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1. 发明申请

US20110260345A1 METHOD FOR FORMING IMAGE SENSING DEVICE 有权
标题翻译：用于形成图像感测装置的方法
公开(公告)号：US20110260345A1
公开(公告)日：2011-10-27
申请号：US12765460
申请日：2010-04-22
申请人： Jau-Jan Deng , Wei-Ping Chen , Jui-Yi Chiu
发明人： Jau-Jan Deng , Wei-Ping Chen , Jui-Yi Chiu
IPC分类号： B29C43/02
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2924/0002 , H01L2924/00
摘要： A method for forming an image sensing device is disclosed, including providing a molding apparatus, disposing a lens in the molding apparatus, injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens, opening the chamber of the molding apparatus to remove the lens and the shell connected to the lens, and assembling the shell with an image sensing element.
摘要翻译：公开了一种用于形成图像感测装置的方法，包括提供模制装置，在模制装置中设置透镜，将注射材料注射到模制装置的腔室中以形成连接到透镜的壳体，打开腔室的模制设备以去除与透镜相连的透镜和壳体，以及将外壳与图像感测元件组装。

2. 发明授权

US09379153B2 Method for forming image sensing device 有权
标题翻译：图像感测装置的形成方法
公开(公告)号：US09379153B2
公开(公告)日：2016-06-28
申请号：US12765460
申请日：2010-04-22
申请人： Jau-Jan Deng , Wei-Ping Chen , Jui-Yi Chiu
发明人： Jau-Jan Deng , Wei-Ping Chen , Jui-Yi Chiu
IPC分类号： B29C43/02 , H01L27/146
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2924/0002 , H01L2924/00
摘要： A method for forming an image sensing device is disclosed, including providing a molding apparatus, disposing a lens in the molding apparatus, injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens, opening the chamber of the molding apparatus to remove the lens and the shell connected to the lens, and assembling the shell with an image sensing element.
摘要翻译：公开了一种用于形成图像感测装置的方法，包括提供模制装置，在模制装置中设置透镜，将注射材料注射到模制装置的腔室中以形成连接到透镜的壳体，打开腔室的模制设备以去除与透镜相连的透镜和壳体，以及将外壳与图像感测元件组装。

3. 发明授权

US08351219B2 Electronic assembly for an image sensing device 有权
标题翻译：用于图像感测装置的电子组件
公开(公告)号：US08351219B2
公开(公告)日：2013-01-08
申请号：US12553362
申请日：2009-09-03
申请人： Chun-Chi Lin , Jau-Jan Deng , Wei-Ping Chen
发明人： Chun-Chi Lin , Jau-Jan Deng , Wei-Ping Chen
IPC分类号： H05K9/00 , H05K7/00 , H05K7/10 , H05K7/14 , H01L33/00 , H01L31/0232 , H01L27/146
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/13 , H04N5/2252 , H04N5/2253 , H04N5/2257
摘要： An electronic assembly for an image sensing device is disclosed, comprising an image sensing element, a lens set comprising a feet enclosing a cavity to receive the image sensing element and an opaque conductive layer disposed on at least a portion of a top side, a sidewall and a bottom side of the lens set, wherein the opaque conductive layer is electrically connected to a grounding layer to reduce electromagnetic interference (EMI) to the image sensing element.
摘要翻译：公开了一种用于图像感测装置的电子组件，包括图像感测元件，透镜组，包括包围腔以容纳图像感测元件的镜头和设置在顶侧的至少一部分上的不透明导电层，侧壁和透镜组的底侧，其中不透明导电层电连接到接地层，以减小对图像感测元件的电磁干扰（EMI）。

4. 发明申请

US20110051390A1 ELECTRONIC ASSEMBLY FOR AN IMAGE SENSING DEVICE 有权
标题翻译：用于图像感测装置的电子组件
公开(公告)号：US20110051390A1
公开(公告)日：2011-03-03
申请号：US12553362
申请日：2009-09-03
申请人： Chun-Chi LIN , Jau-Jan Deng , Wei-Ping Chen
发明人： Chun-Chi LIN , Jau-Jan Deng , Wei-Ping Chen
IPC分类号： H05K9/00
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/13 , H04N5/2252 , H04N5/2253 , H04N5/2257
摘要： An electronic assembly for an image sensing device is disclosed, comprising an image sensing element, a lens set comprising a feet enclosing a cavity to receive the image sensing element and an opaque conductive layer disposed on at least a portion of a top side, a sidewall and a bottom side of the lens set, wherein the opaque conductive layer is electrically connected to a grounding layer to reduce electromagnetic interference (EMI) to the image sensing element.
摘要翻译：公开了一种用于图像感测装置的电子组件，包括图像感测元件，透镜组，包括包围腔以容纳图像感测元件的镜头和设置在顶侧的至少一部分上的不透明导电层，侧壁和透镜组的底侧，其中不透明导电层电连接到接地层，以减小对图像感测元件的电磁干扰（EMI）。

