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1. 发明授权

US08882563B2 Chemical mechanical polishing system 有权
标题翻译：化学机械抛光系统
公开(公告)号：US08882563B2
公开(公告)日：2014-11-11
申请号：US13095404
申请日：2011-04-27
申请人： Jae Phil Boo , Dong Soo Kim , Keon Sik Seo , Chan Woon Jeon , Jun Ho Ban , Ja Cheul Goo
发明人： Jae Phil Boo , Dong Soo Kim , Keon Sik Seo , Chan Woon Jeon , Jun Ho Ban , Ja Cheul Goo
IPC分类号： B24B49/00 , B24B5/00 , B24B37/30 , B24B37/34
CPC分类号： B24B37/345 , B24B37/30
摘要： The invention relates to a chemical mechanical polishing system, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, whereby even though the substrate carrier unit is moved to consecutively polish the substrate on the plural polishing platens, it substantially removes a phenomenon of the twisting of air pressure supply tubes due to the movement of the substrate carrier unit.
摘要翻译：本发明涉及一种化学机械抛光系统，包括：至少一个抛光盘，其可旋转地安装有安装在其上表面上的压板; 沿预定路径设置的导轨; 衬底载体单元，其包括旋转接头，用于在抛光过程中向基板施加压力，所述衬底载体单元沿着所述导轨移动并加载所述衬底; 以及对接单元，其安装成对接到基板载体单元，以便当基板载体单元位于抛光平台上时，向压缩由基板承载单元保持的基板向下挤压的旋转接头提供空气压力，由此即使衬底载体单元移动以连续地抛光多个抛光平板上的衬底，基本上消除了由于衬底载体单元的运动引起的空气压力供应管的扭转现象。

2. 发明授权

US08662956B2 Conditioner of chemical mechanical polishing apparatus 有权
标题翻译：化学机械抛光装置的护发素
公开(公告)号：US08662956B2
公开(公告)日：2014-03-04
申请号：US13099401
申请日：2011-05-03
申请人： Keon Sik Seo , Jae Phil Boo , Dong Soo Kim , Ja Cheul Goo , Chan Woon Jeon , Jnn Ho Ban
发明人： Keon Sik Seo , Jae Phil Boo , Dong Soo Kim , Ja Cheul Goo , Chan Woon Jeon , Jnn Ho Ban
IPC分类号： B24B53/00 , B24B1/00
CPC分类号： B24B53/017 , B24B49/16
摘要： Provided are a conditioner of a chemical mechanical polishing apparatus for polishing a substrate over a platen pad that rotates and a method thereof. The conditioner includes a disk holder, a piston rod, a housing, and a load sensor. The disk holder secures a conditioning disk that finely cuts a surface of the platen pad. The piston rod delivers a normal force to the disk holder. The housing covers at least a portion of the piston rod. The load sensor is installed to receive the normal force that the piston rod delivers to the piston rod and measuring the normal force.
摘要翻译：提供一种用于在旋转的压板上抛光基板的化学机械抛光装置的调节器及其方法。调节器包括盘保持器，活塞杆，壳体和负载传感器。盘保持器固定调节盘，该调节盘精细地切割压板垫的表面。活塞杆向盘保持器施加法向力。壳体覆盖活塞杆的至少一部分。安装负载传感器以接收活塞杆传递到活塞杆并测量法向力的法向力。

3. 发明授权

US08597081B2 Chemical mechanical polishing apparatus having pad conditioning disk and pre-conditioner unit 有权
标题翻译：化学机械抛光装置具有衬垫调节盘和预调节单元
公开(公告)号：US08597081B2
公开(公告)日：2013-12-03
申请号：US13241421
申请日：2011-09-23
申请人： Jae-Kwang Choi , Hong-Jin Kim , Keon-Sik Seo , Sol Han , Kun-Tack Lee , Byoung-Ho Kwon
发明人： Jae-Kwang Choi , Hong-Jin Kim , Keon-Sik Seo , Sol Han , Kun-Tack Lee , Byoung-Ho Kwon
IPC分类号： B24B1/00
CPC分类号： B24B53/017
摘要： A pad conditioning disk, a pre-conditioning unit, and a CMP apparatus having the same are provided. The pad conditioning disk includes a base in which mountain-type tips and valley-type grooves are repeatedly connected to each other, and a cutting layer formed on the base layer. The cutting layer including conditioning particles deposited on surfaces of the tips and grooves. A surfaces roughness of conditioning particles deposited on the surfaces of the tips is less than a surface roughness of conditioning particles deposited on the surfaces of the grooves.
摘要翻译：提供了衬垫调节盘，预调节单元和具有该调节盘的CMP设备。垫调节盘包括其中山型尖端和谷型沟槽彼此重复连接的基底和形成在基底层上的切割层。切割层包括沉积在尖端和凹槽表面上的调节颗粒。沉积在尖端表面上的调理颗粒的表面粗糙度小于沉积在凹槽表面上的调理颗粒的表面粗糙度。

