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1. 发明授权

US06724029B2 Twin-cell flash memory structure and method 有权
标题翻译：双电池闪存结构及方法
公开(公告)号：US06724029B2
公开(公告)日：2004-04-20
申请号：US09683831
申请日：2002-02-21
申请人： Louis L. Hsu , Chung H. Lam , Jack A. Mandelman , Carl J. Radens , William R. Tonti
发明人： Louis L. Hsu , Chung H. Lam , Jack A. Mandelman , Carl J. Radens , William R. Tonti
IPC分类号： H01L27108
CPC分类号： H01L27/11521 , G11C16/0441 , H01L27/115
摘要： A programmable memory cell structure that includes a pair of memory cells is provided. Each pair of memory cells includes a shared control gate and first and second floating gates present about the shared control gate. The first and second floating gates have respective gate regions disposed on respective sides of the control gate. Dielectric structures are present between the control gate and respective ones of the gate regions of the floating gates. The control gate and gates of the first and second floating gates are formed within a single lithographic square.
摘要翻译：提供了包括一对存储单元的可编程存储单元结构。每对存储单元包括共享控制栅极和围绕共享控制栅极存在的第一和第二浮动栅极。第一和第二浮栅具有设置在控制栅极的相应侧上的各自的栅极区域。电介质结构存在于控制栅极和浮动栅极的各个栅极区域之间。第一和第二浮动栅极的控制栅极和栅极形成在单个光刻平面内。

2. 发明授权

US06541815B1 High-density dual-cell flash memory structure 失效
标题翻译：高密度双单元闪存结构
公开(公告)号：US06541815B1
公开(公告)日：2003-04-01
申请号：US09974968
申请日：2001-10-11
申请人： Jack A. Mandelman , Louis L. Hsu , Chung H. Lam , Carl J. Radens
发明人： Jack A. Mandelman , Louis L. Hsu , Chung H. Lam , Carl J. Radens
IPC分类号： H01L29788
CPC分类号： H01L29/66825 , H01L21/28273 , H01L27/115 , H01L27/11556 , H01L29/7885
摘要： A 2F2 flash memory cell structure and a method of fabricating the same are provided. The 2F2 flash memory cell structure includes a Si-containing substrate having a plurality of trenches formed therein. Each trench has sidewalls that extend to a bottom wall, a length and individual segments that include two memory cell elements per segment. Each memory cell element comprises (i) a floating gate region having L-shaped gates formed on a portion of each trench sidewall; (ii) a program line overlapping one side of the L-shaped gates present at the bottom wall of each trench and extending along the entire length of the plurality of trenches; and (iii) a control gate region overlying the floating gate region. The control gate region includes gates formed on portions of the sidewalls of the trenches that are coupled to the floating gate regions. The memory cell structure further includes bitline diffusion regions formed in the Si-containing semiconductor substrate abutting each trench segment; and wordlines that lay orthogonal to the trenches. The wordlines are in contact with a top surface of each control gate region.
摘要翻译：提供了一种2F2闪存单元结构及其制造方法。 2F2闪存单元结构包括其中形成有多个沟槽的含Si衬底。每个沟槽具有延伸到底壁，长度和包括每个段的两个存储单元元件的单独段的侧壁。每个存储单元元件包括（i）具有形成在每个沟槽侧壁的一部分上的L形栅极的浮栅区域; （ii）重叠在每个沟槽的底壁处的L形门的一侧并沿多个沟槽的整个长度延伸的程序线; 和（iii）覆盖浮栅区域的控制栅极区域。控制栅极区域包括形成在沟槽的侧壁的与浮动栅极区域耦合的部分上的栅极。所述存储单元结构还包括形成在所述含Si半导体衬底中的位线邻接每个沟槽段的位线扩散区; 和与沟槽正交的字线。字线与每个控制栅极区域的顶表面接触。

