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1. 发明授权

US5875010A Display panel having individual display devices bonded to light transmitting plates which have a combined area greater than of the devices 失效
标题翻译：具有结合到具有大于装置的组合面积的透光板的单独显示装置的显示面板
公开(公告)号：US5875010A
公开(公告)日：1999-02-23
申请号：US803097
申请日：1997-02-20
申请人： Jeffrey C. Baechtle , Michael A. Gaynes , Mark V. Pierson , Anne M. Quinn, deceased , David B. Stone
发明人： Jeffrey C. Baechtle , Michael A. Gaynes , Mark V. Pierson , Anne M. Quinn, deceased , David B. Stone
IPC分类号： G09F9/40 , G02F1/1333 , G02F1/1339 , G02F1/133
CPC分类号： G02F1/1339 , G02F1/13336
摘要： A display panel and method of making same in which the panel comprises a plurality of display devices mounted between light-transmitting plates. The structure includes clear and opaque bonding materials positioned to retain alignment and provide acceptable brightness, contrast, and resolution while holding the display devices in contact with the light-transmitting plates.
摘要翻译：一种显示面板及其制造方法，其中面板包括安装在透光板之间的多个显示装置。该结构包括透明和不透明的粘合材料，其被定位成保持对准并且在保持显示装置与透光板接触的同时提供可接受的亮度，对比度和分辨率。

2. 发明授权

US06770968B2 Method for bonding heat sinks to overmolds and device formed thereby 有权
标题翻译：用于将散热器连接到包覆成型体的方法和由此形成的装置
公开(公告)号：US06770968B2
公开(公告)日：2004-08-03
申请号：US10369778
申请日：2003-02-19
申请人： Frank D. Egitto , Michael A. Gaynes , Ramesh R. Kodnani , Luis J. Matienzo , Mark V. Pierson
发明人： Frank D. Egitto , Michael A. Gaynes , Ramesh R. Kodnani , Luis J. Matienzo , Mark V. Pierson
IPC分类号： H01L2334
CPC分类号： B29C59/14 , H01L21/56 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/15311 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.
摘要翻译：一种用于将散热器粘合到封装的电子部件的方法包括以下步骤：（a）将形成在基底上的模制聚合物的表面暴露于等离子体; （b）允许等离子体至少部分地将表面上的含硅残余物转化为二氧化硅; 和（c）通过在制品和表面之间施加贴附物将物品粘合到表面上。通常，含硅残渣是使用常规粘合方法和材料的硅油，脱模剂，可以防止形成粘结。形成在模塑聚合物表面上的二氧化硅层有助于形成适当的键。等离子体可以是氧等离子体，并且粘合剂可以选自具有金属氧化物填料的热固化的硅氧烷基糊状粘合剂或浸渍有粘合剂的热固化多孔聚合物膜。特别地，膜可以是聚四氟乙烯，粘合剂可以是聚丁二烯，并且该膜可以进一步用金属氧化物传热介质如氧化锌浸渍。替代方法包括在不进行等离子体处理的情况下应用多孔聚合物膜并热固化膜以形成适当的键。

3. 发明授权

US06576996B2 Method for bonding heat sinks to overmolds and device formed thereby 有权
公开(公告)号：US06576996B2
公开(公告)日：2003-06-10
申请号：US09757159
申请日：2001-01-09
申请人： Frank D. Egitto , Michael A. Gaynes , Ramesh R. Kodnani , Luis J. Matienzo , Mark V. Pierson
发明人： Frank D. Egitto , Michael A. Gaynes , Ramesh R. Kodnani , Luis J. Matienzo , Mark V. Pierson
IPC分类号： H01L2334
CPC分类号： B29C59/14 , H01L21/56 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/15311 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

4. 发明授权

US06288559B1 Semiconductor testing using electrically conductive adhesives 失效
标题翻译：使用导电胶的半导体测试
公开(公告)号：US06288559B1
公开(公告)日：2001-09-11
申请号：US09050820
申请日：1998-03-30
申请人： William E. Bernier , Michael A. Gaynes , Wayne J. Howell , Mark V. Pierson , Ajit K. Trivedi , Charles G. Woychik
发明人： William E. Bernier , Michael A. Gaynes , Wayne J. Howell , Mark V. Pierson , Ajit K. Trivedi , Charles G. Woychik
IPC分类号： G01R3102
CPC分类号： G01R31/2886 , H01L2224/45144 , H01L2224/81385 , H01L2224/83101 , H05K3/321 , H01L2924/00
摘要： A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium. After the palladium-plated ECA is brought into contact with aluminum pads, palladium-coated aluminum pads, or even C4 solder bumps, conductive dendrites are formed on the palladium-treated ECA bumps.
摘要翻译：一种用于测试和燃烧半导体电路的方法和装置。该方法和装置允许通过使用导电粘合剂（ECA）将晶片临时附接到测试基板来测试整个晶片。 ECA符合晶片和测试基板的接触点的共平面偏差，同时在每个点提供质量电连接。 ECA材料可以沉积在晶片触点或衬底焊盘上。此外，ECA可以沉积在C4凸点或锡盖铅基上。该方法和装置的变化包括用ECA填充非导电插入件的通孔。可以通过在测试焊盘上形成导电枝晶而增加电连接，同时将ECA沉积在晶片触点上。为了进一步增强电连接，可以对ECA材料进行等离子体蚀刻以除去其一些聚合物基质并使一面上的导电颗粒暴露，然后用钯镀覆。在镀钯的ECA与铝焊盘，钯涂覆的铝焊盘或甚至C4焊料凸块接触之后，在钯处理的ECA凸块上形成导电枝晶。

