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1. 发明授权

US07279412B2 Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same 有权
标题翻译：具有改进的互连的并行多层印刷电路板及其制造方法
公开(公告)号：US07279412B2
公开(公告)日：2007-10-09
申请号：US10717977
申请日：2003-11-20
申请人： Jee-Soo Mok , Byung-Kook Sun , Chang-Kyu Song , Geum-Hee Yun , Tae-Hoon Kim
发明人： Jee-Soo Mok , Byung-Kook Sun , Chang-Kyu Song , Geum-Hee Yun , Tae-Hoon Kim
IPC分类号： H01L21/4763 , H05K3/00
CPC分类号： H05K3/462 , H05K3/4069 , H05K3/4638 , H05K2201/09536 , H05K2201/10378 , H05K2203/0191 , Y10T29/49124 , Y10T29/49128 , Y10T29/49156 , Y10T29/49165
摘要： Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.
摘要翻译：公开了一种多层印刷电路板和制造多层印刷电路板的方法。交替堆叠电路层和绝缘层，使得没有施加附加电镀和导电糊料填充步骤的设置有镀覆内壁的电路层的通孔连接到填充有导电浆料的绝缘层的通孔。

2. 发明申请

US20050085065A1 Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same 有权
标题翻译：具有改进的互连的并行多层印刷电路板及其制造方法
公开(公告)号：US20050085065A1
公开(公告)日：2005-04-21
申请号：US10717977
申请日：2003-11-20
申请人： Jee-Soo Mok , Byung-Kook Sun , Chang-Kyu Song , Geum-Hee Yun , Tae-Hoon Kim
发明人： Jee-Soo Mok , Byung-Kook Sun , Chang-Kyu Song , Geum-Hee Yun , Tae-Hoon Kim
IPC分类号： H05K3/40 , H05K3/46 , H01L21/4763 , H01K3/10 , H05K3/02 , H05K3/20
CPC分类号： H05K3/462 , H05K3/4069 , H05K3/4638 , H05K2201/09536 , H05K2201/10378 , H05K2203/0191 , Y10T29/49124 , Y10T29/49128 , Y10T29/49156 , Y10T29/49165
摘要： Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.
摘要翻译：公开了一种多层印刷电路板和制造多层印刷电路板的方法。交替堆叠电路层和绝缘层，使得没有施加附加电镀和导电糊料填充步骤的设置有镀覆内壁的电路层的通孔连接到填充有导电浆料的绝缘层的通孔。

3. 发明申请

US20060029726A1 Method of fabricating PCB in parallel manner 审中-公开
标题翻译：平行制造PCB的方法
公开(公告)号：US20060029726A1
公开(公告)日：2006-02-09
申请号：US10948875
申请日：2004-09-24
申请人： Jee-Soo Mok , Byung-Kook Sun , Chang-Kyu Song , Jun-Heyoung Park , Duck-Young Maeng , Tae-Hoon Kim
发明人： Jee-Soo Mok , Byung-Kook Sun , Chang-Kyu Song , Jun-Heyoung Park , Duck-Young Maeng , Tae-Hoon Kim
IPC分类号： H01K3/10
CPC分类号： H05K3/462 , H05K3/0035 , H05K3/4069 , H05K3/4623 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2203/0191 , Y10T29/49165
摘要： Disclosed is a method of fabricating a multilayer PCB (MLB). More particularly, the present invention relates to a method of fabricating a multilayer PCB, in which plural circuit layers having insulating layers attached thereto and another circuit layer having no insulating layer are formed in a parallel manner according to separate processes, and laminated at one time, unlike fabrication of the multilayer PCB adopting a conventional build-up manner.
摘要翻译：公开了一种制造多层PCB（MLB）的方法。更具体地，本发明涉及一种制造多层PCB的方法，其中根据单独的工艺以平行方式形成具有附着绝缘层的多个电路层和不具有绝缘层的另一个电路层，并且一次叠层不同于采用常规积聚方式的多层PCB的制造。

