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1. 发明申请

US20070138626A1 CROSSING CONDUCTIVE TRACES IN A PCB 有权
标题翻译： PCB中的交叉导线
公开(公告)号：US20070138626A1
公开(公告)日：2007-06-21
申请号：US11563972
申请日：2006-11-28
申请人： James L. Knighten , Norman Smith , Jun Fan
发明人： James L. Knighten , Norman Smith , Jun Fan
IPC分类号： H01L23/34
CPC分类号： H05K1/115 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H05K1/0245 , H05K1/0248 , H05K1/141 , H05K1/147 , H05K3/4046 , H05K3/429 , H05K2201/048 , H05K2201/091 , H05K2201/09245 , H05K2201/09645 , H01L2924/00
摘要： A printed circuit board includes at least two conductive traces, each having a first portion and a second portion. The printed circuit board also includes a cross-over section that includes two electrically conductive portions, each connecting electrically to the first and second portions of a corresponding one of the conductive traces, such that the conductive traces in their first portions lie on opposite sides of each other as they do in their second portions.
摘要翻译：印刷电路板包括至少两个导电迹线，每个导电迹线具有第一部分和第二部分。印刷电路板还包括交叉部分，其包括两个导电部分，每个导电部分电连接到相应的一个导电迹线的第一部分和第二部分，使得其第一部分中的导电迹线位于彼此在他们的第二部分。

2. 发明授权

US07652364B2 Crossing conductive traces in a PCB 有权
标题翻译：在PCB中穿过导电迹线
公开(公告)号：US07652364B2
公开(公告)日：2010-01-26
申请号：US11563972
申请日：2006-11-28
申请人： James L. Knighten , Norman Smith , Jun Fan
发明人： James L. Knighten , Norman Smith , Jun Fan
IPC分类号： H01L23/52 , H05K7/00 , H01R12/04
CPC分类号： H05K1/115 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H05K1/0245 , H05K1/0248 , H05K1/141 , H05K1/147 , H05K3/4046 , H05K3/429 , H05K2201/048 , H05K2201/091 , H05K2201/09245 , H05K2201/09645 , H01L2924/00
摘要： A printed circuit board includes at least two conductive traces, each having a first portion and a second portion. The printed circuit board also includes a cross-over section that includes two electrically conductive portions, each connecting electrically to the first and second portions of a corresponding one of the conductive traces, such that the conductive traces in their first portions lie on opposite sides of each other as they do in their second portions.
摘要翻译：印刷电路板包括至少两个导电迹线，每个导电迹线具有第一部分和第二部分。印刷电路板还包括交叉部分，其包括两个导电部分，每个导电部分电连接到相应的一个导电迹线的第一部分和第二部分，使得其第一部分中的导电迹线位于彼此在他们的第二部分。

3. 发明申请

US20070138617A1 USING A THRU-HOLE VIA TO IMPROVE CIRCUIT DENSITY IN A PCB 失效
标题翻译：通过在PCB中提高电路密度来使用THRU-HOLE
公开(公告)号：US20070138617A1
公开(公告)日：2007-06-21
申请号：US11563729
申请日：2006-11-28
申请人： James L. Knighten , Jun Fan , Norman Smith
发明人： James L. Knighten , Jun Fan , Norman Smith
IPC分类号： H01L23/04
CPC分类号： H05K1/115 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H05K1/114 , H05K2201/09645 , H05K2201/10734 , H01L2924/00
摘要： A printed circuit board includes multiple layers on which electrically conductive traces reside, where at least two of the electrically conductive traces each has a first portion formed on one layer of the printed circuit board and a second portion formed on another layer of the printed circuit board. The printed circuit board also includes a thru-hole via that includes at least two electrically conductive portions electrically isolated from each other, such that each of the electrically conductive portions connects electrically to both the first and second portions of a corresponding one of the electrically conductive traces.
摘要翻译：印刷电路板包括多个导电迹线所在的层，其中至少两个导电迹线各自具有形成在印刷电路板的一层上的第一部分和形成在印刷电路板的另一层上的第二部分。印刷电路板还包括通孔，通孔包括彼此电隔离的至少两个导电部分，使得每个导电部分电连接到导电的相应导电部分的第一和第二部分痕迹