5. 发明授权

US6129804A TFT panel alignment and attachment method and apparatus 失效
标题翻译： TFT面板对准和附接方法和装置
公开(公告)号：US6129804A
公开(公告)日：2000-10-10
申请号：US71675
申请日：1998-05-01
申请人： Michael A. Gaynes , Allan O. Johnson , Ramesh R. Kodnani , Mark V. Pierson , Edward J. Tasillo
发明人： Michael A. Gaynes , Allan O. Johnson , Ramesh R. Kodnani , Mark V. Pierson , Edward J. Tasillo
IPC分类号： B32B37/12 , G02F1/1333 , B32B31/00
CPC分类号： B32B38/18 , G02F1/13336 , B32B37/12 , Y10S345/903 , Y10T156/1089 , Y10T156/109 , Y10T156/1092 , Y10T156/1093 , Y10T156/1754 , Y10T156/1756 , Y10T156/1759
摘要： A system for aligning and attaching together a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate loading station where a coverplate that the tiles are to be attached to is arranged on a coverplate support. A coverplate bonding material dispensing station where a bonding material for bonding the tiles to the coverplate is applied to a surface of the coverplate. A tile placement station where the tiles are arranged on the coverplate. A tile aligning and securing station where the tiles are aligned relative to each other and the coverplate by the tile aligner and where the tiles are at least partially bonded to the coverplate. A tile assembly bonding material dispensing station where a bonding material is applied to a surface of the tiles opposite the side that the coverplate is bonded to. A backplate placement station where a backplate is arranged on the tiles. A backplate aligning and securing station where the backplate is aligned with the tiles and the coverplate and at least partially secured to the tiles A full bonding station where the tiles are fully bonded to the coverplate and the backplate.
摘要翻译：一种用于对准和连接在一起的多个薄膜晶体管瓦片用于构建平板显示器的系统。一个盖板加载站，其中瓦片要附着的盖板布置在盖板支架上。一种覆盖板接合材料分配站，其中用于将瓦片粘合到盖板上的粘合材料施加到盖板的表面。瓦片布置台，其中瓦片布置在盖板上。瓦片对准和固定台，其中瓦片通过瓦片对准器相对于彼此并且盖板对准，并且瓦片至少部分地结合到盖板。一种瓦片组合接合材料分配站，其中粘合材料施加到瓦片与盖板粘合的一侧相反的表面。背板放置台，其中背板设置在瓦片上。背板对准和固定台，其中背板与瓦片和盖板对准并且至少部分地固定到瓦片完全粘合台，其中瓦片完全结合到盖板和背板。

6. 发明授权

US5638597A Manufacturing flexible circuit board assemblies with common heat spreaders 失效
标题翻译：制造具有普通散热器的柔性电路板组件
公开(公告)号：US5638597A
公开(公告)日：1997-06-17
申请号：US476759
申请日：1995-06-07
申请人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
发明人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
IPC分类号： H01L21/48 , H01L23/367 , H01L23/538 , H05K1/00 , H05K1/02 , H05K1/18 , H05K3/00 , H05K3/12 , H05K3/34 , H05K7/20 , H05K3/36
CPC分类号： H05K7/20454 , H01L21/4857 , H01L21/4867 , H01L23/3672 , H01L23/5387 , H05K1/021 , H05K1/189 , H05K3/0061 , H05K3/1216 , H05K3/4691 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K1/0298 , H05K1/182 , H05K2201/0154 , H05K2201/09063 , H05K2201/096 , H05K2201/09745 , H05K2201/1056 , H05K2201/2009 , H05K2203/1394 , H05K3/3415 , H05K3/3452 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： A multi-layer flexible circuit board has multiple thicker regions to which components are mounted and thinner, more flexible regions with fewer wiring layers through which the board can be bent about a line without bending thicker regions. Surface mount components such as QFP's and flip-chips are mounted on the front side, and surface mount and pin-in-hole components are mounted on the back side of the circuit board at the thick regions. Heat spreaders are laminated to the back sides of thicker regions. The thicker regions have windows in which wire bond chips are mounted on the heat spreader and wire bonded to the front side of the board. A thermally conductive adhesive or grease connects between the tops of the back side components and the bottoms of the cavities. The heat sinks are bolted together and/or to an enclosure frame to improve thermal performance.
摘要翻译：多层柔性电路板具有多个较厚的区域，组件安装在该较厚的区域上，较薄的，更柔性的区域具有较少的布线层，板可围绕线弯曲，而不会弯曲较厚的区域。表面安装部件如QFP和倒装芯片安装在前侧，表面安装和销孔组件安装在电路板的背面，在较厚的区域。散热器层压到较厚区域的背面。较厚的区域具有窗口，其中引线接合芯片安装在散热器上，并且引线键合到板的前侧。导热粘合剂或油脂连接在后侧部件的顶部和空腔的底部之间。散热器螺栓连接在一起和/或连接到外壳框架以改善热性能。