4. 发明申请

US20050153557A1 Apparatus and method for treating susbtrates 有权
标题翻译：用于治疗感染的装置和方法
公开(公告)号：US20050153557A1
公开(公告)日：2005-07-14
申请号：US11036865
申请日：2005-01-13
申请人： Chan-Woo Cho , Jae-Phil Boo , Myung-Seok Kim , Jong-Muk Kang , Ik-Joo Kim , Jung-Hwan Sung , Ki-Hong Jung , Keon-Sik Seo
发明人： Chan-Woo Cho , Jae-Phil Boo , Myung-Seok Kim , Jong-Muk Kang , Ik-Joo Kim , Jung-Hwan Sung , Ki-Hong Jung , Keon-Sik Seo
IPC分类号： B24B37/013 , B24B37/04 , B24B49/03 , H01L21/304 , H01L21/306 , H01L21/302 , H01L21/461
CPC分类号： B24B49/03 , B24B37/013 , B24B37/042
摘要： The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and more particularly to a polishing apparatus having a workpiece transfer robot for transferring a workpiece from one operation to the next. The polishing apparatus according to the present invention comprises a polishing section including a top ring for holding a workpiece to be polished and a turntable having a polishing surface for polishing a surface of the workpiece held by the top ring; a cleaning section including a cleaning device for cleaning the workpiece that has been polished in the polishing section; and a workpiece transfer robot for transferring the workpiece to be polished to the polishing section or for transferring the workpiece that has been polished to the cleaning section. In this case, the workpiece transfer robot comprises a robot body; at least one arm operatively coupled to the robot body by at least one joint; a holder mechanism mounted on the arm for holding the workpiece; and a seal mechanism at the joint for preventing liquid from entering an interior of the joint, the seal mechanism
摘要翻译：本发明涉及一种用于将诸如半导体晶片的工件抛光到平面镜面抛光的抛光装置，更具体地涉及具有用于将工件从一个操作传送到下一个操作的工件传送机器人的抛光装置。根据本发明的抛光装置包括抛光部分，其包括用于保持待抛光工件的顶环和具有抛光表面的转台，用于抛光由顶环保持的工件的表面; 清洁部，其包括用于清洁在所述研磨部中被抛光的所述工件的清洁装置; 以及工件传送机器人，用于将要抛光的工件传送到抛光部分或用于将已抛光的工件传送到清洁部分。在这种情况下，工件传送机器人包括机器人主体; 至少一个臂通过至少一个接头可操作地联接到所述机器人主体; 安装在所述臂上用于保持所述工件的保持器机构; 和密封机构，用于防止液体进入接头的内部，密封机构

5. 发明申请

US20120083189A1 CHEMICAL MECHANICAL POLISHING APPARATUS HAVING PAD CONDITIONING DISK AND PRE-CONDITIONER UNIT 有权
标题翻译：化学机械抛光装置，具有调色盘和预调器单元
公开(公告)号：US20120083189A1
公开(公告)日：2012-04-05
申请号：US13241421
申请日：2011-09-23
申请人： Jae-Kwang Choi , Hong-Jin Kim , Keon-Sik Seo , Sol Han , Kun-Tack Lee , Byoung-Ho Kwon
发明人： Jae-Kwang Choi , Hong-Jin Kim , Keon-Sik Seo , Sol Han , Kun-Tack Lee , Byoung-Ho Kwon
IPC分类号： B24B1/00 , B24B57/00 , B24B41/06 , B24B55/00
CPC分类号： B24B53/017
摘要： A pad conditioning disk, a pre-conditioning unit, and a CMP apparatus having the same are provided. The pad conditioning disk includes a base in which mountain-type tips and valley-type grooves are repeatedly connected to each other, and a cutting layer formed on the base layer. The cutting layer including conditioning particles deposited on surfaces of the tips and grooves. A surfaces roughness of conditioning particles deposited on the surfaces of the tips is less than a surface roughness of conditioning particles deposited on the surfaces of the grooves.
摘要翻译：提供了衬垫调节盘，预调节单元和具有该调节盘的CMP设备。垫调节盘包括其中山型尖端和谷型沟槽彼此重复连接的基底和形成在基底层上的切割层。切割层包括沉积在尖端和凹槽表面上的调节颗粒。沉积在尖端表面上的调理颗粒的表面粗糙度小于沉积在凹槽表面上的调理颗粒的表面粗糙度。