4. 发明授权

US09075469B2 Stereoscopic liquid crystal display device having touch panel and method for manufacturing the same 有权
标题翻译：具有触摸面板的立体液晶显示装置及其制造方法
公开(公告)号：US09075469B2
公开(公告)日：2015-07-07
申请号：US12912158
申请日：2010-10-26
申请人： Jung-Eun Son , Tae-Hoon Kim
发明人： Jung-Eun Son , Tae-Hoon Kim
IPC分类号： G02F1/1335 , G06F3/041 , G06F3/045 , G02F1/1333 , H04N13/04
CPC分类号： G06F3/0412 , G02F1/13338 , H04N13/305
摘要： A stereoscopic liquid crystal display device includes a liquid crystal panel configured by including a first substrate and a second substrate facing into each other, and a first liquid crystal layer filling a space between the first substrate and the second substrate, an adhesion layer formed on the liquid crystal panel, and a touch and stereoscopic image lens layer including a third substrate and a fourth substrate facing into each other and formed on the adhesion layer, a second liquid crystal layer formed between the third substrate and the fourth substrate, a plurality of first electrodes formed on the third substrate, a second electrode formed on an entire surface of a surface of the fourth substrate facing into the second liquid crystal layer, and a third electrode and a fourth electrode formed on the fourth substrate for detecting a touch position.
摘要翻译：立体液晶显示装置包括：液晶面板，其配置为包括彼此面对的第一基板和第二基板;以及填充所述第一基板和所述第二基板之间的空间的第一液晶层，形成在所述第一基板液晶面板，以及包括彼此面对并形成在粘合层上的第三基板和第四基板的触摸立体图像透镜层，形成在第三基板和第四基板之间的第二液晶层，多个第一形成在第三基板上的电极，形成在面向第二液晶层的第四基板的表面的整个表面上的第二电极，以及形成在第四基板上用于检测触摸位置的第三电极和第四电极。

5. 发明授权

US09007312B2 Device and method for transmitting data in portable terminal 有权
标题翻译：在便携式终端中传输数据的装置和方法
公开(公告)号：US09007312B2
公开(公告)日：2015-04-14
申请号：US13342308
申请日：2012-01-03
申请人： Tae-Hoon Kim , Man-Gun Hur , Jae-Woong Han
发明人： Tae-Hoon Kim , Man-Gun Hur , Jae-Woong Han
IPC分类号： G06F3/041 , G06F1/16 , G06F3/0486 , G06F3/0488 , H04L29/00 , H04L29/06 , H04W12/06 , H04W88/02
CPC分类号： G06F1/1698 , G06F1/1643 , G06F3/0486 , G06F3/04883 , H04L29/00 , H04L63/08 , H04W12/06 , H04W88/02
摘要： A device and method for transmitting data can conveniently perform data transmission between two portable terminals. The device preferably includes a first portable terminal transmitting data on which a drag operation has occurred to a second portable terminal when the second portable terminal is coupled to the first portable terminal using a time and a moving speed of the drag operation when the drag operation occurs from the first terminal to the second portable terminal. The second portable terminal receives the data from the first portable terminal using the time and the moving speed of the drag operation when the drag operation occurs from the first portable terminal to the second portable terminal coupled to the first portable terminal through near field communication.
摘要翻译：用于传输数据的设备和方法可以方便地在两个便携式终端之间执行数据传输。该装置优选地包括第一便携式终端，当第二便携式终端在拖动操作发生时使用时间和拖动操作的移动速度将第二便携式终端连接到第二便携式终端时，向第二便携式终端发送拖动操作已经发生的数据从第一终端到第二便携式终端。当从第一便携式终端到通过近场通信耦合到第一便携式终端的第二便携式终端进行拖动操作时，第二便携式终端使用时间和拖动操作的移动速度从第一便携式终端接收数据。

6. 发明授权

US08747705B2 Compound semiconductors and their application 有权
标题翻译：复合半导体及其应用
公开(公告)号：US08747705B2
公开(公告)日：2014-06-10
申请号：US13617177
申请日：2012-09-14
申请人： Cheol-Hee Park , Tae-Hoon Kim
发明人： Cheol-Hee Park , Tae-Hoon Kim
IPC分类号： H01B1/02 , H01L35/16
CPC分类号： H01L31/0326 , C01B19/002 , C01P2002/50 , C01P2006/40 , H01L31/032 , H01L35/16 , Y02E10/50
摘要： Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: InxCo4Sb12-zTez, where 0
摘要翻译：公开了可用于太阳能电池或作为热电材料的新型化合物半导体及其应用。化合物半导体可以由化学式：In x Co 4 Sb 12-z Te z表示，其中0

7. 发明授权

US08728357B2 Compound semiconductors and their application 有权
标题翻译：复合半导体及其应用
公开(公告)号：US08728357B2
公开(公告)日：2014-05-20
申请号：US13618256
申请日：2012-09-14
申请人： Cheol-Hee Park , Tae-Hoon Kim
发明人： Cheol-Hee Park , Tae-Hoon Kim
IPC分类号： H01B1/02
CPC分类号： C01G51/006 , C01B19/002 , C01G53/006 , C01G55/002 , C01P2002/52 , C01P2002/88 , C01P2004/20 , C01P2006/32 , C01P2006/40 , H01L35/18
摘要： Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: InxMyCo4-m-aAmSb12-n-z-bXnQ′z, where M is at least one selected from the group consisting of Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu; A is at least one selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir and Pt; X is at least one selected from the group consisting of Si, Ga, Ge and Sn; Q′ is at least one selected from the group consisting of O, S and Se; 0
摘要翻译：公开了可用于太阳能电池或作为热电材料的新的化合物半导体及其应用。化合物半导体可以由化学式：In x M y Co 4-m-a A m S b 12 -n z-b X n Q z表示，其中M是选自Ca，Sr，Ba，Ti，V，Cr，Mn，Cu中的至少一种，Zn，Ag，Cd，Sc，Y，La，Ce，Pr，Nd，Sm，Eu，Gd，Tb，Dy，Ho，Er，Tm，Yb和Lu; A是选自Fe，Ni，Ru，Rh，Pd，Ir和Pt中的至少一种; X是选自Si，Ga，Ge和Sn中的至少一种; Q'是选自O，S和Se中的至少一种; 0