4. 发明授权

US07216422B2 Method of forming a capacitor assembly in a circuit board 有权
标题翻译：在电路板中形成电容器组件的方法
公开(公告)号：US07216422B2
公开(公告)日：2007-05-15
申请号：US11007010
申请日：2004-12-08
申请人： Jun Fan , James L. Knighten , Arthur R. Alexander , Norman W. Smith
发明人： Jun Fan , James L. Knighten , Arthur R. Alexander , Norman W. Smith
IPC分类号： H05K3/30
CPC分类号： H05K1/0231 , H05K1/185 , H05K3/4611 , H05K2201/09309 , H05K2201/10636 , Y02P70/611 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling capacitors are further provided with the assembly. Additional layers are provided above and below the assembly.
摘要翻译：电路板包括具有第一和第二功率参考平面层的组件，以及在第一和第二功率参考平面层之间的绝缘体层。离散去耦电容器还具有组件。在组件的上方和下方提供附加层。

5. 发明授权

US07196906B1 Circuit board having segments with different signal speed characteristics 有权
标题翻译：具有不同信号速度特性的电路板
公开(公告)号：US07196906B1
公开(公告)日：2007-03-27
申请号：US10641476
申请日：2003-08-15
申请人： Arthur R. Alexander , James L. Knighten , Jun Fan , Norman W. Smith
发明人： Arthur R. Alexander , James L. Knighten , Jun Fan , Norman W. Smith
IPC分类号： H05K7/02
CPC分类号： H05K1/186 , H05K1/024 , H05K3/429 , H05K3/4623 , H05K3/4688 , H05K2201/09536 , H05K2201/09718 , H05K2203/061
摘要： A circuit board includes multiple segments, with a first segment having plural signal layers and a second segment having plural signal layers. Signal paths provided by signal layers of the first segment exhibit higher speed signal transmission capability than signal paths provided by the signal layers of the second segment.
摘要翻译：电路板包括多个段，具有多个信号层的第一段和具有多个信号层的第二段。由第一段的信号层提供的信号路径显示比由第二段的信号层提供的信号路径更高的速度信号传输能力。

6. 发明授权

US07045719B1 Enhancing signal path characteristics in a circuit board 有权
标题翻译：增强电路板中的信号路径特性
公开(公告)号：US07045719B1
公开(公告)日：2006-05-16
申请号：US10274573
申请日：2002-10-21
申请人： Arthur R. Alexander , James L. Knighten , Jun Fan
发明人： Arthur R. Alexander , James L. Knighten , Jun Fan
IPC分类号： H01R12/04
CPC分类号： H05K1/0251 , H05K1/0298 , H05K1/116 , H05K1/185 , H05K3/429 , H05K2201/09327 , H05K2201/09718 , Y10T29/49165
摘要： A circuit board includes multiple signal layers, in which signal lines are routed, and power reference plane layers, in which power reference planes (e.g., power supply voltage or ground) are provided. Vias are passed through at least one signal layer and at least one power reference plane layer, or alternatively, vias are passed through at least two power reference plane layers. In one arrangement, a first clearance is defined around the via at the signal layer and a second clearance is defined around the via at the power reference plane layer. The second clearance is larger in size than the first clearance to match or tailor the impedance of the via as closely as possible with the impedance of the signal line that the via is electrically connected to. In another arrangement, clearances around vias at different power reference plane layers are selected to have different sizes to enhance the ability of one of the power reference plane layers (the one with a smaller clearance size) to carry a higher current level.
摘要翻译：电路板包括其中信号线路由的多个信号层和功率参考平面层，其中提供功率参考平面（例如，电源电压或地）。通孔通过至少一个信号层和至少一个功率参考平面层，或者替代地，通孔穿过至少两个功率参考平面层。在一种布置中，在信号层周围围绕通孔限定第一间隙，并且在功率参考平面层周围的通孔周围限定第二间隙。第二间隙的尺寸大于第一间隙，以便匹配或调整通孔的阻抗尽可能接近通孔电连接到的信号线的阻抗。在另一种布置中，选择不同功率参考平面层上的通孔周围的间隙以具有不同的尺寸以增强功率参考平面层（具有较小的间隙尺寸的一个）之一的能力承载更高的电流水平。

