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1. 发明授权

US06348233B2 Method of forming conductive line features for enhanced reliability of multi-layer ceramic substrates 失效
标题翻译：形成导线特征的方法，以提高多层陶瓷基片的可靠性
公开(公告)号：US06348233B2
公开(公告)日：2002-02-19
申请号：US09813376
申请日：2001-03-21
申请人： Jeffrey A. Brody , Harry D. Cox , John Garant , Hsichang Liu , Paul G. McLaughlin , Tom Wayson
发明人： Jeffrey A. Brody , Harry D. Cox , John Garant , Hsichang Liu , Paul G. McLaughlin , Tom Wayson
IPC分类号： B05D512
CPC分类号： H05K1/116 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4053 , H05K3/4611 , H05K3/4629 , H05K2201/09727 , Y10S428/901 , Y10T428/24917 , Y10T428/24926 , H01L2924/00
摘要： A method for minimizing formation of cracks at junctions between conductive vias and conductive lines in line-to-via connections on a substrate. The method comprises providing a transition zone connected between a base section of the line and a cap, the transition zone providing a volume of conductive paste during a conductive paste screen printing operation that is greater than the volume provided by the base section being directly connected to the cap. In particular, the transition zone volume is an effective amount to prevent necking of the conductive line into the via when the mask is misaligned to the substrate within an expected alignment tolerance. The transition zone may comprise a jogged end extending from the base section to the cap at an angle to the line, or a flared end extending from the base section. Line-to-via connection structures, patterns on a mask for making such structures, and masks having such patterns are also disclosed.
摘要翻译：一种用于最小化在基板上的线对通孔连接中的导电通孔和导电线之间的接合处的裂纹形成的方法。该方法包括提供连接在管线的基部和盖之间的过渡区，该过渡区在导电糊状丝网印刷操作期间提供一定体积的导电膏，其大于由基部直接连接到这顶帽子。特别地，过渡区体积是防止在预定的对准公差内掩模不对准衬底时导电线在通孔中颈缩的有效量。过渡区域可以包括从基部延伸到盖子的帽部的慢跑端，或者从基部延伸的扩口端。还公开了线到通孔连接结构，用于制造这种结构的掩模上的图案，以及具有这种图案的掩模。

2. 发明授权

US06217989B1 Conductive line features for enhanced reliability of multi-layer ceramic substrates 有权
标题翻译：导电线特征，可提高多层陶瓷基板的可靠性
公开(公告)号：US06217989B1
公开(公告)日：2001-04-17
申请号：US09458877
申请日：1999-12-10
申请人： Jeffrey A. Brody , Harry D. Cox , John Garant , Hsichang Liu , Paul G. McLaughlin , Tom Wayson
发明人： Jeffrey A. Brody , Harry D. Cox , John Garant , Hsichang Liu , Paul G. McLaughlin , Tom Wayson
IPC分类号： B32B1500
CPC分类号： H05K1/116 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4053 , H05K3/4611 , H05K3/4629 , H05K2201/09727 , Y10S428/901 , Y10T428/24917 , Y10T428/24926 , H01L2924/00
摘要： A method for minimizing formation of cracks at junctions between conductive vias and conductive lines in line-to-via connections on a substrate. The method comprises providing a transition zone connected between a base section of the line and a cap, the transition zone providing a volume of conductive paste during a conductive paste screen printing operation that is greater than the volume provided by the base section being directly connected to the cap. In particular, the transition zone volume is an effective amount to prevent necking of the conductive line into the via when the mask is misaligned to the substrate within an expected alignment tolerance. The transition zone may comprise a jogged end extending from the base section to the cap at an angle to the line, or a flared end extending from the base section. Line-to-via connection structures, patterns on a mask for making such structures, and masks having such patterns are also disclosed.
摘要翻译：一种用于最小化在基板上的线对通孔连接中的导电通孔和导电线之间的接合处的裂纹形成的方法。该方法包括提供连接在管线的基部和盖之间的过渡区，该过渡区在导电糊状丝网印刷操作期间提供一定体积的导电膏，其大于由基部直接连接到这顶帽子。特别地，过渡区体积是防止在预定的对准公差内掩模不对准衬底时导电线在通孔中颈缩的有效量。过渡区域可以包括从基部延伸到盖子的帽部的慢跑端，或者从基部延伸的扩口端。还公开了线到通孔连接结构，用于制造这种结构的掩模上的图案，以及具有这种图案的掩模。

