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1. 发明授权

US06395633B1 Method of forming micro-via 有权
标题翻译：形成微孔的方法
公开(公告)号：US06395633B1
公开(公告)日：2002-05-28
申请号：US09871206
申请日：2001-05-31
申请人： Jao-Chin Cheng , Chang-Chin Hsieh , Chih-Peng Fan , Chin-Chung Chang
发明人： Jao-Chin Cheng , Chang-Chin Hsieh , Chih-Peng Fan , Chin-Chung Chang
IPC分类号： H01L2144
CPC分类号： H05K3/4647 , H05K3/108 , H05K3/243 , H05K2203/0542 , H05K2203/0733
摘要： A method of forming a micro-via, for fabrication and design of a layout of a circuit board. A patterned conductive wiring layer is formed on the substrate. A copper layer is plated onto the substrate and the conductive wiring layer. A photoresist layer is formed on the copper layer. A part of the photoresist layer is removed to expose a part of the copper layer. Using the copper layer as a seed layer, a conductive pillar is formed on the exposed part of the copper layer. The photoresist layer is removed. The exposed plated copper layer is removed. An insulation layer is formed on surfaces of the substrate and the conductive pillar. A part of the insulation layer is removed to expose the conductive pillar. A patterned conductive wiring layer is formed on the conductive pillar.
摘要翻译：一种形成微通孔的方法，用于制造和设计电路板的布局。在基板上形成有图案的导电布线层。将铜层镀在基板和导电布线层上。在铜层上形成光致抗蚀剂层。去除光致抗蚀剂层的一部分以露出铜层的一部分。使用铜层作为种子层，在铜层的露出部分上形成导电柱。去除光致抗蚀剂层。暴露的镀铜层被去除。在基板和导电柱的表面上形成绝缘层。去除绝缘层的一部分以露出导电柱。在导电柱上形成有图案的导电布线层。

2. 发明授权

US06749737B2 Method of fabricating inter-layer solid conductive rods 有权
标题翻译：制造层间固体导电棒的方法
公开(公告)号：US06749737B2
公开(公告)日：2004-06-15
申请号：US09927723
申请日：2001-08-10
申请人： Jao-Chin Cheng , Chang-Chin Hsieh , Chih-Peng Fan , Chih-Hao Yeh
发明人： Jao-Chin Cheng , Chang-Chin Hsieh , Chih-Peng Fan , Chih-Hao Yeh
IPC分类号： C25D502
CPC分类号： H05K3/423 , C25D1/003 , H05K3/0035 , H05K3/4602 , H05K2201/0355 , H05K2201/0394 , H05K2203/025 , H05K2203/0554 , H05K2203/0733
摘要： A method of forming a solid inter-layer conductive rod. A printed circuit board comprising an insulating core layer, a first conductive layer and a second conductive layer is provided. The insulating core layer is sandwiched between the first conductive layer and the second conductive layer. A first opening that exposes a portion of the insulating core layer is formed in the first conductive layer. The exposed insulating core layer is removed by laser drilling to form a second opening that exposes a portion of the second conductive layer. An electroplating process is conducted using the second conductive layer as a negative electrode so that conductive material solidly fills the first opening and the second opening to form a solid conductive rod.
摘要翻译：形成固体层间导电棒的方法。提供了包括绝缘芯层，第一导电层和第二导电层的印刷电路板。绝缘芯层夹在第一导电层和第二导电层之间。在第一导电层中形成露出绝缘芯层的一部分的第一开口。暴露的绝缘芯层通过激光钻孔去除以形成露出第二导电层的一部分的第二开口。使用第二导电层作为负极进行电镀工艺，使得导电材料牢固地填充第一开口和第二开口以形成固体导电棒。

3. 发明授权

US06448170B1 Method of producing external connector for substrate 有权
标题翻译：制造基板外部连接器的方法
公开(公告)号：US06448170B1
公开(公告)日：2002-09-10
申请号：US09998453
申请日：2001-11-27
申请人： Jao-Chin Cheng , Chang-Chin Hsieh , Bang-Chiung Liu , Chung-Yuan Chiu
发明人： Jao-Chin Cheng , Chang-Chin Hsieh , Bang-Chiung Liu , Chung-Yuan Chiu
IPC分类号： H01L2144
CPC分类号： H05K3/28 , H01L21/4853 , H05K3/243 , H05K2201/0367 , H05K2203/0542
摘要： A method of producing an external connector is provided. A substrate is provided and a plurality of pads are formed on the substrate. A copper layer is formed on the substrate to cover the pads. A patterned photoresist is formed on the copper layer. The patterned photoresist has a plurality of openings to expose the copper layer which corresponds to the pads. Then, a conductive plug is formed on the exposed copper layer. The patterned photoresist is removed, and the copper layer which is not covered by the conductive plug is subsequently removed. A solder resist is formed over the substrate to cover the pads and the conductive plug. A portion of the solder resist is removed until the conductive plug is exposed, wherein the solder resist is as high as the conductive plug.
摘要翻译：提供一种制造外部连接器的方法。提供衬底并且在衬底上形成多个衬垫。在衬底上形成铜层以覆盖衬垫。在铜层上形成图案化的光致抗蚀剂。图案化的光致抗蚀剂具有多个开口以暴露对应于焊盘的铜层。然后，在暴露的铜层上形成导电塞。去除图案化的光致抗蚀剂，随后去除未被导电塞覆盖的铜层。在衬底上形成阻焊剂以覆盖焊盘和导电插头。去除阻焊剂的一部分直到导电插头露出，其中阻焊层与导电插塞一样高。

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