7. 发明授权

US07271348B1 Providing decoupling capacitors in a circuit board 有权
标题翻译：在电路板中提供去耦电容
公开(公告)号：US07271348B1
公开(公告)日：2007-09-18
申请号：US10670829
申请日：2003-09-25
申请人： Jun Fan , Arthur R. Alexander , Norman W. Smith , James L. Knighten
发明人： Jun Fan , Arthur R. Alexander , Norman W. Smith , James L. Knighten
IPC分类号： H05K1/16
CPC分类号： H05K1/0231 , H05K1/185 , H05K3/4611 , H05K2201/09309 , H05K2201/10636 , Y02P70/611 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board includes first and second reference plane layers. A first decoupling capacitor is mounted to a surface of the first reference plane layer, and a second decoupling capacitor is mounted to a surface of the second reference plane layer. Vias extend generally along a first direction through the circuit board. The first and second decoupling capacitors are aligned generally along the first direction to increase an amount of space through which the vias are extendable.
摘要翻译：电路板包括第一和第二参考平面层。第一去耦电容器安装到第一参考平面层的表面，并且第二去耦电容器被安装到第二参考平面层的表面。通孔沿着第一方向大致延伸穿过电路板。第一和第二去耦电容器大致沿着第一方向排列，以增加通孔可扩展的空间量。

8. 发明授权

US07626828B1 Providing a resistive element between reference plane layers in a circuit board 有权
标题翻译：在电路板中的参考平面层之间提供电阻元件
公开(公告)号：US07626828B1
公开(公告)日：2009-12-01
申请号：US10630886
申请日：2003-07-30
申请人： Arthur R. Alexander , Jun Fan , James L. Knighten , Norman W. Smith
发明人： Arthur R. Alexander , Jun Fan , James L. Knighten , Norman W. Smith
IPC分类号： H05K1/18
CPC分类号： H05K1/0234 , H05K1/0231 , H05K1/167 , H05K1/185 , H05K2201/09309 , H05K2201/10022 , H05K2201/1053
摘要： A circuit board includes reference plane layers and a dielectric between the reference plane layers. A resistive element is also provided between the reference plane layers to provide a resistive path between the reference plane layers. Optimally, a decoupling capacitor is provided having a first electrode electrically connected to the resistive element, and a second electrode electrically connected to one of the reference plane layers.
摘要翻译：电路板包括参考平面层和参考平面层之间的电介质。在参考平面层之间还提供电阻元件以提供参考平面层之间的电阻路径。最佳地，提供了具有电连接到电阻元件的第一电极和电连接到参考平面层之一的第二电极的去耦电容器。

9. 发明授权

US07791896B1 Providing an embedded capacitor in a circuit board 有权
标题翻译：在电路板中提供嵌入式电容器
公开(公告)号：US07791896B1
公开(公告)日：2010-09-07
申请号：US11820570
申请日：2007-06-20
申请人： Jun Fan , James L. Knighten , Norman W. Smith
发明人： Jun Fan , James L. Knighten , Norman W. Smith
IPC分类号： H05K1/16
CPC分类号： H05K1/0231 , H05K1/185 , H05K2201/09309 , H05K2201/10636 , H05K2201/10643 , Y02P70/611
摘要： A circuit board includes power reference layers and a capacitor provided between the power reference layers such that a shorter dimension of the capacitor defines a space between the power reference layers. The capacitor has plural conductive plates and plural dielectric layers.
摘要翻译：电路板包括功率参考层和设置在功率参考层之间的电容器，使得电容器的较短尺寸限定功率参考层之间的空间。电容器具有多个导电板和多个电介质层。

10. 发明授权

US07435912B1 Tailoring via impedance on a circuit board 失效
标题翻译：通过电路板上的阻抗进行裁剪
公开(公告)号：US07435912B1
公开(公告)日：2008-10-14
申请号：US10145436
申请日：2002-05-14
申请人： Arthur R. Alexander , James L. Knighten , Jun Fan
发明人： Arthur R. Alexander , James L. Knighten , Jun Fan
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K1/0251 , H05K1/0298 , H05K1/116 , H05K1/185 , H05K3/429 , H05K2201/09327 , H05K2201/09718 , Y10T29/49165
摘要： A circuit board includes multiple signal layers, in which signal lines are routed, and reference plane layers, in which power reference planes are provided. To connect signal lines at different signal layers, vias are passed through at least one signal layer and at least one reference plane layer. At the one signal layer, a first clearance (or anti-pad) is defined around the via. At the reference plane layer, a second clearance is defined around the via. The second clearance is larger in size than the first clearance to match the impedance of the via as closely as possible with the impedance of a signal line the via is electrically connected to.
摘要翻译：电路板包括信号线路由的多个信号层以及提供功率参考平面的参考平面层。为了在不同的信号层连接信号线，通孔通过至少一个信号层和至少一个参考平面层。在一个信号层处，围绕通孔限定第一间隙（或抗焊盘）。在参考平面层，围绕通孔限定第二间隙。第二间隙的尺寸大于第一间隙，以使通孔的阻抗尽可能接近通孔电连接到的信号线的阻抗。

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