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    • 5. 发明授权
    • Electrostatic discharge protection device
    • 静电放电保护装置
    • US07335954B2
    • 2008-02-26
    • US11110315
    • 2005-04-20
    • Jack L. GlennPedro E. Castillo-Borelly
    • Jack L. GlennPedro E. Castillo-Borelly
    • H01L23/62
    • H01L29/87H01L27/0262H01L29/0626H01L29/8611
    • An electrostatic discharge (ESD) protection device includes a first-type substrate, a second-type well formed in the substrate and a first-type well formed in the substrate. The second-type well includes a second-type+ region formed between first and second first-type+ regions. The first-type well is formed in the substrate adjacent a first side of the second-type well. The first-type well includes first and second first-type regions with a first-type+ region and a second-type+ region formed between the first and second first-type regions. The second-type+ region of the first-type well is formed between the first-type+ region of the first-type well and the second-type well.
    • 静电放电(ESD)保护装置包括第一型衬底,在衬底中形成的第二类阱和在衬底中形成的第一类阱。 第二类阱包括在第一和第二第一类型+区域之间形成的第二类型+区域。 第一类型的阱在与第二类型阱的第一侧相邻的衬底中形成。 第一类阱包括在第一和第二第一类型区域之间形成第一和第二第一类型的区域,其具有第一类型+区域和第二类型+区域。 第一型阱的第二型+区形成在第一型阱的第一型+区与第二型阱之间。
    • 6. 发明授权
    • Method and device for electrostatic discharge protection
    • 静电放电保护方法及装置
    • US07619262B2
    • 2009-11-17
    • US11600510
    • 2006-11-16
    • Jack L. GlennMark W. Gose
    • Jack L. GlennMark W. Gose
    • H01L29/76
    • H01L27/0262
    • Electrostatic discharge (ESD) protection is provided for an integrated circuit. In an aspect, a dynamic region having doped regions is formed on an epitaxy layer and substrate, and interconnects contact the dynamic region. In an aspect, the dynamic region operates as a back-to-back SCR that snaps back in both positive and negative voltage directions. In an aspect the dynamic region operates as an SCR that snaps back in a positive voltage direction and operates as a simple diode in a negative voltage direction. In another aspect, the dynamic region operates as an SCR that snaps back in a negative voltage direction and operates as a simple diode in a positive voltage direction. ESD protection over an adjustable and wide positive and negative voltage range is provided by varying widths and positioning of various doping regions. Breakdown voltages, critical voltages and critical currents are independently controlled.
    • 为集成电路提供静电放电(ESD)保护。 在一方面,具有掺杂区域的动态区域形成在外延层和衬底上,并且互连接触动态区域。 在一个方面,动态区域作为背靠背SCR在正电压和负电压方向上反弹地工作。 在一个方面,动态区域作为SCR在正电压方向上反弹并作为负电压方向上的简单二极管工作。 另一方面,动态区域作为SCR反向工作,并以正电压方向作为简单的二极管工作。 通过改变各种掺杂区域的宽度和定位来提供可调和宽的正负电压范围内的ESD保护。 击穿电压,临界电压和临界电流是独立控制的。
    • 8. 发明申请
    • Method and device for electrostatic discharge protection
    • 静电放电保护方法及装置
    • US20080116480A1
    • 2008-05-22
    • US11600510
    • 2006-11-16
    • Jack L. GlennMark W. Gose
    • Jack L. GlennMark W. Gose
    • H01L23/60H01L21/332
    • H01L27/0262
    • Electrostatic discharge (ESD) protection is provided for an integrated circuit. In an aspect, a dynamic region having doped regions is formed on an epitaxy layer and substrate, and interconnects contact the dynamic region. In an aspect, the dynamic region operates as a back-to-back SCR that snaps back in both positive and negative voltage directions. In an aspect the dynamic region operates as an SCR that snaps back in a positive voltage direction and operates as a simple diode in a negative voltage direction. In another aspect, the dynamic region operates as an SCR that snaps back in a negative voltage direction and operates as a simple diode in a positive voltage direction. ESD protection over an adjustable and wide positive and negative voltage range is provided by varying widths and positioning of various doping regions. Breakdown voltages, critical voltages and critical currents are independently controlled.
    • 为集成电路提供静电放电(ESD)保护。 在一方面,具有掺杂区域的动态区域形成在外延层和衬底上,并且互连接触动态区域。 在一个方面,动态区域作为背靠背SCR在正电压和负电压方向上反弹地工作。 在一个方面,动态区域作为SCR在正电压方向上反弹并作为负电压方向上的简单二极管工作。 另一方面,动态区域作为SCR反向工作,并以正电压方向作为简单的二极管工作。 通过改变各种掺杂区域的宽度和定位来提供可调和宽的正负电压范围内的ESD保护。 击穿电压,临界电压和临界电流是独立控制的。
    • 9. 发明授权
    • Method and apparatus for electrostatic discharge protection having a stable breakdown voltage and low snapback voltage
    • 具有稳定击穿电压和低回弹电压的静电放电保护方法和装置
    • US07601990B2
    • 2009-10-13
    • US11586412
    • 2006-10-25
    • Jack L. Glenn
    • Jack L. Glenn
    • H01L29/72
    • H01L27/0262H01L29/7436H01L2924/0002H01L2924/00
    • Electrostatic discharge (ESD) protection is provided for an integrated circuit. Snap back from a lower initial critical voltage and critical current is provided, as compared to contemporary designs. A dynamic region having doped regions is formed on a substrate, interconnects contacting the dynamic region. The dynamic region includes an Nwell region, a Pwell region and shallow diffusions, defining a PNP region, an NPN region and a voltage Breakdown region. In an aspect, the Nwell region includes a first N+ contact, a first P+ contact and an N+ doped enhancement, while the Pwell region includes a second N+ contact, a second P+ contact and a P+ doped enhancement. The N+ doped enhancement contacts the P+ doped enhancement forming the breakdown voltage region therebetween, in one case forming a buried breakdown voltage junction. Independent control is provided over breakdown voltage, NPN critical voltage, NPN critical current and PNP critical current, by varying doping levels, widths and positioning of various doping regions.
    • 为集成电路提供静电放电(ESD)保护。 与现代设计相比,提供了较低的初始临界电压和临界电流。 具有掺杂区域的动态区域形成在基板上,与动态区域接触。 动态区域包括Nwell区域,P阱区域和浅扩散,限定PNP区域,NPN区域和电压击穿区域。 在一方面,N阱区包括第一N +接触,第​​一P +接触和N +掺杂增强,而P阱区包括第二N +接触,第​​二P +接触和P +掺杂增强。 N +掺杂的增强接触形成其间的击穿电压区域的P +掺杂增强,在一种情况下形成掩埋击穿电压结。 通过改变各种掺杂区域的掺杂水平,宽度和定位,提供了击穿电压,NPN临界电压,NPN临界电流和PNP临界电流的独立控制。