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    • 4. 发明授权
    • High K dielectric growth on metal triflate or trifluoroacetate terminated III-V semiconductor surfaces
    • 金属三氟甲磺酸盐或三氟乙酸封端III-V半导体表面上的高K电介质生长
    • US07763317B2
    • 2010-07-27
    • US11694781
    • 2007-03-30
    • James M. BlackwellWilly RachmadyGregory J. KearnsDarryl J. Morrison
    • James M. BlackwellWilly RachmadyGregory J. KearnsDarryl J. Morrison
    • C23C16/00
    • H01L21/0228H01L21/02178H01L21/306H01L21/3141
    • Surface preparation of a compound semiconductor surface, such as indium antimonide (InSb), with a triflating agent, such as triflic anhydride or a trifluoroacetylating agent, such as trifluoroacetic anhydride is described. In one embodiment, the triflating or trifluoroacetylating passivates the compound semiconductor surface by terminating the surface with triflate trifluoroacetate groups. In a further embodiment, a triflating agent or trifluoroacetylating agent is employed to first convert a thin native oxide present on a compound semiconductor surface to a soluble species. In another embodiment, the passivated compound semiconductor surface is activated in an ALD chamber by reacting the triflate or trifluoroacetate protecting groups with a protic source, such as water (H2O). Metalorganic precursors are then introduced in the ALD chamber to form a good quality interfacial layer, such as aluminum oxide (Al2O3), on the compound semiconductor surface.
    • 描述了化合物半导体表面如铟锑酸盐(InSb)与三氟甲磺酸酐或三氟乙酰化剂如三氟乙酸酐之类的三氟甲磺酸酯的表面处理。 在一个实施方案中,三氟甲磺酸酯或三氟乙酰化剂通过用三氟甲磺酸酯三氟乙酸酯基团终止表面而钝化化合物半导体表面。 在另一个实施方案中,使用三氟甲磺酸酯或三氟乙酰化剂来将存在于化合物半导体表面上的薄的天然氧化物转化为可溶物质。 在另一个实施方案中,通过使三氟甲磺酸酯或三氟乙酸酯保护基团与质子源如水(H 2 O)反应,钝化的化合物半导体表面在ALD室中活化。 然后将金属有机前体引入ALD室中以在化合物半导体表面上形成良好质量的界面层,例如氧化铝(Al 2 O 3)。
    • 5. 发明申请
    • HIGH K DIELECTRIC GROWTH ON METAL TRIFLATE OR TRIFLUOROACETATE TERMINATED III-V SEMICONDUCTOR SURFACES
    • 金属三聚物或三氟化铵终止的III-V半导体表面的高K电介质生长
    • US20080241423A1
    • 2008-10-02
    • US11694781
    • 2007-03-30
    • James M. BlackwellWilly RachmadyGregory J. KearnsDarryl J. Morrison
    • James M. BlackwellWilly RachmadyGregory J. KearnsDarryl J. Morrison
    • C23C22/00
    • H01L21/0228H01L21/02178H01L21/306H01L21/3141
    • Surface preparation of a compound semiconductor surface, such as indium antimonide (InSb), with a triflating agent, such as triflic anhydride or a trifluoroacetylating agent, such as trifluoroacetic anhydride is described. In one embodiment, the triflating or trifluoroacetylating passivates the compound semiconductor surface by terminating the surface with triflate trifluoroacetate groups. In a further embodiment, a triflating agent or trifluoroacetylating agent is employed to first convert a thin native oxide present on a compound semiconductor surface to a soluble species. In another embodiment, the passivated compound semiconductor surface is activated in an ALD chamber by reacting the triflate or trifluoroacetate protecting groups with a protic source, such as water (H2O). Metalorganic precursors are then introduced in the ALD chamber to form a good quality interfacial layer, such as aluminum oxide (Al2O3), on the compound semiconductor surface.
    • 描述了化合物半导体表面如铟锑酸盐(InSb)与三氟甲磺酸酐或三氟乙酰化剂如三氟乙酸酐之类的三氟甲磺酸酯的表面处理。 在一个实施方案中,三氟甲磺酸酯或三氟乙酰化剂通过用三氟甲磺酸酯三氟乙酸酯基团终止表面而钝化化合物半导体表面。 在另一个实施方案中,使用三氟甲磺酸酯或三氟乙酰化剂来将存在于化合物半导体表面上的薄的天然氧化物转化为可溶物质。 在另一个实施方案中,钝化的化合物半导体表面通过使三氟甲磺酸酯或三氟乙酸酯保护基与质子源(例如水(H 2 O 2))反应而在ALD室中活化。 然后将金属有机前体引入ALD室中以在化合物半导体表面上形成良好质量的界面层,例如氧化铝(Al 2 O 3 O 3)。