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    • 10. 发明申请
    • COOLING DEVICE FOR A POWER MODULE, AND A RELATED METHOD THEREOF
    • 用于功率模块的冷却装置及其相关方法
    • US20120327603A1
    • 2012-12-27
    • US13168030
    • 2011-06-24
    • Richard Alfred BeaupreJoseph Lucian SmolenskiWilliam Dwight GerstlerXiaochun Shen
    • Richard Alfred BeaupreJoseph Lucian SmolenskiWilliam Dwight GerstlerXiaochun Shen
    • H05K7/20B23P19/00F28F9/02
    • H01L23/473H01L2924/0002Y10T29/49817H01L2924/00
    • A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality of milli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels.
    • 公开了一种具有通过基板设置在基板上的电子模块的功率模块的冷却装置。 冷却装置包括具有至少一个冷却段的散热板。 冷却段包括用于进入冷却介质的入口增压室,多个入口歧管通道,多个出口歧管通道和出口增压室。 多个入口歧管通道正交地连接到入口气室,用于从入口通风室接收冷却介质。 多个出口歧管通道平行于入口歧管通道设置。 出口增压室正交地连接到多个出口歧管通道,用于排出冷却介质。 多个毫通道与入口和出口歧管通道正交地布置在基板中。 多个毫通道将冷却介质从多个入口歧管通道引导到多个出口歧管通道。