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    • 5. 发明授权
    • Apparatus for cleaning of circuit substrates
    • 电路基板清洗装置
    • US08752228B2
    • 2014-06-17
    • US11912126
    • 2005-04-20
    • Janos FarkasSrdjan KordicSebastien PetitdidierKevin E CooperJan Van Hassel
    • Janos FarkasSrdjan KordicSebastien PetitdidierKevin E CooperJan Van Hassel
    • H01L21/00
    • H01L21/67046
    • Silicon wafers and the like are cleaned using new scrubber-type apparatus in which measures are taken to compensate for differential cleaning of the central region of the wafer by: using rotary brushes having one or more non-contact portions arranged in the section thereof that faces the central region of the substrate, or toggling the relative position of the wafer and the rotary brushes, or directing cleaning fluid(s) preferentially towards the central region of the wafer. Another aspect of the invention provides scrubber-type cleaning apparatus in which the rotary brushes are replaced by rollers (110). A web of cleaning material (116) is interposed between each roller and the substrate. Various different webs of cleaning material may be used, e.g. a length of tissue, a continuous loop of cleaning material whose surface is reconditioned on each cleaning pass, adhesive material provided on a carrier tape, etc.
    • 使用新的洗涤器型装置清洁硅晶片等,其中采取措施来补偿晶片的中心区域的差别清洁:使用具有一个或多个非接触部分的旋转电刷, 或者切换晶片和旋转刷的相对位置,或者将清洁流体优先地引向晶片的中心区域。 本发明的另一方面提供了一种洗涤器型清洁装置,其中旋转刷由辊(110)代替。 清洁材料网(116)插入在每个辊和基底之间。 可以使用各种不同的清洁材料网,例如。 组织长度,每个清洁通道上表面被修复的清洁材料的连续回路,设置在载带上的粘合材料等。
    • 7. 发明申请
    • Apparatus for Cleaning of Circuit Substrates
    • 电路基板清洗装置
    • US20080271274A1
    • 2008-11-06
    • US11912126
    • 2005-04-20
    • Srdjan KordicKevin E. CooperSebastien PetitdidierJanos FarkasJan Van-Hassel
    • Srdjan KordicKevin E. CooperSebastien PetitdidierJanos FarkasJan Van-Hassel
    • H01L21/00
    • H01L21/67046
    • Silicon wafers and the like are cleaned using new scrubber-type apparatus in which measures are taken to compensate for differential cleaning of the central region of the wafer by: using rotary brushes having one or more non-contact portions arranged in the section thereof that faces the central region of the substrate, or toggling the relative position of the wafer and the rotary brushes, or directing cleaning fluid(s) preferentially towards the central region of the wafer. Another aspect of the invention provides scrubber-type cleaning apparatus in which the rotary brushes are replaced by rollers (110). A web of cleaning material (116) is interposed between each roller and the substrate. Various different webs of cleaning material may be used, e.g. a length of tissue, a continuous loop of cleaning material whose surface is reconditioned on each cleaning pass, adhesive material provided on a carrier tape, etc.
    • 使用新的洗涤器型装置清洁硅晶片等,其中采取措施来补偿晶片的中心区域的差别清洁:使用具有一个或多个非接触部分的旋转电刷, 或者切换晶片和旋转刷的相对位置,或者将清洁流体优先地引向晶片的中心区域。 本发明的另一方面提供了一种洗涤器型清洁装置,其中旋转刷由辊(110)代替。 清洁材料网(116)插入在每个辊和基底之间。 可以使用各种不同的清洁材料网,例如。 组织长度,每个清洁通道上表面被修复的清洁材料的连续回路,设置在载带上的粘合材料等。