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1. 发明申请

US20120127579A1 Protecting An Optical Surface 有权
标题翻译：保护光学表面
公开(公告)号：US20120127579A1
公开(公告)日：2012-05-24
申请号：US13300947
申请日：2011-11-21
申请人： Stephen H. Black , Thomas A. Kocian , Buu Q. Diep
发明人： Stephen H. Black , Thomas A. Kocian , Buu Q. Diep
IPC分类号： G02B1/11 , B32B37/14
CPC分类号： G02B1/11 , G02B1/105 , G02B1/14 , Y10T156/10
摘要： According to one embodiment, a method includes receiving a light beam at an anti-reflective layer of optically transmissive material. The anti-reflective layer has an outer surface disposed within a recess of a protective layer of optically transmissive material, such that the outer surface is protected by the recess and the protective layer from being contacted. The outer surface is further disposed along an optical path of an optical device disposed inwardly from the outer surface. The anti-reflective layer has an average cross-sectional thickness that is less than an average cross-sectional thickness of the protective layer. The method further includes modulating the light beam using the anti-reflective layer.
摘要翻译：根据一个实施例，一种方法包括在光学透射材料的抗反射层处接收光束。抗反射层具有设置在光学透射材料的保护层的凹部内的外表面，使得外表面被凹部保护并且保护层不被接触。外表面还沿着从外表面向内设置的光学装置的光路进一步设置。抗反射层的平均截面厚度小于保护层的平均截面厚度。该方法还包括使用抗反射层调制光束。

2. 发明授权

US09022584B2 Protecting an optical surface 有权
标题翻译：保护光学表面
公开(公告)号：US09022584B2
公开(公告)日：2015-05-05
申请号：US13300947
申请日：2011-11-21
申请人： Stephen H. Black , Thomas A. Kocian , Buu Q. Diep
发明人： Stephen H. Black , Thomas A. Kocian , Buu Q. Diep
IPC分类号： G02B27/00 , G02B1/11 , G02B1/10
CPC分类号： G02B1/11 , G02B1/105 , G02B1/14 , Y10T156/10
摘要： According to one embodiment, a method includes receiving a light beam at an anti-reflective layer of optically transmissive material. The anti-reflective layer has an outer surface disposed within a recess of a protective layer of optically transmissive material, such that the outer surface is protected by the recess and the protective layer from being contacted. The outer surface is further disposed along an optical path of an optical device disposed inwardly from the outer surface. The anti-reflective layer has an average cross-sectional thickness that is less than an average cross-sectional thickness of the protective layer. The method further includes modulating the light beam using the anti-reflective layer.
摘要翻译：根据一个实施例，一种方法包括在光学透射材料的抗反射层处接收光束。抗反射层具有设置在光学透射材料的保护层的凹部内的外表面，使得外表面被凹部保护并且保护层不被接触。外表面还沿着从外表面向内设置的光学装置的光路进一步设置。抗反射层的平均截面厚度小于保护层的平均截面厚度。该方法还包括使用抗反射层调制光束。

