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1. 发明授权

US09049807B2 Processes of making pad-less interconnect for electrical coreless substrate 有权
标题翻译：制造无电芯基板的无焊接互连的工艺
公开(公告)号：US09049807B2
公开(公告)日：2015-06-02
申请号：US12215018
申请日：2008-06-24
申请人： Javier Soto , Charan Gurumurthy , Robert Nickerson , Debendra Mallik
发明人： Javier Soto , Charan Gurumurthy , Robert Nickerson , Debendra Mallik
IPC分类号： H05K3/36 , H05K3/40 , H01L21/48 , H01L23/498 , H05K3/46 , H01L23/31 , H05K1/11 , H05K3/00 , H05K3/20 , H05K3/24 , H05K3/28 , H05K3/34
CPC分类号： H01L24/17 , H01L21/4857 , H01L21/486 , H01L23/3128 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L2224/05571 , H01L2224/05573 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/00014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/2064 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H05K1/113 , H05K3/0035 , H05K3/007 , H05K3/20 , H05K3/244 , H05K3/28 , H05K3/3457 , H05K3/4007 , H05K3/4682 , H05K2201/0367 , H05K2201/096 , H05K2203/0152 , H05K2203/1536 , Y10T29/49147 , H01L2924/00 , H01L2224/05599
摘要： A microelectronic device includes a laminated mounting substrate including a die side and a land side with a surface finish layer disposed in a recess on the mounting substrate die side. An electrically conductive first plug is in contact with the surface finish layer and an electrically conductive subsequent plug is disposed on the mounting substrate land side and it is electrically coupled to the electrically conductive first plug and disposed directly below the electrically conductive first plug.
摘要翻译：微电子器件包括层叠安装基板，其包括裸片侧和具有设置在安装基板裸片侧的凹部中的表面光洁度层的平台侧。导电的第一插头与表面光洁度层接触，并且导电的后续插头设置在安装衬底接地侧上，并且其电耦合到导电的第一插头并且直接设置在导电的第一插头的正下方。

2. 发明申请

US20090314519A1 Direct layer laser lamination for electrical bump substrates, and processes of making same 有权
标题翻译：用于电子凸块基板的直接层激光层压及其制造方法
公开(公告)号：US20090314519A1
公开(公告)日：2009-12-24
申请号：US12215018
申请日：2008-06-24
申请人： Javier Soto , Charan Gurumurthy , Robert Nickerson , Debendra Mallik
发明人： Javier Soto , Charan Gurumurthy , Robert Nickerson , Debendra Mallik
IPC分类号： H05K3/00 , H05K1/00
CPC分类号： H01L24/17 , H01L21/4857 , H01L21/486 , H01L23/3128 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L2224/05571 , H01L2224/05573 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/00014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/2064 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H05K1/113 , H05K3/0035 , H05K3/007 , H05K3/20 , H05K3/244 , H05K3/28 , H05K3/3457 , H05K3/4007 , H05K3/4682 , H05K2201/0367 , H05K2201/096 , H05K2203/0152 , H05K2203/1536 , Y10T29/49147 , H01L2924/00 , H01L2224/05599
摘要： A microelectronic device includes a laminated mounting substrate including a die side and a land side with a surface finish layer disposed in a recess on the mounting substrate die side. An electrically conductive first plug is in contact with the surface finish layer and an electrically conductive subsequent plug is disposed on the mounting substrate land side and it is electrically coupled to the electrically conductive first plug and disposed directly below the electrically conductive first plug.
摘要翻译：微电子器件包括层叠安装基板，其包括裸片侧和具有设置在安装基板裸片侧的凹部中的表面光洁度层的平台侧。导电的第一插头与表面光洁度层接触，并且导电的后续插头设置在安装衬底接地侧上，并且其电耦合到导电的第一插头并且直接设置在导电的第一插头的正下方。

