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    • 6. 发明申请
    • SENSOR WITH FAIL-SAFE MEDIA SEAL
    • 传感器与安全介质密封
    • US20130098160A1
    • 2013-04-25
    • US13281183
    • 2011-10-25
    • Paul RozgoRyan Jones
    • Paul RozgoRyan Jones
    • G01L9/00B23P11/00
    • G01L19/0672G01L9/0041G01L19/147H01L2224/48091Y10T29/49826H01L2924/00014
    • The present disclosure relates to sensors that are exposed to media during use. In some cases, a sensor assembly includes a sensor element positioned on a substrate, where the sensor element may be mechanically and electrically connected to the substrate and may be in fluid communication with a media inlet port. The sensor assembly may include a cover sealed to the substrate of the sensor assembly to enclose the sensor element in a sealed chamber. In some instances, the sensor assembly may include a bonding layer on the substrate of the sensor assembly, and the cover may be sealed to the bonding layer to form the sealed chamber. In some instances, the sealed chamber may help provide a fail-safe media seal for the sensor assembly in the event the sensor element forms a leak during use.
    • 本公开涉及在使用期间暴露于介质的传感器。 在一些情况下,传感器组件包括定位在基底上的传感器元件,其中传感器元件可以机械地和电连接到基底并且可以与介质入口端口流体连通。 传感器组件可以包括密封到传感器组件的基底的盖,以将传感器元件封闭在密封室中。 在一些情况下,传感器组件可以包括传感器组件的衬底上的结合层,并且盖子可以密封到粘合层以形成密封室。 在一些情况下,在传感器元件在使用期间形成泄漏的情况下,密封腔室可以帮助为传感器组件提供故障安全的介质密封件。
    • 8. 发明申请
    • MODULAR SENSOR ASSEMBLY INCLUDING REMOVABLE SENSING MODULE
    • 模块式传感器组件,包括可拆卸的感应模块
    • US20120290268A1
    • 2012-11-15
    • US13103891
    • 2011-05-09
    • Paul Prehn BeyBill HooverJamie SpeldrichRyan Jones
    • Paul Prehn BeyBill HooverJamie SpeldrichRyan Jones
    • G06F15/00
    • G01D3/021G01D11/245G01F1/684G01F1/6845G01F1/6965G01P5/12
    • A modular sensor assembly in which a sensing module may be packaged and provided separately from a signal processing module and which, in some applications, may facilitate disposal and/or replacement of the sensing module when exposed to a “dirty” or “contaminated” environment without requiring disposal and/or replacement of the entire sensor assembly. In certain applications, the sensing module may include at least one transducer or sensor and a local memory containing a set of conditioning coefficients. The sensing module may be removably coupled to a signal processing module which, in some cases, may be configured to download the set of conditioning coefficients stored in the local memory of the sensing module, and to use the set of conditioning coefficients to produce a substantially linearized output signal.
    • 模块化传感器组件,其中感测模块可以与信号处理模块分开封装和提供,并且在一些应用中,当暴露于污染或污染的环境而不需要处置时,可以有助于处理和/或更换感测模块, /或更换整个传感器组件。 在某些应用中,感测模块可以包括至少一个换能器或传感器以及包含一组调节系数的本地存储器。 感测模块​​可以可移除地耦合到信号处理模块,信号处理模块在一些情况下可被配置为下载存储在感测模块的本地存储器中的一组调理系数,并且使用该组调节系数来产生基本上 线性化输出信号。
    • 10. 发明授权
    • Differential force sensor
    • 差速传感器
    • US08091436B2
    • 2012-01-10
    • US12834321
    • 2010-07-12
    • Todd EckhardtRichard WadeRyan Jones
    • Todd EckhardtRichard WadeRyan Jones
    • G01F1/37A61M31/00
    • A61M5/14A61M5/16831A61M2205/332G01F1/383G01L1/18G01L1/2231G01L9/0055G01L15/00G01L19/0023
    • A differential force sensor method and apparatus for automatically monitoring manual injections through an intravenous line. The differential force sensor includes two piezoresistive sense die that are packaged in close proximity utilizing a number of packaging processes. The two piezoresistive sense die can be utilized to measure forces exerted on a diaphragm on either side of an orifice. The piezoresistive sense die can be packaged in close proximity to make intimate contact with the diaphragms on either side of the orifice. The differential force sensor further includes two plungers that make intimate contact with the diaphragm and transfer the force into the piezo-resistive sense dies. Additionally, one or more ASICs and microcontrollers can be utilized to provide thermal calibration and differential calculation.
    • 一种用于通过静脉管线自动监测手动注射的差速力传感器方法和装置。 差速力传感器包括两个压阻式感测管芯,其通过许多包装工艺紧密地包装在一起。 两个压阻感应模具可用于测量施加在孔口两侧的隔膜上的力。 压阻感应芯片可以紧密封装,以便与孔板两侧的隔膜紧密接触。 差速力传感器还包括两个柱塞,其与膜片紧密接触并将力传递到压阻感测模具中。 此外,可以使用一个或多个ASIC和微控制器来提供热校准和差分计算。