3. 发明申请

US20120096813A1 Incident Radiation Detector Packaging 有权
标题翻译：事件辐射检测仪包装
公开(公告)号：US20120096813A1
公开(公告)日：2012-04-26
申请号：US13275635
申请日：2011-10-18
申请人： Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Buu Diep
发明人： Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Buu Diep
IPC分类号： B65B3/02
CPC分类号： H01L27/14618 , B81B7/0077 , G01J5/045 , H01L23/10 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L27/14683 , H01L2224/04026 , H01L2224/05073 , H01L2224/05082 , H01L2224/05155 , H01L2224/05166 , H01L2224/05187 , H01L2224/05563 , H01L2224/05582 , H01L2224/05644 , H01L2224/05669 , H01L2224/29011 , H01L2224/29013 , H01L2224/291 , H01L2224/29144 , H01L2224/32225 , H01L2224/83815 , H01L2224/94 , H01L2924/0002 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/01074 , H01L2924/04941 , H01L2924/05341 , H01L2924/014 , H01L2224/83 , H01L2924/0105
摘要： In accordance with particular embodiments, a method for packaging an incident radiation detector includes depositing an opaque solder resistant material on a first surface of a transparent lid substrate configured to cover at least one detector. The method also includes forming at least one cavity in the lid substrate. The method further includes forming a first portion of at least one hermetic seal ring on the opaque solder resistant material. The first portion of each hermetic seal ring surrounds a perimeter of a corresponding cavity in the lid substrate. The method also includes aligning the first portion of the at least one hermetic seal ring with a second portion of the at least one hermetic seal ring. The method additionally includes bonding the first portion of the at least one hermetic seal ring with the second portion of the at least one hermetic seal ring with solder.
摘要翻译：根据具体实施例，一种用于封装入射辐射检测器的方法包括在透明盖基板的第一表面上沉积不透明的阻焊材料，该第一表面被构造成覆盖至少一个检测器。该方法还包括在盖基板中形成至少一个空腔。该方法还包括在不透明的耐焊材料上形成至少一个密封环的第一部分。每个气密密封环的第一部分围绕盖衬底中的相应空腔的周边。该方法还包括将至少一个密封环的第一部分与至少一个密封环的第二部分对准。该方法还包括用焊料将至少一个气密密封环的第一部分与至少一个密封环的第二部分接合。

4. 发明授权

US08608894B2 Wafer level packaged focal plane array 有权
标题翻译：晶圆级封装焦平面阵列
公开(公告)号：US08608894B2
公开(公告)日：2013-12-17
申请号：US13298955
申请日：2011-11-17
申请人： Stephen H. Black , Thomas A. Kocian
发明人： Stephen H. Black , Thomas A. Kocian
IPC分类号： G01J1/04
CPC分类号： H01L27/14683 , H01L27/14618 , H01L27/14649 , H01L2924/0002 , H01L2924/00
摘要： A method for manufacturing a wafer level packaged focal plane array, in accordance with certain embodiments, includes forming a detector wafer, which may include forming detector arrays and read-out circuits. The method may also include forming a lid wafer. Forming the lid wafer may include polishing a surface of a magnetically confined Czochralski (MCZ) wafer, bonding a Czochralski wafer to the MCZ wafer, and forming pockets in the Czochralski wafer. Each pocked may expose a portion of the polished surface of the MCZ wafer. The method may further include bonding the lid wafer and the detector wafer together such that the each detector array and read-out circuit are sealed within a different pocket, thereby forming a plurality of wafer level packaged focal plane arrays. The method may additionally include separating at least one wafer level packaged focal plan array from the plurality of wafer level packaged focal plane arrays.
摘要翻译：根据某些实施例的用于制造晶片级封装焦平面阵列的方法包括形成检测器晶片，其可以包括形成检测器阵列和读出电路。该方法还可以包括形成盖子晶片。形成盖晶片可以包括抛光限磁切克劳斯基（MCZ）晶片的表面，将切克劳斯基晶片结合到MCZ晶片，以及在切克劳斯基晶片中形成凹坑。每一个可能会暴露MCZ晶片抛光表面的一部分。该方法还可以包括将盖晶片和检测器晶片结合在一起，使得每个检测器阵列和读出电路被密封在不同的口袋内，由此形成多个晶片级封装的焦平面阵列。该方法可以另外包括从多个晶片级封装焦平面阵列分离至少一个晶片级封装焦点平面图阵列。

