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    • 2. 发明授权
    • Split programmable logic array
    • 分割可编程逻辑阵列
    • US4195352A
    • 1980-03-25
    • US814054
    • 1977-07-08
    • George K. TuGeorge E. MagerLamar T. BakerRobert E. Markle
    • George K. TuGeorge E. MagerLamar T. BakerRobert E. Markle
    • H03K19/177G06F9/00H03K19/08H03K19/34
    • H03K19/17716
    • A mask programmable logic array (PLA) for producing a particular digital output given a certain digital input. The input signals to the PLA first pass through a series of AND gates resulting in a predetermined number of product terms being formed. The product signals then pass through a set of OR gates to become the final output signals. In the subject invention, the AND gates and OR gates are implemented through the use of NOR-NOR logic. A first set of NOR gates is implemented in an array to receive input signals and to produce product terms. A second and third set of NOR gates form two arrays. These two arrays are then located on either side of the first array to receive selected product signals in order to produce final output signals. In effect the OR portion of the PLA has been split into two arrays.TABLE OF CONTENTSSubjectBackground of the InventionSummary of the InventionBrief Description of the DrawingsDetailed Description of the Preferred EmbodimentThe System Block DiagramMicroprocessor Unit Pin DesignationsClock and Timing SignalsSystem TimingThe ROMThe Stack AreaThe RAM AreaElimination of Race Conditions in the RAMThe ALU and ControlTime Slot End PredictorThe CROMBit Manipulation SchemeData Pad Input/OutputPrecharged Data Line DriverBus ControlTest CircuitrySplit PLA ControlThe S-CounterDetails of Logic BlocksThe MOS/LSI ChipThe Chip Test FunctionsThe Instruction Set
    • 面罩可编程逻辑阵列(PLA),用于产生给定一定数字输入的特定数字输出。 到PLA的输入信号首先通过一系列AND门,产生预定数量的产品项。 然后,产品信号通过一组或门以成为最终的输出信号。 在本发明中,AND门和OR门通过使用NOR-NOR逻辑来实现。 第一组NOR门在阵列中实现以接收输入信号并产生产品术语。 第二组和第三组NOR门形成两个阵列。 然后,这两个阵列位于第一阵列的任一侧,以接收选定的产品信号,以产生最终的输出信号。 实际上,PLA的OR部分已经分成两个阵列。
    • 3. 发明授权
    • Chip topography for MOS integrated circuitry microprocessor chip
    • US4144561A
    • 1979-03-13
    • US813902
    • 1977-07-08
    • George K. TuLamar T. BakerRobert E. MarkleGeorge E. Mager
    • George K. TuLamar T. BakerRobert E. MarkleGeorge E. Mager
    • G06F15/78H01L27/02G06F1/00G06F9/00
    • H01L27/0207
    • The chip topography of an MOS microprocessor chip. The chip architecture includes an internal data bus and an internal address bus. Input/output circuitry is located along the top edge of the chip and is coupled to the data bus. Output circuitry is located along the bottom edge and coupled to the address bus. A program storage area which includes a ROM is located in the lower left hand corner of the chip. The ROM contains instruction words for defining the operation of the microprocessor. A data storage area which includes a RAM is located in the upper left hand corner of the chip and is coupled to the data bus. An ALU area is located to the right of the data storage area and is coupled to the data bus for performing arithmetic and logic operations on data. A condition decode ROM located in the approximate center of the chip is coupled to the data bus and is used for decoding a condition field of an instruction word received from the ROM. A bus control area is located in the upper right hand corner of the chip. A programmed control area is located between the ALU area and the bus control area in the upper right hand portion of the chip and is coupled to the data bus for receiving instruction words from the program storage area and for generating commands which define the operation of the microprocessor in response to the instruction words. A clock/T-counter is located in the lower right hand corner and is used for synchronizing data signal flow in the micrprocessor. A stack area is located in the lower right hand portion of the chip. Within this stack area are various registers located from top to bottom as follows; write X circuitry, an X register a stack array, stack read/write circuitry, a memory address register, and an incrementer. A stack control is located between the aforementioned stack circuitry and the right hand edge. In addition, a RAM decode is located between the RAM and the left hand edge, a ROM column decode is located between the ROM and the bottom edge, and a ROM row decode is located between the ROM and the stack area.