3. 发明申请

US20070184644A1 BALL GRID ARRAY COPPER BALANCING 审中-公开
标题翻译：球网阵列铜平衡
公开(公告)号：US20070184644A1
公开(公告)日：2007-08-09
申请号：US11691135
申请日：2007-03-26
申请人： Robert Nickerson , Hamid Ekhlassi
发明人： Robert Nickerson , Hamid Ekhlassi
IPC分类号： H01L21/44
CPC分类号： H01L23/49816 , H01L23/49838 , H01L2924/0002 , H01L2924/00
摘要： A ball grid array device includes a substrate having a first major surface and a second major surface. The first major surface includes leads for electrical connections. The second major surface is devoid of leads. The ball grid array device also includes a first land having a solder mask opening at the first major surface of the substrate, and a second, buried land near the first major surface of the substrate. A method for forming an electronic device includes forming an electronic circuit in a substrate, placing an input pad for an input to the electronic circuit on at least one major surface of the substrate, placing an output pad for an output from the electronic circuit on the at least one major surface of the substrate, and placing an electrically isolated pad near the at least one major surface of the substrate.
摘要翻译：球栅阵列器件包括具有第一主表面和第二主表面的衬底。第一主表面包括用于电连接的引线。第二个主要表面没有铅。球栅阵列器件还包括在衬底的第一主表面处具有焊料掩模开口的第一焊盘和在衬底的第一主表面附近的第二埋置焊盘。一种形成电子设备的方法包括在基板中形成电子电路，在基板的至少一个主表面上放置用于输入到电子电路的输入焊盘，将用于电子电路的输出的输出焊盘放置在衬底的至少一个主表面，并且将电绝缘垫放置在衬底的至少一个主表面附近。

4. 发明授权

US07205649B2 Ball grid array copper balancing 有权
标题翻译：球栅阵列铜平衡
公开(公告)号：US07205649B2
公开(公告)日：2007-04-17
申请号：US10610317
申请日：2003-06-30
申请人： Robert Nickerson , Hamid Ekhlassi
发明人： Robert Nickerson , Hamid Ekhlassi
IPC分类号： H01L23/053 , H01L23/12 , H01L23/06 , H01L23/48 , H01L23/52
CPC分类号： H01L23/49816 , H01L23/49838 , H01L2924/0002 , H01L2924/00
摘要： A ball grid array device includes a substrate having a first major surface and a second major surface. The first major surface includes leads for electrical connections. The second major surface is devoid of leads. The ball grid array device also includes a first land having a solder mask opening at the first major surface of the substrate, and a second, buried land near the first major surface of the substrate. A method for forming an electronic device includes forming an electronic circuit in a substrate, placing an input pad for an input to the electronic circuit on at least one major surface of the substrate, placing an output pad for an output from the electronic circuit on the at least one major surface of the substrate, and placing an electrically isolated pad near the at least one major surface of the substrate.
摘要翻译：球栅阵列器件包括具有第一主表面和第二主表面的衬底。第一主表面包括用于电连接的引线。第二个主要表面没有铅。球栅阵列器件还包括在衬底的第一主表面处具有焊料掩模开口的第一焊盘和在衬底的第一主表面附近的第二埋置焊盘。一种形成电子设备的方法包括在基板中形成电子电路，在基板的至少一个主表面上放置用于输入到电子电路的输入焊盘，将用于电子电路的输出的输出焊盘放置在衬底的至少一个主表面，并且将电绝缘垫放置在衬底的至少一个主表面附近。

5. 发明申请

US20060001180A1 In-line wire bonding on a package, and method of assembling same 审中-公开
标题翻译：封装上的线内引线接合及其组装方法
公开(公告)号：US20060001180A1
公开(公告)日：2006-01-05
申请号：US10882998
申请日：2004-06-30
申请人： Brian Taggart , Robert Nickerson , Ronald Spreitzer
发明人： Brian Taggart , Robert Nickerson , Ronald Spreitzer
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L24/85 , H01L23/49816 , H01L23/49838 , H01L23/5386 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/4554 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48482 , H01L2224/49052 , H01L2224/49175 , H01L2224/49431 , H01L2224/49433 , H01L2224/85051 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2224/78 , H01L2924/00
摘要： A wire-bonding substrate includes in-line wire bonds that are substantially of the same pitch on the die bond pads as on the substrate bond pads. A wire-bonding substrate also includes staggered bond pads on at least one of the die and the substrate. A substrate bond pad includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is also disclosed that includes a die that is coupled to the first wire-bonding pad. A computing system is also disclosed that includes the in-line wire-bonding configuration.
摘要翻译：引线键合衬底包括在衬底接合焊盘上的芯片接合焊盘上基本上具有相同间距的在线引线键合。引线键合衬底还包括在芯片和衬底中的至少一个上的交错键合焊盘。衬底接合焊盘包括第一引线接合焊盘和直接设置在引线接合衬底中的第一引线接合焊盘下方的第一通孔。还公开了包括耦合到第一引线接合焊盘的管芯的封装。还公开了包括在线引线结构配置的计算系统。