5. 发明授权

US08837060B2 Image capture lens module and wafer level packaged image capture devices 有权
标题翻译：图像采集镜头模块和晶圆级封装图像捕获设备
公开(公告)号：US08837060B2
公开(公告)日：2014-09-16
申请号：US13035391
申请日：2011-02-25
申请人： Chun-Chi Lin , Jau-Jan Deng , Wei-Ping Chen
发明人： Chun-Chi Lin , Jau-Jan Deng , Wei-Ping Chen
IPC分类号： G02B9/04 , G02B9/08 , G02B13/00 , G02B5/00 , H01L27/146 , G02B9/02
CPC分类号： G02B13/003 , G02B5/005 , G02B9/02 , G02B9/04 , G02B9/08 , G02B13/004 , G02B13/0085 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： Image capture lens modules and wafer level packaged image capture devices are presented. The image capture lens module includes a compound lens with a first lens element and a second lens element molded on both sides of a substrate, and a field stop disposed at an interface between the first lens element and the substrate or at an interface between the second lens element and the substrate, wherein the field stop is a coating layer with a polygonal transparent area.
摘要翻译：提出了图像采集镜头模块和晶片级封装图像捕获设备。图像拍摄透镜模块包括具有第一透镜元件和模制在基板的两侧上的第二透镜元件的复合透镜，以及设置在第一透镜元件和基板之间或第二透镜元件的第二透镜元件透镜元件和基板，其中场挡板是具有多边形透明区域的涂层。

6. 发明授权

US08500344B2 Compact camera module and method for fabricating the same 有权
标题翻译：紧凑型相机模块及其制造方法
公开(公告)号：US08500344B2
公开(公告)日：2013-08-06
申请号：US13189899
申请日：2011-07-25
申请人： Pai-Chun Peter Zung , Jau-Jan Deng , Wei-Ping Chen
发明人： Pai-Chun Peter Zung , Jau-Jan Deng , Wei-Ping Chen
IPC分类号： G03B17/00 , G02B7/02
CPC分类号： G02B7/021 , H01L27/14618 , H01L27/14623 , H01L27/14625 , H01L27/14683 , H01L2224/13 , H04N5/2251 , H04N5/2257 , Y10T29/49826
摘要： The invention provides a compact camera module and a method for fabricating the same. A compact camera module includes an image sensor device package. A back spacer ring is disposed on the image sensor device package. A first edge of the back spacer ring is aligned to a second edge of the image sensor device package. An optical lens plate disposed over the back spacer ring. A front spacer ring is sandwiched between the back spacer ring and the optical lens plate. A third edge of the front spacer ring is aligned to a fourth edge of the optical lens plate.
摘要翻译：本发明提供一种紧凑型相机模块及其制造方法。小型相机模块包括图像传感器装置包装。后隔离环设置在图像传感器装置封装上。后间隔环的第一边缘对准图像传感器装置包装的第二边缘。设置在后隔离环上的光学透镜板。前间隔环夹在后间隔环和光学透镜板之间。前间隔环的第三边缘与光学透镜板的第四边缘对准。

7. 发明申请

US20080089016A1 Industrial computer casing 审中-公开
标题翻译：工业电脑外壳
公开(公告)号：US20080089016A1
公开(公告)日：2008-04-17
申请号：US11581532
申请日：2006-10-17
申请人： Wei-Ping Chen
发明人： Wei-Ping Chen
IPC分类号： H02B1/00
CPC分类号： G06F1/181
摘要： An industrial computer casing comprises a seat; a front frame at a front side of the seat and formed with a frame hole and a long hole at an upper side of the frame hole; a door plate covering upon a front end of the front frame; the door plate having a plurality of via holes; a tray installed with a data processing unit; the tray passing through the long hole and running across the frame supporter and the supporting plate so as to be positioned at an upper front side of the casing; and a back plate at a backside of the seat; a mother board installed on the seat and in an open space between the frame supporter and the back plate; and an upper cover covering upon the seat.
摘要翻译：工业计算机外壳包括座; 位于所述座椅的前侧的前框架，并且在所述框架孔的上侧形成有框架孔和长孔; 盖板，其覆盖在前框架的前端; 门板具有多个通孔; 安装有数据处理单元的托盘; 所述托盘穿过所述长孔并穿过所述框架支撑件和所述支撑板，以便定位在所述壳体的上前侧; 和座椅背面的背板; 安装在座椅上并且在框架支撑件和后板之间的敞开空间中的母板; 以及覆盖在座椅上的上盖。

