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    • 1. 发明授权
    • Method of manufacturing an integrated heat spreader lid
    • 一体式散热器盖的制造方法
    • US07186585B2
    • 2007-03-06
    • US11147694
    • 2005-06-08
    • Jack BishDamon BrinkKevin Hanrahan
    • Jack BishDamon BrinkKevin Hanrahan
    • H01L21/44H01L21/48H01L21/50
    • H01L23/3675H01L23/10H01L2924/01079H01L2924/16152H01L2924/1616
    • A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery region and may comprise a number of slots cut partially or completely through the lid in a pattern surrounding or partially surrounding the center region. The strain isolation regions provide isolation of strain and relief of stress due to thermal expansion of the lid despite constraint at its periphery by the bonded lip, resulting in less thermally-induced warping of the center region, less thermally-induced stress on the bond between the lip and the substrate board, and/or less thermally-induced deflection of the substrate board. The reduced warping, stress, and/or deflection increases the reliability of the system by reducing the propensity for delamination or separation in the interface between the lid and the die, and/or by reducing the chance of structural failure in the bond between the lid and the substrate board.
    • 散热器盖包括具有用于结合到下面的基板,中心区域和一个或多个应变隔离区域的唇缘的外周区域。 应变隔离区域位于中心区域和外周边区域之间,并且可以包括以周围或部分围绕中心区域的图案部分地或完全地通过盖子切割的多个槽。 应变隔离区域提供了由于盖子的热膨胀而导致的应力分离和释放应力,尽管在其外围受到粘合的唇缘的约束,导致较少的热诱导的中心区域的翘曲,较少的热诱导的在 唇缘和衬底板,和/或较少的热诱导的衬底板的偏转。 减小的翘曲,应力和/或挠曲通过降低在盖和模具之间的界面中的分层或分离的倾向和/或通过减少盖子之间的结合的结构故障的机会来增加系统的可靠性 和基板。
    • 2. 发明授权
    • Integrated heat spreader lid
    • 集成散热器盖
    • US06906413B2
    • 2005-06-14
    • US10449940
    • 2003-05-30
    • Jack BishKevin HanrahanDamon Brink
    • Jack BishKevin HanrahanDamon Brink
    • H01L23/10H01L23/34
    • H01L23/3675H01L23/10H01L2924/01079H01L2924/16152H01L2924/1616
    • A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery region and may comprise a number of slots cut partially or completely through the lid in a pattern surrounding or partially surrounding the center region. The strain isolation regions provide isolation of strain and relief of stress due to thermal expansion of the lid despite constraint at its periphery by the bonded lip, resulting in less thermally-induced warping of the center region, less thermally-induced stress on the bond between the lip and the substrate board, and/or less thermally-induced deflection of the substrate board. The reduced warping, stress, and/or deflection increases the reliability of the system by reducing the propensity for delamination or separation in the interface between the lid and the die, and/or by reducing the chance of structural failure in the bond between the lid and the substrate board.
    • 散热器盖包括具有用于结合到下面的基板,中心区域和一个或多个应变隔离区域的唇缘的外周区域。 应变隔离区域位于中心区域和外周边区域之间,并且可以包括以周围或部分围绕中心区域的图案部分地或完全地通过盖子切割的多个槽。 应变隔离区域提供了由于盖子的热膨胀而导致的应力分离和释放应力,尽管在其外围受到粘合的唇缘的约束,导致较少的热诱导的中心区域的翘曲,较少的热诱导的在 唇缘和衬底板,和/或较少的热诱导的衬底板的偏转。 减小的翘曲,应力和/或挠曲通过降低在盖和模具之间的界面中的分层或分离的倾向和/或通过减少盖子之间的结合的结构故障的机会来增加系统的可靠性 和基板。
    • 3. 发明申请
    • Integrated heat spreader lid
    • 集成散热器盖
    • US20070152323A1
    • 2007-07-05
    • US11713869
    • 2007-03-05
    • Jack BishDamon BrinkKevin Hanrahan
    • Jack BishDamon BrinkKevin Hanrahan
    • H01L23/34
    • H01L23/3675H01L23/10H01L2924/01079H01L2924/16152H01L2924/1616
    • A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery region and may comprise a number of slots cut partially or completely through the lid in a pattern surrounding or partially surrounding the center region. The strain isolation regions provide isolation of strain and relief of stress due to thermal expansion of the lid despite constraint at its periphery by the bonded lip, resulting in less thermally-induced warping of the center region, less thermally-induced stress on the bond between the lip and the substrate board, and/or less thermally-induced deflection of the substrate board. The reduced warping, stress, and/or deflection increases the reliability of the system by reducing the propensity for delamination or separation in the interface between the lid and the die, and/or by reducing the chance of structural failure in the bond between the lid and the substrate board.