3. 发明授权

US07138685B2 Vertical MOSFET SRAM cell 失效
标题翻译：垂直MOSFET SRAM单元
公开(公告)号：US07138685B2
公开(公告)日：2006-11-21
申请号：US10318495
申请日：2002-12-11
申请人： Louis L. Hsu , Oleg Gluschenkov , Jack A. Mandelman , Carl J. Radens
发明人： Louis L. Hsu , Oleg Gluschenkov , Jack A. Mandelman , Carl J. Radens
IPC分类号： H01L21/00
CPC分类号： H01L27/11 , G11C11/412 , H01L21/84 , H01L27/1104 , H01L27/1203
摘要： A method of forming an SRAM cell device includes the following steps. Form pass gate FET transistors and form a pair of vertical pull-down FET transistors with a first common body and a first common source in a silicon layer patterned into parallel islands formed on a planar insulator. Etch down through upper diffusions between cross-coupled inverter FET transistors to form pull-down isolation spaces bisecting the upper strata of pull-up and pull-down drain regions of the pair of vertical pull-down FET transistors, with the isolation spaces reaching down to the common body strata. Form a pair of vertical pull-up FET transistors with a second common body and a second common drain. Then, connect the FET transistors to form an SRAM cell.
摘要翻译：形成SRAM单元装置的方法包括以下步骤。形成栅极FET晶体管并形成一对垂直下拉FET晶体管，其具有第一共同体和第一公共源，图案化为平坦绝缘体上形成平行岛的硅层。通过交叉耦合的反相器FET晶体管之间的上扩散来蚀刻，以形成将一对垂直下拉FET晶体管的上拉和下拉漏极区的上层平分的下拉隔离空间，隔离空间达到到共同的身体层。形成一对具有第二共同体和第二公共漏极的垂直上拉FET晶体管。然后，连接FET晶体管以形成SRAM单元。

4. 发明授权

US06355531B1 Method for fabricating semiconductor devices with different properties using maskless process 失效
标题翻译：使用无掩模工艺制造具有不同特性的半导体器件的方法
公开(公告)号：US06355531B1
公开(公告)日：2002-03-12
申请号：US09634225
申请日：2000-08-09
申请人： Jack A. Mandelman , Louis L. Hsu , Carl J. Radens , William R. Tonti , Li-Kong Wang
发明人： Jack A. Mandelman , Louis L. Hsu , Carl J. Radens , William R. Tonti , Li-Kong Wang
IPC分类号： H01L218236
CPC分类号： H01L21/823892 , H01L21/823807 , H01L21/82385 , Y10S438/981
摘要： A method is provided for fabricating semiconductor devices having different properties on a common semiconductor substrate. The method includes the steps of (a) forming N openings on the semiconductor substrate, wherein each opening is corresponding to a channel region of each semiconductor device, (b) forming oxide layers of an ith type on surfaces of the N openings, (c) depositing gate conductor material of an ith type over structure of the semiconductor devices, the gate conductor material of the ith type having a gate conductor work-function of an ith type, (d) removing the gate conductor material of the ith type such that a predetermined amount of the gate conductor material of the ith type remains in an ith opening to form a gate conductor material layer of the ith type on top surface in the ith opening and the gate conductor material of the ith type deposited in the structure other than the ith opening is removed, (e) removing the oxide layers of the ith type from openings other than the ith opening, (f) repeating the steps of (a) through (e) from “i=1” to “i=N”, and (g) forming at least one layer on surface of each of N gate conductor material layers in the N openings to form a gate conductor, whereby the N semiconductor devices have N gate conductors, respectively, wherein the N gate conductors have N types of gate conductor work-functions. The semiconductor devices also have channel regions of which doping levels are different from each other by implanting the channel regions with different types of implants.
摘要翻译：提供了一种在公共半导体衬底上制造具有不同特性的半导体器件的方法。该方法包括以下步骤：（a）在半导体衬底上形成N个开口，其中每个开口对应于每个半导体器件的沟道区，（b）在N个开口的表面上形成第i个类型的氧化物层，（c ）沉积所述半导体器件的第i型结构的栅极导体材料，所述第i型栅极导体材料具有第i类型的栅极导体功函数，（d）去除所述第i种类型的栅极导体材料，使得第i个类型的栅极导体材料的预定量保持在第i个开口中，以在第i个开口的顶表面上形成第i型的栅极导体材料层，并且沉积在除第除去第i个开口，（e）从第i个开口以外的开口除去第i个类型的氧化物层，（f）重复步骤（a）至（e）从“i = 1”到“i = N “，（g）在其上形成至少一层在N个开口中的N个栅极导体材料层中的每一个的表面形成栅极导体，由此N个半导体器件分别具有N个栅极导体，其中N个栅极导体具有N种类型的栅极导体功函数。半导体器件还具有通过用不同类型的植入物植入沟道区域而使掺杂水平彼此不同的沟道区域。

