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    • 1. 发明申请
    • CHEMICAL MECHANICAL POLISHING SYSTEM
    • 化学机械抛光系统
    • US20110269378A1
    • 2011-11-03
    • US13095404
    • 2011-04-27
    • Jae Phil BooDong Soo KimKeon Sik SeoChan Woon JeonJun Ho BanJa Cheul Goo
    • Jae Phil BooDong Soo KimKeon Sik SeoChan Woon JeonJun Ho BanJa Cheul Goo
    • B24B37/04B24B1/00
    • B24B37/345B24B37/30
    • The invention relates to a chemical mechanical polishing system, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, whereby even though the substrate carrier unit is moved to consecutively polish the substrate on the plural polishing platens, it substantially removes a phenomenon of the twisting of air pressure supply tubes due to the movement of the substrate carrier unit.
    • 本发明涉及一种化学机械抛光系统,包括:至少一个抛光盘,其可旋转地安装有安装在其上表面上的压板; 沿预定路径设置的导轨; 衬底载体单元,其包括旋转接头,用于在抛光过程中向基板施加压力,所述衬底载体单元沿着所述导轨移动并加载所述衬底; 以及对接单元,其安装成对接到基板载体单元,以便当基板载体单元位于抛光平台上时,向压缩由基板承载单元保持的基板向下挤压的旋转接头提供空气压力,由此即使 衬底载体单元移动以连续地抛光多个抛光平板上的衬底,基本上消除了由于衬底载体单元的运动引起的空气压力供应管的扭转现象。
    • 2. 发明授权
    • Chemical mechanical polishing system
    • 化学机械抛光系统
    • US08882563B2
    • 2014-11-11
    • US13095404
    • 2011-04-27
    • Jae Phil BooDong Soo KimKeon Sik SeoChan Woon JeonJun Ho BanJa Cheul Goo
    • Jae Phil BooDong Soo KimKeon Sik SeoChan Woon JeonJun Ho BanJa Cheul Goo
    • B24B49/00B24B5/00B24B37/30B24B37/34
    • B24B37/345B24B37/30
    • The invention relates to a chemical mechanical polishing system, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, whereby even though the substrate carrier unit is moved to consecutively polish the substrate on the plural polishing platens, it substantially removes a phenomenon of the twisting of air pressure supply tubes due to the movement of the substrate carrier unit.
    • 本发明涉及一种化学机械抛光系统,包括:至少一个抛光盘,其可旋转地安装有安装在其上表面上的压板; 沿预定路径设置的导轨; 衬底载体单元,其包括旋转接头,用于在抛光过程中向基板施加压力,所述衬底载体单元沿着所述导轨移动并加载所述衬底; 以及对接单元,其安装成对接到基板载体单元,以便当基板载体单元位于抛光平台上时,向压缩由基板承载单元保持的基板向下挤压的旋转接头提供空气压力,由此即使 衬底载体单元移动以连续地抛光多个抛光平板上的衬底,基本上消除了由于衬底载体单元的运动引起的空气压力供应管的扭转现象。