6. 发明申请

US20050285260A1 Bottom heat spreader 有权
标题翻译：底部散热器
公开(公告)号：US20050285260A1
公开(公告)日：2005-12-29
申请号：US10877586
申请日：2004-06-25
申请人： Dale Hackitt , Robert Nickerson , Brian Taggart
发明人： Dale Hackitt , Robert Nickerson , Brian Taggart
IPC分类号： H01L23/34 , H01L23/367 , H01L23/433 , H01L25/065
CPC分类号： H01L25/0657 , H01L23/367 , H01L23/4334 , H01L24/48 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2225/06589 , H01L2924/00014 , H01L2924/01078 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.
摘要翻译：本发明的实施例提供了一种微电子器件，其具有位于芯片与芯片电连接的芯片和衬底之间的散热器。对于本发明的一个实施例，散热器是具有近似等于芯片的热膨胀系数的热膨胀系数的热塞。

7. 发明申请

US20140346679A1 PACKAGE SUBSTRATES WITH MULTIPLE DICE 有权
标题翻译：包装基底与多个米
公开(公告)号：US20140346679A1
公开(公告)日：2014-11-27
申请号：US14293916
申请日：2014-06-02
申请人： Robert Nickerson , Nicholas Holmberg
发明人： Robert Nickerson , Nicholas Holmberg
IPC分类号： H01L23/522
CPC分类号： H01L23/5226 , H01L23/3107 , H01L23/49827 , H01L23/5389 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L2224/16145 , H01L2224/17181 , H01L2224/32145 , H01L2224/48227 , H01L2224/73215 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06568
摘要： This disclosure relates generally to package substrates with multiple embedded dice wherein each of the embedded dice can be connected directly to a bus of the package substrate without being routed through another die. The package substrate may be configured as a bumpless build up layer (BBUL) substrate.
摘要翻译：本公开一般涉及具有多个嵌入式裸片的封装衬底，其中每个嵌入的裸片可以直接连接到封装衬底的总线，而不通过另一个裸片布线。封装衬底可以被配置为无凸起构建层（BBUL）衬底。

8. 发明申请

US20100051233A1 HEAT-TRANSFERRING, HOLLOW-FLIGHT SCREW CONVEYOR 审中-公开
标题翻译：热转印，中空螺旋输送机
公开(公告)号：US20100051233A1
公开(公告)日：2010-03-04
申请号：US12552369
申请日：2009-09-02
申请人： Preston Whitney , Robert Nickerson
发明人： Preston Whitney , Robert Nickerson
IPC分类号： F28F5/06 , F26B11/12
CPC分类号： F28F5/06 , F26B3/24 , F26B17/20 , F28D2021/0038
摘要： A screw conveyor includes a steam delivery chamber, a condensate return chamber, and a helical hollow flight. In example embodiments, the condensate return chamber is defined by an inner pipe, the steam delivery chamber is defined between the outer and inner pipes, and the helical flight extends radially from the outer pipe. The screw conveyor includes a series of heating zones, each having a “closed-loop” helical passageway formed by the hollow flight and each having a corresponding steam inlet, condensate outlet, and barrier. Steam travels into the screw conveyor, through the steam inlets, and into the helical passageways, where it condenses as it heats a material conveyed by the screw conveyor. As the screw conveyor rotates, the barriers force the condensate upward until it drains through the condensate outlets and into the condensate return chamber for removal from the screw conveyor.
摘要翻译：螺旋输送机包括蒸汽输送室，冷凝水回流室和螺旋空心飞行器。在示例性实施例中，冷凝物返回室由内管限定，蒸汽输送室限定在外管和内管之间，螺旋形螺旋从外管径向延伸。螺旋输送机包括一系列加热区，每个加热区具有由中空螺旋形成的每个具有相应蒸汽入口，冷凝物出口和阻挡层的“闭环”螺旋通道。蒸汽通过蒸汽入口进入螺旋输送机，并进入螺旋通道，当螺旋输送机加热由螺旋输送机输送的材料时，蒸汽冷凝。当螺旋输送机旋转时，障碍物将冷凝物向上推动，直到其通过冷凝物出口排出并进入冷凝水回流室，以从螺旋输送机中取出。