8. 发明授权

US08535637B2 Thermoelectric conversion material and its manufacturing method, and thermoelectric conversion device using the same 有权
标题翻译：热电转换材料及其制造方法以及使用其的热电转换装置
公开(公告)号：US08535637B2
公开(公告)日：2013-09-17
申请号：US13463511
申请日：2012-05-03
申请人： Cheol-Hee Park , Se-Hui Sohn , Won-Jong Kwon , Seung-Tae Hong , Tae-Hoon Kim
发明人： Cheol-Hee Park , Se-Hui Sohn , Won-Jong Kwon , Seung-Tae Hong , Tae-Hoon Kim
IPC分类号： H01L35/00 , H01L35/12 , H01L35/16 , H01L35/20 , C01B19/04 , C01B13/00 , C01B13/14 , C01G29/00 , C01G3/02 , C01G28/00
CPC分类号： H01L35/16 , C09K11/881 , C09K11/885 , H01B1/08 , H01B1/10 , H01L31/0272 , H01L31/032 , H01L31/072 , H01L31/0725 , H01L35/18 , H01L35/22 , Y02E10/50
摘要： Disclosed is a new thermoelectric conversion material represented by the chemical formula 1: Bi1-xCu1-yO1-zTe, where 0≦x 0. A thermoelectric conversion device using said thermoelectric conversion material has good energy conversion efficiency.
摘要翻译：公开了由化学式1：Bi1-xCu1-yO1-zTe表示的新型热电转换材料，其中0≤x≤1,0≤y≤1,0≤z≤1且x + y + z> 0。使用所述热电转换材料的热电转换装置具有良好的能量转换效率。

9. 发明申请

US20110040014A1 INKJET INK COMPOSITION 失效
标题翻译： INKJET墨水组合物
公开(公告)号：US20110040014A1
公开(公告)日：2011-02-17
申请号：US12636378
申请日：2009-12-11
申请人： Tae-Hoon Kim , Dong-Hoon Kim , Byung-Ho Jun , Joon-Rak Choi , Young-Kwan Seo , Young-Il Lee
发明人： Tae-Hoon Kim , Dong-Hoon Kim , Byung-Ho Jun , Joon-Rak Choi , Young-Kwan Seo , Young-Il Lee
IPC分类号： C08K3/08
CPC分类号： C08K3/08 , C08L21/02
摘要： The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating.
摘要翻译：本发明提供一种用于喷墨的金属油墨组合物，更具体地说，一种在PCB基板上不产生裂纹的金属油墨组合物，可以实现低固化温度，并且即使在涂布之后也提供改善的粘合强度。

10. 发明申请

US20110030999A1 METAL CIRCUIT WIRING HAVING ORGANIC RESIN FOR ADHESIVE LAYERS AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有粘合层的有机树脂的金属电路布线及其制造方法
公开(公告)号：US20110030999A1
公开(公告)日：2011-02-10
申请号：US12634145
申请日：2009-12-09
申请人： Young-Il LEE , Sung-Eun Kim , Tae-Hoon Kim , Young-Kwan Seo
发明人： Young-Il LEE , Sung-Eun Kim , Tae-Hoon Kim , Young-Kwan Seo
IPC分类号： H05K1/03 , H05K3/10
CPC分类号： H05K3/386 , H05K3/1208 , H05K2201/0133 , H05K2201/0162 , Y10T29/49162
摘要： The invention is to provide a metal circuit wiring having an organic adhesive layer, the metal circuit wirings comprising: an organic adhesive layer formed with a resin selected from the group consisting of acrylic resin, chloroprene rubber and silicone rubber resin; and metal wiring patterns formed with an ink composition including metal nanoparticles, in which the metal wiring exhibits excellent adhesive between metal nano materials and the substrate and electrical property.
摘要翻译：本发明提供一种具有有机粘合剂层的金属电路布线，金属电路布线包括：由选自丙烯酸树脂，氯丁二烯橡胶和硅橡胶树脂的树脂形成的有机粘合剂层; 以及金属配线图案，其形成有包含金属纳米颗粒的油墨组合物，其中金属布线在金属纳米材料和基材之间表现出优异的粘合剂和电性能。

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