3. 发明授权

US06662718B2 Screening mask having a stress-relieving area 失效
标题翻译：具有减轻压力的屏蔽面罩
公开(公告)号：US06662718B2
公开(公告)日：2003-12-16
申请号：US09895673
申请日：2001-06-29
申请人： Evelyn Barrington , Jeffrey A. Brody , Harry David Cox , Lorraine Di Piero-Simmonds , John J. Garant , Dinesh Gupta , Edward J. Hassdenteufel, III , Hsichang Liu , Paul G. McLaughlin , Ahmed S. Shah , Charles Timothy Ryan , Richard C. Steger , John A. Trumpetto
发明人： Evelyn Barrington , Jeffrey A. Brody , Harry David Cox , Lorraine Di Piero-Simmonds , John J. Garant , Dinesh Gupta , Edward J. Hassdenteufel, III , Hsichang Liu , Paul G. McLaughlin , Ahmed S. Shah , Charles Timothy Ryan , Richard C. Steger , John A. Trumpetto
IPC分类号： B05C1706
CPC分类号： B41M1/12 , B41C1/14 , G03F7/12
摘要： A screening mask having a stress-relieving area including an inner functional area having a pattern which is replicated on an underlying substrate, the inner functional area pattern having an one open area through which a paste is extruded and at least one tab, and an outer nonfunctional area distinct from the inner functional area, the outer nonfunctional area having a stress-relieving area adjacent to an edge of the screening mask that protects the at least one tab in the inner functional area from breaking.
摘要翻译：一种具有应力消除区域的筛选掩模，包括具有在下面的基底上复制的图案的内部功能区域，所述内部功能区域图案具有一个开口区域，通过该区域挤出糊状物和至少一个突出部分，以及外部非功能区域与内部功能区域不同，外部非功能区域具有与屏蔽掩模边缘相邻的应力消除区域，其保护内部功能区域中的至少一个突出部不被破坏。

4. 发明授权

US07302757B2 Micro-bumps to enhance LGA interconnections 有权
标题翻译：微型凸点以增强LGA互连
公开(公告)号：US07302757B2
公开(公告)日：2007-12-04
申请号：US11204699
申请日：2005-08-16
申请人： Jeffrey A. Brody , Hsichang Liu , Hai Pham Longworth , James C. Monaco , Gerard J. Nuzback , Wei Zou
发明人： Jeffrey A. Brody , Hsichang Liu , Hai Pham Longworth , James C. Monaco , Gerard J. Nuzback , Wei Zou
IPC分类号： H01K3/10
CPC分类号： H05K3/325 , H01L23/49811 , H01L2924/0002 , H01L2924/09701 , H05K3/4007 , H05K2201/0367 , H05K2201/0373 , H05K2201/10348 , H05K2201/10719 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , H01L2924/00
摘要： An improved Land Grid Array interconnect structure is provided with the use of small metal bumps on the substrate electrical contact pad. The bumps interlock with segments of the fuzz button connection and increase the physical contact surface area between the contact pad and fuss button. The improved contact reduces displacement of electrical contact points due to thermo-mechanical stress and lowers the required actuation force during assembly.
摘要翻译：提供了一种改进的Land Grid阵列互连结构，其中在基板电接触焊盘上使用小的金属凸块。凸起与绒头按钮连接的部分互锁，并增加接触垫和大按钮之间的物理接触表面积。改进的接触减少了由于热机械应力引起的电接触点的位移，并降低了组装过程中所需的致动力。