    • 散热器盖包括具有用于结合到下面的基板,中心区域和一个或多个应变隔离区域的唇缘的外周边区域。 应变隔离区域位于中心区域和外周边区域之间,并且可以包括以周围或部分围绕中心区域的图案部分地或完全地通过盖子切割的多个槽。 应变隔离区域提供了由于盖子的热膨胀而导致的应力分离和释放应力,尽管在其外围受到粘合的唇缘的约束,导致较少的热诱导的中心区域的翘曲,较少的热诱导的在 唇缘和衬底板,和/或较少的热诱导的衬底板的偏转。 减小的翘曲,应力和/或挠曲通过降低在盖和模具之间的界面中的分层或分离的倾向和/或通过减少盖子之间的结合的结构故障的机会来增加系统的可靠性 和基板。
    • 5. 发明授权
    • Integrated heat spreader lid
    • 集成散热器盖
    • US07518219B2
    • 2009-04-14
    • US11713869
    • 2007-03-05
    • Jack BishDamon BrinkKevin Hanrahan
    • Jack BishDamon BrinkKevin Hanrahan
    • H01L23/495
    • H01L23/3675H01L23/10H01L2924/01079H01L2924/16152H01L2924/1616
    • A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery region and may comprise a number of slots cut partially or completely through the lid in a pattern surrounding or partially surrounding the center region. The strain isolation regions provide isolation of strain and relief of stress due to thermal expansion of the lid despite constraint at its periphery by the bonded lip, resulting in less thermally-induced warping of the center region, less thermally-induced stress on the bond between the lip and the substrate board, and/or less thermally-induced deflection of the substrate board. The reduced warping, stress, and/or deflection increases the reliability of the system by reducing the propensity for delamination or separation in the interface between the lid and the die, and/or by reducing the chance of structural failure in the bond between the lid and the substrate board.
    • 散热器盖包括具有用于结合到下面的基板,中心区域和一个或多个应变隔离区域的唇缘的外周区域。 应变隔离区域位于中心区域和外周边区域之间,并且可以包括以周围或部分围绕中心区域的图案部分地或完全地通过盖子切割的多个槽。 应变隔离区域提供了由于盖子的热膨胀而导致的应力分离和释放应力,尽管在其外围受到粘合的唇缘的约束,导致较少的热诱导的中心区域的翘曲,较少的热诱导的在 唇缘和衬底板,和/或较少的热诱导的衬底板的偏转。 减小的翘曲,应力和/或挠曲通过降低在盖和模具之间的界面中的分层或分离的倾向和/或通过减少盖子之间的结合的结构故障的机会来增加系统的可靠性 和基板。
    • 8. 发明授权
    • Plated base plate for suspension assembly in hard disk drive
    • 用于悬挂组装在硬盘驱动器中的电镀基板
    • US07324307B2
    • 2008-01-29
    • US10241609
    • 2002-09-10
    • Damon D. BrinkRyan SchmidtKevin HanrahanJack Bish
    • Damon D. BrinkRyan SchmidtKevin HanrahanJack Bish
    • G11B5/48
    • G11B5/4813
    • A swage mount that includes a flange, having a first side and a second side, and a cylindrically shaped hub. The hub is primarily comprised of a metal (such as stainless steel), and extends from the second side of the flange, and has an inner surface and an outer surface. The surface of the swage mount is plated with one or more layers of metal, or a combination of metals, which provide a) increased retention torque, and b) increased part cleanliness. This invention may be used in conjunction with surface hardened swage mounts that contain surface protrusions. In this case the metal plating prevents separation of the protrusions from the swage mount, thereby preventing contamination.
    • 包括具有第一侧和第二侧以及圆柱形毂的凸缘的模压座。 轮毂主要由金属(例如不锈钢)组成,并从凸缘的第二侧延伸,并具有内表面和外表面。 金属模的表面镀有一层或多层金属或金属组合,其提供a)增加的保持力矩,和b)增加的零件清洁度。 本发明可以与包含表面突起的表面硬化的模具安装件结合使用。 在这种情况下,金属电镀防止突起与模具座分离,从而防止污染。