6. 发明申请

US20110275289A1 CONDITIONER OF CHEMICAL MECHANICAL POLISHING APPARATUS 有权
标题翻译：化学机械抛光装置的调节剂
公开(公告)号：US20110275289A1
公开(公告)日：2011-11-10
申请号：US13099401
申请日：2011-05-03
申请人： Keon Sik SEO , Jae Phil BOO , Dong Soo KIM , Ja Cheul GOO , Chan Woon JEON , Jun Ho BAN
发明人： Keon Sik SEO , Jae Phil BOO , Dong Soo KIM , Ja Cheul GOO , Chan Woon JEON , Jun Ho BAN
IPC分类号： B24B53/00 , B24B1/00
CPC分类号： B24B53/017 , B24B49/16
摘要： Provided are a conditioner of a chemical mechanical polishing apparatus for polishing a substrate over a platen pad that rotates and a method thereof. The conditioner includes a disk holder, a piston rod, a housing, and a load sensor. The disk holder secures a conditioning disk that finely cuts a surface of the platen pad. The piston rod delivers a normal force to the disk holder. The housing covers at least a portion of the piston rod. The load sensor is installed to receive the normal force that the piston rod delivers to the piston rod and measuring the normal force.
摘要翻译：提供一种用于在旋转的压板上抛光基板的化学机械抛光装置的调节器及其方法。调节器包括盘保持器，活塞杆，壳体和负载传感器。盘保持器固定调节盘，该调节盘精细地切割压板垫的表面。活塞杆向盘保持器施加法向力。壳体覆盖活塞杆的至少一部分。安装负载传感器以接收活塞杆传递到活塞杆并测量法向力的法向力。

7. 发明申请

US20110269378A1 CHEMICAL MECHANICAL POLISHING SYSTEM 有权
标题翻译：化学机械抛光系统
公开(公告)号：US20110269378A1
公开(公告)日：2011-11-03
申请号：US13095404
申请日：2011-04-27
申请人： Jae Phil Boo , Dong Soo Kim , Keon Sik Seo , Chan Woon Jeon , Jun Ho Ban , Ja Cheul Goo
发明人： Jae Phil Boo , Dong Soo Kim , Keon Sik Seo , Chan Woon Jeon , Jun Ho Ban , Ja Cheul Goo
IPC分类号： B24B37/04 , B24B1/00
CPC分类号： B24B37/345 , B24B37/30
摘要： The invention relates to a chemical mechanical polishing system, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, whereby even though the substrate carrier unit is moved to consecutively polish the substrate on the plural polishing platens, it substantially removes a phenomenon of the twisting of air pressure supply tubes due to the movement of the substrate carrier unit.
摘要翻译：本发明涉及一种化学机械抛光系统，包括：至少一个抛光盘，其可旋转地安装有安装在其上表面上的压板; 沿预定路径设置的导轨; 衬底载体单元，其包括旋转接头，用于在抛光过程中向基板施加压力，所述衬底载体单元沿着所述导轨移动并加载所述衬底; 以及对接单元，其安装成对接到基板载体单元，以便当基板载体单元位于抛光平台上时，向压缩由基板承载单元保持的基板向下挤压的旋转接头提供空气压力，由此即使衬底载体单元移动以连续地抛光多个抛光平板上的衬底，基本上消除了由于衬底载体单元的运动引起的空气压力供应管的扭转现象。

8. 发明授权

US07196011B2 Apparatus and method for treating substrates 有权
标题翻译：用于处理底物的装置和方法
公开(公告)号：US07196011B2
公开(公告)日：2007-03-27
申请号：US11036865
申请日：2005-01-13
申请人： Chan-Woo Cho , Jae-Phil Boo , Myung-Seok Kim , Jong-Muk Kang , Ik-Joo Kim , Jung-Hwan Sung , Ki-Hong Jung , Keon-Sik Seo
发明人： Chan-Woo Cho , Jae-Phil Boo , Myung-Seok Kim , Jong-Muk Kang , Ik-Joo Kim , Jung-Hwan Sung , Ki-Hong Jung , Keon-Sik Seo
IPC分类号： H01L21/469
CPC分类号： B24B49/03 , B24B37/013 , B24B37/042
摘要： The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and more particularly to a polishing apparatus having a workpiece transfer robot for transferring a workpiece from one operation to the next.The polishing apparatus according to the present invention comprises a polishing section including a top ring for holding a workpiece to be polished and a turntable having a polishing surface for polishing a surface of the workpiece held by the top ring; a cleaning section including a cleaning device for cleaning the workpiece that has been polished in the polishing section; and a workpiece transfer robot for transferring the workpiece to be polished to the polishing section or for transferring the workpiece that has been polished to the cleaning section. In this case, the workpiece transfer robot comprises a robot body; at least one arm operatively coupled to the robot body by at least one joint; a holder mechanism mounted on the arm for holding the workpiece; and a seal mechanism at the joint for preventing liquid from entering an interior of the joint, the seal mechanism.
摘要翻译：本发明涉及一种用于将诸如半导体晶片的工件抛光到平面镜面抛光的抛光装置，更具体地涉及具有用于将工件从一个操作传送到下一个操作的工件传送机器人的抛光装置。

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