5. 发明申请

US20090267228A1 INTERMETALLIC DIFFUSION BLOCK DEVICE AND METHOD OF MANUFACTURE 失效
标题翻译：中间扩散块装置及其制造方法
公开(公告)号：US20090267228A1
公开(公告)日：2009-10-29
申请号：US12111510
申请日：2008-04-29
申请人： Charles L. Arvin , Carla A. Bailey , Harry D. Cox , Hua Gan , Hsichang Liu , Arthur G. Merryman , Vall F. McClean , Srinivasa S. N. Reddy , Brian R. Sundlof
发明人： Charles L. Arvin , Carla A. Bailey , Harry D. Cox , Hua Gan , Hsichang Liu , Arthur G. Merryman , Vall F. McClean , Srinivasa S. N. Reddy , Brian R. Sundlof
IPC分类号： H01L23/52 , H01L21/44
CPC分类号： H01L24/05 , H01L24/03 , H01L2224/03462 , H01L2224/03472 , H01L2224/03831 , H01L2224/0401 , H01L2224/05011 , H01L2224/05017 , H01L2224/05147 , H01L2224/05166 , H01L2224/05564 , H01L2224/05647 , H01L2224/05655 , H01L2224/131 , H01L2924/00013 , H01L2924/0002 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/14 , H01L2924/1461 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： One embodiment of the present invention is directed to an under bump metallurgy material. The under bump metallurgy material of this embodiment includes an adhesion layer and a conduction layer formed on top of the adhesion layer. The under bump metallurgy material of this embodiment also includes a barrier layer plated on top of the conduction layer and a sacrificial layer plated on top of the barrier layer. The conduction layer of this embodiment includes a trench formed therein, the trench contacting a portion of the barrier layer and blocking a path of intermetallic formation between the conduction layer and the sacrificial layer.
摘要翻译：本发明的一个实施例涉及一种凸块下金属材料。本实施方式的凸块状冶金材料包括粘合层和形成在粘合层顶部的导电层。该实施例的凸块下冶金材料还包括电镀在导电层顶部上的阻挡层和镀在阻挡层顶部上的牺牲层。该实施例的导电层包括在其中形成的沟槽，沟槽接触势垒层的一部分并且阻挡导电层和牺牲层之间的金属间形成路径。

6. 发明授权

US07683493B2 Intermetallic diffusion block device and method of manufacture 失效
标题翻译：金属间扩散块装置及其制造方法
公开(公告)号：US07683493B2
公开(公告)日：2010-03-23
申请号：US12111510
申请日：2008-04-29
申请人： Charles L. Arvin , Carla A. Bailey , Harry D. Cox , Hua Gan , Hsichang Liu , Arthur G. Merryman , Vall F. McClean , Srinivasa S. N. Reddy , Brian R. Sundlof
发明人： Charles L. Arvin , Carla A. Bailey , Harry D. Cox , Hua Gan , Hsichang Liu , Arthur G. Merryman , Vall F. McClean , Srinivasa S. N. Reddy , Brian R. Sundlof
IPC分类号： H01L23/52
CPC分类号： H01L24/05 , H01L24/03 , H01L2224/03462 , H01L2224/03472 , H01L2224/03831 , H01L2224/0401 , H01L2224/05011 , H01L2224/05017 , H01L2224/05147 , H01L2224/05166 , H01L2224/05564 , H01L2224/05647 , H01L2224/05655 , H01L2224/131 , H01L2924/00013 , H01L2924/0002 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/14 , H01L2924/1461 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： One embodiment of the present invention is directed to an under bump metallurgy material. The under bump metallurgy material of this embodiment includes an adhesion layer and a conduction layer formed on top of the adhesion layer. The under bump metallurgy material of this embodiment also includes a barrier layer plated on top of the conduction layer and a sacrificial layer plated on top of the barrier layer. The conduction layer of this embodiment includes a trench formed therein, the trench contacting a portion of the barrier layer and blocking a path of intermetallic formation between the conduction layer and the sacrificial layer.
摘要翻译：本发明的一个实施例涉及一种凸块下金属材料。本实施方式的凸块状冶金材料包括粘合层和形成在粘合层顶部的导电层。该实施例的凸块下冶金材料还包括电镀在导电层顶部上的阻挡层和镀在阻挡层顶部上的牺牲层。该实施例的导电层包括在其中形成的沟槽，沟槽接触势垒层的一部分并且阻挡导电层和牺牲层之间的金属间形成路径。