7. 发明授权

US5545465A Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits 失效
标题翻译：具有限定体积的焊料或导电粘合剂的电路板沉积在用于电路的互连位置处
公开(公告)号：US5545465A
公开(公告)日：1996-08-13
申请号：US449029
申请日：1995-05-24
申请人： Michael A. Gaynes , George D. Oxx , Mark V. Pierson , Jerzy Zalesinski
发明人： Michael A. Gaynes , George D. Oxx , Mark V. Pierson , Jerzy Zalesinski
IPC分类号： B05C5/02 , B23K3/06 , H01L21/48 , H01L21/60 , H05K3/12 , H05K3/32 , H05K3/34 , B32B9/00
CPC分类号： H01L24/27 , B23K3/0692 , H01L21/4853 , H01L21/4867 , H01L24/83 , H05K3/1233 , H05K3/3484 , B23K2201/36 , H01L2224/2919 , H01L2224/8319 , H01L2224/838 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/3025 , H05K2201/0989 , H05K2203/0126 , H05K2203/043 , H05K2203/0568 , H05K2203/0577 , H05K3/321 , H05K3/3452 , Y10T29/49165 , Y10T428/24917
摘要： A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a paste injection head. A permanent mask with cavity openings is applied around conductive pads on a carrier. The conductive pads correspond to chip attachment sites. The injection head is brought into contact with a surface of the mask, and pressure is applied to a bonding agent in the injection head. The injection head is then moved over the surface of the mask, filling cavity openings with the bonding agent. The injection head is then removed from the surface of the mask. If a solder paste is used, infrared radiation is applied to filled cavity openings to evaporate a paste flux and reflow solder to form solder balls within the cavity openings projecting above the mask. If a conductive adhesive is used, a stencil is applied to the surface of the mask prior to contacting the mask with said injection head. When the cavity openings are filled, stencil is removed from the mask and the conductive adhesive filling the cavity openings is dried.
摘要翻译：在电子电路的制造中将焊接剂和导电粘合剂等粘合剂施加到焊盘部位的方法使用糊剂注入头。具有腔体开口的永久性掩模施加在载体上的导电焊盘周围。导电垫对应于芯片附接位置。使注射头与掩模的表面接触，并且将压力施加到注射头中的粘合剂。然后将注射头移动到掩模的表面上，用粘合剂填充空腔开口。然后将注射头从掩模的表面去除。如果使用焊膏，则将红外线辐射施加到填充的空腔开口，以蒸发浆料焊剂并回流焊料，以在突出在掩模上方的空腔开口内形成焊球。如果使用导电粘合剂，则在将掩模与所述注射头接触之前，将模板施加到掩模的表面。当腔开口被填充时，将模板从掩模中取出，并且填充空腔开口的导电粘合剂被干燥。

