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1. 发明申请

US20120291709A1 ROTATING SUBSTRATE SUPPORT AND METHODS OF USE 审中-公开
标题翻译：旋转基板支持和使用方法
公开(公告)号：US20120291709A1
公开(公告)日：2012-11-22
申请号：US13559511
申请日：2012-07-26
申请人： Jacob Smith , ALEXANDER TAM , R. SURYANARAYANAN IYER , SEAN SEUTTER , BINH TRAN , NIR MERRY , ADAM BRAILOVE , ROBERT SHYDO, JR. , ROBERT ANDREWS , FRANK ROBERTS , THEODORE SMICK , GEOFFREY RYDING
发明人： Jacob Smith , ALEXANDER TAM , R. SURYANARAYANAN IYER , SEAN SEUTTER , BINH TRAN , NIR MERRY , ADAM BRAILOVE , ROBERT SHYDO, JR. , ROBERT ANDREWS , FRANK ROBERTS , THEODORE SMICK , GEOFFREY RYDING
IPC分类号： C23C14/50
CPC分类号： H01L21/68792 , C23C16/4584 , H01L21/67126 , H01L21/68742
摘要： A method and apparatus for processing a substrate utilizing a rotating substrate support are disclosed herein. In one embodiment, an apparatus for processing a substrate includes a chamber having a substrate support assembly disposed within the chamber. The substrate support assembly includes a substrate support having a support surface and a heater disposed beneath the support surface. A shaft is coupled to the substrate support and a motor is coupled to the shaft through a rotor to provide rotary movement to the substrate support. A seal block is disposed around the rotor and forms a seal therewith. The seal block has at least one seal and at least one channel disposed along the interface between the seal block and the shaft. A port is coupled to each channel for connecting to a pump. A lift mechanism is coupled to the shaft for raising and lowering the substrate support.
摘要翻译：本文公开了一种利用旋转衬底支撑件来处理衬底的方法和装置。在一个实施例中，用于处理衬底的装置包括具有设置在腔室内的衬底支撑组件的室。衬底支撑组件包括具有支撑表面的衬底支撑件和设置在支撑表面下方的加热器。轴联接到基板支撑件，并且电机通过转子联接到轴，以向基板支撑件提供旋转运动。密封块设置在转子周围并与其形成密封。密封块具有至少一个密封件和沿密封块和轴之间的界面设置的至少一个通道。端口连接到每个通道以连接到泵。升降机构联接到轴上以升高和降低基板支撑。

2. 发明申请

US20100317140A1 TECHNIQUES FOR FORMING THIN FILMS BY IMPLANTATION WITH REDUCED CHANNELING 有权
标题翻译：通过减少通道进行植入形成薄膜的技术
公开(公告)号：US20100317140A1
公开(公告)日：2010-12-16
申请号：US12778989
申请日：2010-05-12
申请人： ADAM BRAILOVE , Zuqin Liu , Francois J. Henley , Albert J. Lamm
发明人： ADAM BRAILOVE , Zuqin Liu , Francois J. Henley , Albert J. Lamm
IPC分类号： H01L21/263 , H01J37/08
CPC分类号： H01L31/0392 , H01L21/67213 , H01L21/76254 , H01L31/18 , Y02E10/50
摘要： Embodiments of the present invention relate to the use of a particle accelerator beam to form thin films of material from a bulk substrate. In particular embodiments, a bulk substrate having a top surface is exposed to a beam of accelerated particles. Then, a thin film of material is separated from the bulk substrate by performing a controlled cleaving process along a cleave region formed by particles implanted from the beam. To improve uniformity of depth of implantation, channeling effects are reduced by one or more techniques. In one technique, a miscut bulk substrate is subjected to the implantation, such that the lattice of the substrate is offset at an angle relative to the impinging particle beam. According to another technique, the substrate is tilted at an angle relative to the impinging particle beam. In still another technique, the substrate is subjected to a dithering motion during the implantation. These techniques may be employed alone or in combination.
摘要翻译：本发明的实施例涉及使用粒子加速器束从大量衬底形成材料薄膜。在具体的实施方案中，具有顶表面的本体衬底暴露于加速颗粒束。然后，通过沿着从光束注入的颗粒形成的切割区域进行受控的切割过程，将薄膜材料与本体基板分离。为了改善植入深度的均匀性，可以通过一种或多种技术降低沟道效应。在一种技术中，对杂散块体基板进行注入，使得基板的晶格相对于撞击的粒子束以一定角度偏移。根据另一种技术，衬底相对于撞击粒子束以一定角度倾斜。在另一种技术中，衬底在植入期间经历抖动运动。这些技术可以单独使用或组合使用。

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