5. 发明授权

US08809784B2 Incident radiation detector packaging 有权
标题翻译：入射辐射探测器包装
公开(公告)号：US08809784B2
公开(公告)日：2014-08-19
申请号：US13275635
申请日：2011-10-18
申请人： Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Buu Diep
发明人： Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Buu Diep
IPC分类号： G01J5/00 , G01J5/04 , H01L27/146 , H01L23/10 , B81B7/00
CPC分类号： H01L27/14618 , B81B7/0077 , G01J5/045 , H01L23/10 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L27/14683 , H01L2224/04026 , H01L2224/05073 , H01L2224/05082 , H01L2224/05155 , H01L2224/05166 , H01L2224/05187 , H01L2224/05563 , H01L2224/05582 , H01L2224/05644 , H01L2224/05669 , H01L2224/29011 , H01L2224/29013 , H01L2224/291 , H01L2224/29144 , H01L2224/32225 , H01L2224/83815 , H01L2224/94 , H01L2924/0002 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/01074 , H01L2924/04941 , H01L2924/05341 , H01L2924/014 , H01L2224/83 , H01L2924/0105
摘要： In accordance with particular embodiments, a method for packaging an incident radiation detector includes depositing an opaque solder resistant material on a first surface of a transparent lid substrate configured to cover at least one detector. The method also includes forming at least one cavity in the lid substrate. The method further includes forming a first portion of at least one hermetic seal ring on the opaque solder resistant material. The first portion of each hermetic seal ring surrounds a perimeter of a corresponding cavity in the lid substrate. The method also includes aligning the first portion of the at least one hermetic seal ring with a second portion of the at least one hermetic seal ring. The method additionally includes bonding the first portion of the at least one hermetic seal ring with the second portion of the at least one hermetic seal ring with solder.
摘要翻译：根据具体实施例，一种用于封装入射辐射检测器的方法包括在透明盖基板的第一表面上沉积不透明的阻焊材料，该第一表面被构造成覆盖至少一个检测器。该方法还包括在盖基板中形成至少一个空腔。该方法还包括在不透明的耐焊材料上形成至少一个密封环的第一部分。每个气密密封环的第一部分围绕盖衬底中的相应空腔的周边。该方法还包括将至少一个密封环的第一部分与至少一个密封环的第二部分对准。该方法还包括用焊料将至少一个气密密封环的第一部分与至少一个密封环的第二部分接合。

6. 发明申请

US20120139072A1 Wafer Level Packaged Focal Plane Array 有权
标题翻译：晶圆级封装焦平面阵列
公开(公告)号：US20120139072A1
公开(公告)日：2012-06-07
申请号：US13298955
申请日：2011-11-17
申请人： Stephen H. Black , Thomas A. Kocian
发明人： Stephen H. Black , Thomas A. Kocian
IPC分类号： H01L31/02 , H01L31/0232
CPC分类号： H01L27/14683 , H01L27/14618 , H01L27/14649 , H01L2924/0002 , H01L2924/00
摘要： A method for manufacturing a wafer level packaged focal plane array, in accordance with certain embodiments, includes forming a detector wafer, which may include forming detector arrays and read-out circuits. The method may also include forming a lid wafer. Forming the lid wafer may include polishing a surface of a magnetically confined Czochralski (MCZ) wafer, bonding a Czochralski wafer to the MCZ wafer, and forming pockets in the Czochralski wafer. Each pocked may expose a portion of the polished surface of the MCZ wafer. The method may further include bonding the lid wafer and the detector wafer together such that the each detector array and read-out circuit are sealed within a different pocket, thereby forming a plurality of wafer level packaged focal plane arrays. The method may additionally include separating at least one wafer level packaged focal plan array from the plurality of wafer level packaged focal plane arrays.
摘要翻译：根据某些实施例的用于制造晶片级封装焦平面阵列的方法包括形成检测器晶片，其可以包括形成检测器阵列和读出电路。该方法还可以包括形成盖子晶片。形成盖晶片可以包括抛光限磁切克劳斯基（MCZ）晶片的表面，将切克劳斯基晶片结合到MCZ晶片，以及在切克劳斯基晶片中形成凹坑。每一个可能会暴露MCZ晶片抛光表面的一部分。该方法还可以包括将盖晶片和检测器晶片结合在一起，使得每个检测器阵列和读出电路被密封在不同的口袋内，由此形成多个晶片级封装的焦平面阵列。该方法可以另外包括从多个晶片级封装焦平面阵列分离至少一个晶片级封装焦点平面图阵列。