8. 发明授权

US06559666B2 Method and device for semiconductor testing using electrically conductive adhesives 失效
标题翻译：使用导电胶粘剂进行半导体测试的方法和装置
公开(公告)号：US06559666B2
公开(公告)日：2003-05-06
申请号：US09875246
申请日：2001-06-06
申请人： William E. Bernier , Michael A. Gaynes , Wayne J. Howell , Mark V. Pierson , Ajit K. Trivedi , Charles G. Woychik
发明人： William E. Bernier , Michael A. Gaynes , Wayne J. Howell , Mark V. Pierson , Ajit K. Trivedi , Charles G. Woychik
IPC分类号： G01R3102
CPC分类号： G01R31/2886 , H01L2224/45144 , H01L2224/81385 , H01L2224/83101 , H05K3/321 , H01L2924/00
摘要： A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium. After the palladium-plated ECA is brought into contact with aluminum pads, palladium-coated aluminum pads, or even C4 solder bumps, conductive dendrites are formed on the palladium-treated ECA bumps.
摘要翻译：一种用于测试和燃烧半导体电路的方法和装置。该方法和装置允许通过使用导电粘合剂（ECA）将晶片临时附接到测试基板来测试整个晶片。 ECA符合晶片和测试基板的接触点的共平面偏差，同时在每个点提供质量电连接。 ECA材料可以沉积在晶片触点或衬底焊盘上。此外，ECA可以沉积在C4凸点或锡盖铅基上。该方法和装置的变化包括用ECA填充非导电插入件的通孔。可以通过在测试焊盘上形成导电枝晶而增加电连接，同时将ECA沉积在晶片触点上。为了进一步增强电连接，可以对ECA材料进行等离子体蚀刻以除去其一些聚合物基质并使一面上的导电颗粒暴露，然后用钯镀覆。在镀钯的ECA与铝焊盘，钯涂覆的铝焊盘或甚至C4焊料凸块接触之后，在钯处理的ECA凸块上形成导电枝晶。

9. 发明授权

US06268739B1 Method and device for semiconductor testing using electrically conductive adhesives 失效
公开(公告)号：US06268739B1
公开(公告)日：2001-07-31
申请号：US09478678
申请日：2000-01-06
申请人： William E. Bernier , Michael A. Gaynes , Wayne J. Howell , Mark V. Pierson , Ajit K. Trivedi , Charles G. Woychik
发明人： William E. Bernier , Michael A. Gaynes , Wayne J. Howell , Mark V. Pierson , Ajit K. Trivedi , Charles G. Woychik
IPC分类号： G01R3102
CPC分类号： G01R31/2886 , H01L2224/45144 , H01L2224/81385 , H01L2224/83101 , H05K3/321 , H01L2924/00
摘要： A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium. After the palladium-plated ECA is brought into contact with aluminum pads, palladium-coated aluminum pads, or even C4 solder bumps, conductive dendrites are formed on the palladium-treated ECA bumps.

10. 发明授权

US5565033A Pressurized injection nozzle for screening paste 失效
标题翻译：加压喷嘴用于筛分浆料
公开(公告)号：US5565033A
公开(公告)日：1996-10-15
申请号：US448958
申请日：1995-05-24
申请人： Michael A. Gaynes , George D. Oxx , Mark V. Pierson , Jerzy Zalesinski
发明人： Michael A. Gaynes , George D. Oxx , Mark V. Pierson , Jerzy Zalesinski
IPC分类号： B05C5/02 , B23K3/06 , H01L21/48 , H01L21/60 , H05K3/12 , H05K3/32 , H05K3/34 , B05C1/16
CPC分类号： H01L24/27 , B23K3/0692 , H01L21/4853 , H01L21/4867 , H01L24/83 , H05K3/1233 , H05K3/3484 , B23K2201/36 , H01L2224/2919 , H01L2224/8319 , H01L2224/838 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/3025 , H05K2201/0989 , H05K2203/0126 , H05K2203/043 , H05K2203/0568 , H05K2203/0577 , H05K3/321 , H05K3/3452 , Y10T29/49165 , Y10T428/24917
摘要： A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a paste injection head. A permanent mask with cavity openings is applied around conductive pads on a carrier. The conductive pads correspond to chip attachment sites. The injection head is brought into contact with a surface of the mask, and pressure is applied to a bonding agent in the injection head. The injection head is then moved over the surface of the mask, filling cavity openings with the bonding agent. The injection head is then removed from the surface of the mask. If a solder paste is used, infrared radiation is applied to filled cavity openings to evaporate a paste flux and reflow solder to form solder balls within the cavity openings projecting above the mask. If a conductive adhesive is used, a stencil is applied to the surface of the mask prior to contacting the mask with said injection head. When the cavity openings are filled, stencil is removed from the mask and the conductive adhesive filling the cavity openings is dried.
摘要翻译：在电子电路的制造中将焊接剂和导电粘合剂等粘合剂施加到焊盘部位的方法使用糊剂注入头。具有腔体开口的永久性掩模施加在载体上的导电焊盘周围。导电垫对应于芯片附接位置。使注射头与掩模的表面接触，并且将压力施加到注射头中的粘合剂。然后将注射头移动到掩模的表面上，用粘合剂填充空腔开口。然后将注射头从掩模的表面去除。如果使用焊膏，则将红外线辐射施加到填充的空腔开口，以蒸发浆料焊剂并回流焊料，以在突出在掩模上方的空腔开口内形成焊球。如果使用导电粘合剂，则在将掩模与所述注射头接触之前，将模板施加到掩模的表面。当腔开口被填充时，将模板从掩模中取出，并且填充空腔开口的导电粘合剂被干燥。

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