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    • 3. 发明授权
    • Multilayer film and laminate for use in producing printed circuit boards
    • 用于生产印刷电路板的多层膜和层压板
    • US5057372A
    • 1991-10-15
    • US326931
    • 1989-03-22
    • Stephen M. ImfeldRandall S. Shipley
    • Stephen M. ImfeldRandall S. Shipley
    • B32B15/08H05K1/03H05K3/00H05K3/02H05K3/38
    • B32B15/08H05K3/025Y10S428/901Y10T428/31507Y10T428/31692Y10T428/31757Y10T428/31797Y10T428/31913
    • A multilayer film having as one surface layer thereof a support layer containing a thermoplastic resin able to withstand temperatures up to 200 degrees C. without softening and the other surface layer an adhesive layer containing a thermoplastic resin having a melting point ranging from about 100 to 200 degrees C. Optionally, a tie layer may be employed between the support layer and the adhesive layer. The multilayer film is useful as a protective carrier sheet for a cladding metal foil used in the production of printed circuit boards. The carrier sheet provides temporary, peelable surface protection for the cladding metal foil preventing contamination and physical damage to the foil both before and during printed circuit board formation. Adhesion of the carrier sheet to the cladding metal foil, measured using a 180 degree peel test is less than 0.4 pounds/in-width and greater than 0.005 pounds/in-width, and preferably less than 0.1 pounds/in-width and greater than 0.01 pounds/in-width.
    • 一种多层膜,其具有一层表层,该支撑层含有能够耐受高达200℃的温度而不软化的热塑性树脂,另一表面层含有熔点为约100至200的热塑性树脂的粘合剂层 任选地,可以在支撑层和粘合剂层之间使用粘结层。 多层膜可用作印刷电路板生产中所用的包覆金属箔的保护载体片。 承载板为包覆金属箔提供临时的可剥离表面保护,防止在印刷电路板形成之前和期间对箔的污染和物理损坏。 使用180度剥离试验测量的载体片材对包层金属箔的粘附力小于0.4磅/宽,并且大于0.005磅/宽,优选小于0.1磅/宽度,并且大于 0.01磅/宽。