7. 发明授权

US06762868B2 Electro-optical package with drop-in aperture 有权
标题翻译：电光封装带有光圈
公开(公告)号：US06762868B2
公开(公告)日：2004-07-13
申请号：US09990952
申请日：2001-11-09
申请人： Jwei Wien Liu , Thomas A. Kocian
发明人： Jwei Wien Liu , Thomas A. Kocian
IPC分类号： G02B2600
CPC分类号： B81B7/0067 , H01L23/552 , H01L2924/0002 , H01L2924/00
摘要： A drop-in aperture 20, which improves the performance and lowers the cost of electro-optical SLM packages. The disclosed package provides a separate metal light shield (aperture) 20 and antireflective coated cover 33, and positions the aperture 20 inside the package 40 in close proximity to the SLM's 41 surface. This approach further uses an on-chip SLM light shield to define the projected screen border, thereby making the edge definition of the metal drop-in aperture less critical. Therefore, the cover can be mounted well away from the plane of the SLM, which relaxes the defect requirements of the cover and lowers the cost of the overall package. The package of this invention improves the performance and lifetime and lowers the cost of projection display systems.
摘要翻译：插入孔20，其提高了性能并降低了电光SLM封装的成本。所公开的封装提供单独的金属光屏蔽（孔）20和防反射涂层盖33，并且将孔20定位在封装40内靠近SLM的41表面。该方法还使用片上SLM光罩来定义投影屏幕边界，从而使得金属入射孔的边缘定义不太关键。因此，盖可以远离SLM的平面安装，这放宽了盖的缺陷要求并降低了整体封装的成本。本发明的封装提高了性能和使用寿命并降低了投影显示系统的成本。

8. 发明授权

US5550398A Hermetic packaging with optical 失效
标题翻译：光学封装
公开(公告)号：US5550398A
公开(公告)日：1996-08-27
申请号：US489244
申请日：1995-06-12
申请人： Thomas A. Kocian , Doug Darrow
发明人： Thomas A. Kocian , Doug Darrow
IPC分类号： H01L31/0203
CPC分类号： H01L31/0203
摘要： The invention is to a semiconductor package and method of making in which an optical glass window (23) is secured to a housing (20) at a low temperature. The optical glass (23) is etched and a metal layer (26) is formed on the etched surface. The metal layer is sealed to a metal frame (21) and the frame is sealed to a housing (20), or the deposited metal layer (26) is sealed directly to the housing (20).
摘要翻译：本发明涉及半导体封装和制造方法，其中光学玻璃窗（23）在低温下被固定到壳体（20）。蚀刻光学玻璃（23），在被蚀刻的表面上形成金属层（26）。金属层被密封到金属框架（21）并且框架被密封到壳体（20），或者沉积的金属层（26）被直接密封到壳体（20）。

9. 发明授权

US07226810B2 MEMS device wafer-level package 有权
标题翻译： MEMS器件晶圆级封装
公开(公告)号：US07226810B2
公开(公告)日：2007-06-05
申请号：US11157024
申请日：2005-06-20
申请人： Thomas A. Kocian , Richard L. Knipe , Mark H. Strumpell
发明人： Thomas A. Kocian , Richard L. Knipe , Mark H. Strumpell
IPC分类号： H01L21/50 , H01L21/46
CPC分类号： B81C99/004 , B81C99/0065 , B81C2203/0109 , G02B26/0833 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/01019 , H01L2924/09701 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.
摘要翻译：通过目视检查和/或电气测试来检查具有多个管芯的半导体晶片的方法和系统。如果晶片上的某些管芯通过检查，那么在它们仍然是晶片的一部分的同时，将窗口安装或固定在那些特定的金属模上。

10. 发明授权

US06908791B2 MEMS device wafer-level package 有权
标题翻译： MEMS器件晶圆级封装
公开(公告)号：US06908791B2
公开(公告)日：2005-06-21
申请号：US10135559
申请日：2002-04-29
申请人： Thomas A. Kocian , Richard L. Knipe , Mark H. Strumpell
发明人： Thomas A. Kocian , Richard L. Knipe , Mark H. Strumpell
IPC分类号： B81C99/00 , H01L21/48 , H01L21/50
CPC分类号： B81C99/004 , B81C99/0065 , B81C2203/0109 , G02B26/0833 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/01019 , H01L2924/09701 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.
摘要翻译：通过目视检查和/或电气测试检查具有多个管芯的半导体晶片的方法和系统。如果晶片上的某些管芯通过检查，那么在它们仍然是晶片的一部分的同时，将窗口安装或固定在那些特定的金属模上。

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