8. 发明授权

US07994355B2 Metallocene-based chiral phosphine or arsine ligands 失效
标题翻译：基于茂金属的手性膦或胂配体
公开(公告)号：US07994355B2
公开(公告)日：2011-08-09
申请号：US10586287
申请日：2005-01-14
申请人： Wei-Ping Chen , John Whittall
发明人： Wei-Ping Chen , John Whittall
IPC分类号： C07F15/02 , C08F4/70 , C08F4/80
CPC分类号： C07F17/02 , B01J31/1845 , B01J31/186 , B01J31/188 , B01J31/189 , B01J31/1895 , B01J31/2295 , B01J31/2404 , B01J31/2409 , B01J31/2452 , B01J31/2457 , B01J31/2495 , B01J2231/645 , B01J2531/0205 , B01J2531/82 , B01J2531/822 , B01J2531/842 , B01J2531/847
摘要： The present invention relates to metallocene-based phosphine ligands having chirality at phosphorus and at least one other element of chirality (planar chirality and/or chirality at carbon); and to the use of such ligands in asymmetric transformation reactions to generate high enantiomeric excesses of formed compounds. A method for the preparation of ligands according to the invention involving the conversion of the ortho-lithiated substituted metallocene to a phosphine chiral at phosphorus is also disclosed.
摘要翻译：本发明涉及在磷中具有手性和手性的至少一种其他元素（碳的手性和/或手性）的金属茂基膦配体。以及在不对称转化反应中使用这种配体以产生形成的化合物的高对映体过量。还公开了用于制备根据本发明的配体的方法，其涉及将邻位取代的金属茂转化为在磷上手性膦化合物。

9. 发明申请

US20080130217A1 Swappable data access unit rack structure installable in a computer casing 审中-公开
标题翻译：可插拔数据存取单元机架结构可安装在计算机外壳中
公开(公告)号：US20080130217A1
公开(公告)日：2008-06-05
申请号：US11633226
申请日：2006-12-05
申请人： Wei-Ping Chen
发明人： Wei-Ping Chen
IPC分类号： H05K5/02
CPC分类号： H05K7/20727 , H05K7/1487
摘要： In a swappable data access unit rack structure installable in a computer casing, a chassis is a box body composed of a lower casing, a front frame, a rear panel and an upper casing. The front frame has a frame hole, a transversal long hole at its upper edge, and a frame at the rear of the front frame. An upper distal surface of the frame is of the same height with a lower edge of the long hole of the front frame. A rack panel is fixed at the upper edge of the inner side of the lower casing. The long hole, the upper distal surface of the frame and the rack panel define a horizontal bay and a tray for carrying a data access unit. The tray is slidably slid into the bay and mounted across the upper distal surface of the frame and the rack panel.
摘要翻译：在可安装在计算机外壳中的可交换数据存取单元机架结构中，底盘是由下壳体，前框架，后面板和上壳体组成的盒体。前框架具有框架孔，其上边缘处具有横向长孔，并且在前框架的后部具有框架。框架的上远端表面与前框架的长孔的下边缘具有相同的高度。机架面板固定在下壳体内侧的上缘。长孔，框架的上远端表面和搁板面板限定水平托架和用于承载数据存取单元的托盘。托盘可滑动地滑入隔间并安装在框架和机架面板的上远端表面上。

10. 发明申请

US20120155854A1 CAMERA MODULE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：相机模块及其制作方法
公开(公告)号：US20120155854A1
公开(公告)日：2012-06-21
申请号：US12974720
申请日：2010-12-21
申请人： Tzu-Wei HUANG , Wei-Ping Chen , Jui-Hung Chang , Chia-Hui Huang , Teng-Sheng Chen
发明人： Tzu-Wei HUANG , Wei-Ping Chen , Jui-Hung Chang , Chia-Hui Huang , Teng-Sheng Chen
IPC分类号： G03B17/02 , H05K13/00
CPC分类号： H01L27/14618 , G03B17/02 , H01L27/14623 , H01L27/14625 , H01L27/14683 , H01L2924/0002 , H04N5/2253 , H04N5/2257 , Y10T29/49002 , H01L2924/00
摘要： The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer.
摘要翻译：本发明提供一种相机模块及其制造方法。相机模块包括在其底表面上具有多个焊球的图像传感器装置芯片。光学透镜设置在图像传感器装置芯片上。金属板具有在图像传感器装置的底面上延伸的部分。金属涂层围绕光学透镜的垂直表面和金属板的一部分的顶表面。第一遮光层覆盖金属涂层的垂直表面。

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