7. 发明授权

US07472650B2 Nickel alloy plated structure 失效
标题翻译：镍合金镀层结构
公开(公告)号：US07472650B2
公开(公告)日：2009-01-06
申请号：US11865170
申请日：2007-10-01
申请人： Harry David Cox , Hsichang Liu , Nike Oluwakemi Medahunsi , Krystyna Waleria Semkow
发明人： Harry David Cox , Hsichang Liu , Nike Oluwakemi Medahunsi , Krystyna Waleria Semkow
IPC分类号： B05C17/06 , B32B3/24 , B32B15/20
CPC分类号： C25D5/022 , C23C28/021 , C23C28/023 , C25D5/10 , H01L21/4867 , H05K3/1225 , H05K3/245 , H05K2201/09736 , Y10T428/12063 , Y10T428/12361 , Y10T428/12486 , Y10T428/1291
摘要： A structure. The structure includes a layered configuration including a copper layer, a first layer, and a second layer. The first and second layers are disposed on opposite sides of the copper layer and are in direct mechanical contact with the copper layer. The first and second layers each include a same alloy of nickel and a metal consisting of cobalt, iron, copper, manganese, or molybdenum. A first region in the first layer extends completely through the first layer. A second region in the second layer extends completely through the second layer. A third region in the first layer extends completely through the first layer. The third region does not extend into any portion of the second layer. The first, second region, and third regions each include a photoresist or an opening such that photoresist or opening extends completely through the first, second, and first layer, respectively.
摘要翻译：一个结构。该结构包括包括铜层，第一层和第二层的层状构造。第一层和第二层设置在铜层的相对侧上，并与铜层直接机械接触。第一层和第二层各自包括镍和由钴，铁，铜，锰或钼组成的金属的相同合金。第一层中的第一区域完全延伸穿过第一层。第二层中的第二区域完全延伸穿过第二层。第一层中的第三区域完全延伸穿过第一层。第三区域不延伸到第二层的任何部分。第一，第二区域和第三区域各自包括光致抗蚀剂或开口，使得光致抗蚀剂或开口分别完全延伸穿过第一层，第二层和第一层。

8. 发明申请

US20080190565A1 APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAYERS OF MULTILAYER CERAMIC CHIP CARRIERS 有权
标题翻译：用于提供多层陶瓷芯片运输机层压板分散负荷分布的装置
公开(公告)号：US20080190565A1
公开(公告)日：2008-08-14
申请号：US12105494
申请日：2008-04-18
申请人： Jay A. Bunt , Donald W. Diangelo , Cristian Docu , Thomas Foley , Melvin R. Gottschalk , Lisa A. Hamilton , Thomas A. Kline , Mark J. LaPlante , Hsichang Liu , Sebastian Loscerbo , Govindarajan Natarajan , Olga A. Otieno , Renee L. Weisman
发明人： Jay A. Bunt , Donald W. Diangelo , Cristian Docu , Thomas Foley , Melvin R. Gottschalk , Lisa A. Hamilton , Thomas A. Kline , Mark J. LaPlante , Hsichang Liu , Sebastian Loscerbo , Govindarajan Natarajan , Olga A. Otieno , Renee L. Weisman
IPC分类号： B32B37/00
CPC分类号： B32B37/0007 , B32B37/26 , B32B2315/02 , H05K1/0306 , H05K3/0052 , H05K3/4611 , H05K3/4629 , H05K2201/09781 , H05K2203/0169 , H05K2203/068 , Y10T156/1052 , Y10T156/108
摘要： An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.
摘要翻译：一种用于为多层陶瓷芯片载体层压层提供均匀的轴向载荷分布的装置，包括：底板，其被配置为在其上支撑多个生片层，所述底板具有至少一个弹性安装的负载支撑杆，其邻近所述底座的外边缘设置盘子。负载支撑杆安装在一个或多个偏压构件上，使得支撑杆的顶表面在基板的顶表面上延伸选定的距离。

