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    • 6. 发明授权
    • Process for slicing boules of single crystal material
    • 单晶材料切片方法
    • US4084354A
    • 1978-04-18
    • US803082
    • 1977-06-03
    • Johannes GrandiaJohn Charles Hill
    • Johannes GrandiaJohn Charles Hill
    • B24B27/06B28D1/00B28D5/00B28D5/02C30B33/00B24B1/02
    • B28D5/028B28D1/003C30B29/28C30B33/00
    • A process for slicing boules of a single crystal material such as gadolinium gallium garnet (GGG) into wafers is described. The boule is prepared, by grinding preferably, so that the longitudinal boule axis corresponds to the crystallographic orientation axis of the boule. The boule is then mounted in a fixture and aligned so that the common longitudinal axis and crystallographic orientation axis is perpendicular to the saw blade. The boule is then rotated while maintaining the orientation of the combined common axis and engaged against an inner diameter rotating saw blade for a time sufficient for the blade to slice through the boule and form a wafer. The wafers obtained by this slicing process may be directly polished without the conventional lapping step to form a wafer having a surface that is substantially flat, parallel and defect free.
    • 描述了将诸如钆镓石榴石(GGG)的单晶材料的坯料切成晶片的方法。 通过优选研磨来制备所述预制棒,使得所述纵向轴轴对应于所述轴的晶体取向轴线。 然后将该支架安装在夹具中并对齐,使得公共纵向轴线和结晶定向轴线垂直于锯片。 然后在保持组合的共同轴线的方向并且与内径旋转的锯片接合足够的时间以使叶片穿过毛坯并形成晶片的同时旋转轴。 通过该切片方法获得的晶片可以直接抛光,而不需要传统的研磨步骤,以形成具有基本平坦,平行和无缺陷的表面的晶片。