9. 发明申请

US20080023820A1 BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME 审中-公开
标题翻译：通过基材的粘合剂手指，其制造方法，其包装及其组装方法
公开(公告)号：US20080023820A1
公开(公告)日：2008-01-31
申请号：US11866239
申请日：2007-10-02
申请人： Brian Taggart , Ronald Apreitzer , Robert Nickerson
发明人： Brian Taggart , Ronald Apreitzer , Robert Nickerson
IPC分类号： H01L23/04 , H05K1/11
CPC分类号： H05K1/111 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49052 , H01L2224/49175 , H01L2224/49433 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/0103 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H05K2201/096 , H05K2203/049 , Y02P70/611 , Y10T29/49156 , Y10T29/49162 , Y10T29/49165 , H01L2924/00014 , H01L2924/00
摘要： A wire-bonding substrate is disclosed. The wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package is also disclosed that includes a die that is coupled to the first wire-bonding pad. The package can include a larger substrate that is coupled to the wire-bonding substrate through an electrical connection such as a solder ball. A process of forming the wire-bonding substrate is also disclosed. The process includes via formation to stop on the wire-bond pad. A method of assembling a microelectronic package is also disclosed that includes coupling the die to the wire-bond pad. A computing system is also disclosed that includes the wire-bonding substrate.
摘要翻译：公开了引线键合衬底。引线键合衬底包括第一引线接合焊盘和布置在引线接合衬底中的第一引线接合焊盘正下方的第一通孔。还公开了包括耦合到第一引线接合焊盘的管芯的封装。封装可以包括通过诸如焊球之类的电连接而与引线键合衬底耦合的较大衬底。还公开了形成引线接合基板的工艺。该过程包括通孔形成以在接线焊盘上停止。还公开了组装微电子封装的方法，其包括将管芯耦合到引线接合焊盘。还公开了一种包括引线接合衬底的计算系统。

10. 发明申请

US20060000876A1 Circular wire-bond pad, package made therewith, and method of assembling same 有权
标题翻译：圆形导线焊盘，由其制成的封装及其组装方法
公开(公告)号：US20060000876A1
公开(公告)日：2006-01-05
申请号：US10881741
申请日：2004-06-30
申请人： Robert Nickerson , Brian Taggart , Hai Ding
发明人： Robert Nickerson , Brian Taggart , Hai Ding
IPC分类号： B23K31/02
CPC分类号： B23K20/004 , B23K2101/42 , H01L23/49816 , H01L23/49838 , H01L23/5386 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49052 , H01L2224/4917 , H01L2224/49171 , H01L2224/49175 , H01L2224/4943 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , Y10T428/249921 , Y10T428/26 , H01L2224/78 , H01L2224/45099 , H01L2924/00
摘要： A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also disclosed that is located directly above the via in the substrate. A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is includes a chip stack with a total die-side characteristic dimension, and a total substrate-side characteristic dimension that is smaller than the total die-side characteristic dimension. A computing system includes the curvilinear wire-bond pad.
摘要翻译：引线键合衬底包括曲线性引线键合焊盘。曲线引线接合焊盘用于反向引线接合以将管芯与衬底耦合。还公开了一种曲线形接合焊盘，其位于衬底中的通孔正上方。引线键合衬底包括第一引线接合焊盘和布线键合衬底中的第一引线接合焊盘正下方的第一通孔。封装包括具有总模侧特性尺寸的芯片堆叠，以及小于总模侧特征尺寸的总基板侧特征尺寸。一种计算系统包括曲线性的接线焊盘。

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