9. 发明授权

US07078320B2 Partial wafer bonding and dicing 失效
标题翻译：部分晶片接合和切割
公开(公告)号：US07078320B2
公开(公告)日：2006-07-18
申请号：US10710880
申请日：2004-08-10
申请人： Louis C. Hsu , Hsichang Liu , James R. Salimeno, III
发明人： Louis C. Hsu , Hsichang Liu , James R. Salimeno, III
IPC分类号： H01L21/326 , H01L21/46
CPC分类号： H01L21/2007 , H01L21/78 , Y10S438/977
摘要： Disclosed is a method of manufacturing integrated circuit chips that partially joins an integrated circuit wafer to a supporting wafer at a limited number of joining points. Once joined, the integrated circuit wafer is chemically-mechanically polished to reduce the thickness of the integrated circuit wafer. Then, after reducing the thickness of the integrated circuit wafer, the invention performs conventional processing on the integrated circuit wafer to form devices and wiring in the integrated circuit wafer. Next, the invention cuts through the integrated circuit wafer and the supporting wafer to form chip sections. During this cutting process, the integrated circuit wafer separates from the supporting wafer in chip sections where the integrated circuit wafer is not joined to the supporting wafer by the joining points. Chip sections where the integrated circuit wafer remains joined to the supporting wafer are thicker than the chips sections where the integrated circuit wafer separates from the supporting wafer.
摘要翻译：公开了一种制造在有限数量的接合点部分地将集成电路晶片连接到支撑晶片的集成电路芯片的方法。一旦接合，集成电路晶片被化学机械抛光以减小集成电路晶片的厚度。然后，在减小集成电路晶片的厚度之后，本发明对集成电路晶片进行常规处理，以在集成电路晶片中形成器件和布线。接下来，本发明切割集成电路晶片和支撑晶片以形成芯片部分。在该切割过程中，集成电路晶片与集成电路晶片通过接合点未接合到支撑晶片的芯片部分中的支撑晶片分离。集成电路晶片保持接合到支撑晶片的芯片部分比集成电路晶片与支撑晶片分离的芯片部分更厚。

10. 发明申请

US20080190545A1 METHOD FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAYERS OF MULTILAYER CERAMIC CHIP CARRIERS 有权
标题翻译：用于提供多层陶瓷芯片运输机层压板单相负载分配的方法
公开(公告)号：US20080190545A1
公开(公告)日：2008-08-14
申请号：US12105622
申请日：2008-04-18
申请人： Jay A. Bunt , Donald W. Diangelo , Cristian Docu , Thomas Foley , Melvin R. Gottschalk , Lisa A. Hamilton , Thomas A. Kline , Mark J. LaPlante , Hsichang Liu , Sebastian Loscerbo , Govindarajan Natarajan , Olga A. Otieno , Renee L. Weisman
发明人： Jay A. Bunt , Donald W. Diangelo , Cristian Docu , Thomas Foley , Melvin R. Gottschalk , Lisa A. Hamilton , Thomas A. Kline , Mark J. LaPlante , Hsichang Liu , Sebastian Loscerbo , Govindarajan Natarajan , Olga A. Otieno , Renee L. Weisman
IPC分类号： B32B37/26 , B32B37/10
CPC分类号： B32B37/0007 , B32B37/26 , B32B2315/02 , H05K1/0306 , H05K3/0052 , H05K3/4611 , H05K3/4629 , H05K2201/09781 , H05K2203/0169 , H05K2203/068 , Y10T156/1052 , Y10T156/108
摘要： An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.
摘要翻译：一种用于为多层陶瓷芯片载体层压层提供均匀的轴向载荷分布的装置，包括：底板，其被配置为在其上支撑多个生片层，所述底板具有至少一个弹性安装的负载支撑杆，其邻近所述底座的外边缘设置盘子。负载支撑杆安装在一个或多个偏压构件上，使得支撑杆的顶表面在基板的顶表面上延伸选定的距离。

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