5. 发明授权

US06570207B2 Structure and method for creating vertical capacitor and anti-fuse in DRAM process employing vertical array device cell complex 失效
标题翻译：在使用垂直阵列器件单元复合体的DRAM工艺中创建垂直电容器和反熔丝的结构和方法
公开(公告)号：US06570207B2
公开(公告)日：2003-05-27
申请号：US09736496
申请日：2000-12-13
申请人： Louis L. Hsu , Jack A. Mandelman , Carl J. Radens , William R. Tonti
发明人： Louis L. Hsu , Jack A. Mandelman , Carl J. Radens , William R. Tonti
IPC分类号： H01L27108
CPC分类号： H01L27/10897 , H01L23/5252 , H01L27/10841 , H01L27/10864 , H01L27/10894 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit chip is provided having both a conventional DRAM vertical transfer device and an integrated vertical storage capacitor or anti-fuse that can be accessed directly without having to turn on a transfer gate. The mechanism for accessing the integrated capacitor or anti-fuse directly can be a modified doping profile within the vertical cell that provides a low resistance punch-through FET. Alternatively, the mechanism can be a pair of overlapping or nearly overlapping diffusions within the vertical cell.
摘要翻译：提供一种集成电路芯片，其具有常规DRAM垂直传送装置和可以直接访问的集成垂直存储电容器或反熔丝，而不必打开传输门。直接访问集成电容器或反熔丝的机构可以是垂直单元内的修改的掺杂分布，其提供低电阻穿通FET。或者，机构可以是垂直单元内的一对重叠或几乎重叠的扩散。

6. 发明授权

US06538295B1 Salicide device with borderless contact 有权
标题翻译：自杀式装置与无边界接触
公开(公告)号：US06538295B1
公开(公告)日：2003-03-25
申请号：US09645499
申请日：2000-08-25
申请人： Gary B. Bronner , Jeffrey P. Gambino , Louis L. Hsu , Jack A. Mandelman , Carl J. Radens , William R. Tonti
发明人： Gary B. Bronner , Jeffrey P. Gambino , Louis L. Hsu , Jack A. Mandelman , Carl J. Radens , William R. Tonti
IPC分类号： H01L2976
CPC分类号： H01L21/76897 , H01L27/10873 , H01L29/665
摘要： A method and structure for a field effect transistor structure for dynamic random access memory integrated circuit devices has a gate conductor, salicide regions positioned along sides of the gate conductor, a gate cap positioned above the gate conductor and at least one self-aligned contact adjacent the gate conductor.
摘要翻译：用于动态随机存取存储器集成电路器件的场效应晶体管结构的方法和结构具有栅极导体，沿着栅极导体的侧面定位的自对准硅化物区域，位于栅极导体上方的栅极帽和邻近的至少一个自对准接触门导体。

7. 发明授权

US06174762B1 Salicide device with borderless contact 失效
标题翻译：自杀式装置与无边界接触
公开(公告)号：US06174762B1
公开(公告)日：2001-01-16
申请号：US09260311
申请日：1999-03-02
申请人： Gary B. Bronner , Jeffrey P. Gambino , Louis L. Hsu , Jack A. Mandelman , Carl J. Radens , William R. Tonti
发明人： Gary B. Bronner , Jeffrey P. Gambino , Louis L. Hsu , Jack A. Mandelman , Carl J. Radens , William R. Tonti
IPC分类号： H01L218234
CPC分类号： H01L21/76897 , H01L27/10873 , H01L29/665
摘要： A method and structure for a field effect transistor structure for dynamic random access memory integrated circuit devices has a gate conductor, salicide regions positioned along sides of the gate conductor, a gate cap positioned above the gate conductor and at least one self-aligned contact adjacent the gate conductor.
摘要翻译：用于动态随机存取存储器集成电路器件的场效应晶体管结构的方法和结构具有栅极导体，沿着栅极导体的侧面定位的自对准硅化物区域，位于栅极导体上方的栅极帽和邻近的至少一个自对准接触门导体。

8. 发明授权

US07087948B2 Forming electronic structures having dual dielectric thicknesses and the structure so formed 失效
公开(公告)号：US07087948B2
公开(公告)日：2006-08-08
申请号：US10995444
申请日：2004-11-23
申请人： Louis L. Hsu , Jack A. Mandelman , Carl J. Radens , Richard A. Strub , William R. Tonti
发明人： Louis L. Hsu , Jack A. Mandelman , Carl J. Radens , Richard A. Strub , William R. Tonti
IPC分类号： H01L27/108 , H01L29/76 , H01L29/94 , H01L31/119
CPC分类号： H01L29/66181 , H01L21/823462 , H01L27/10861 , H01L27/10894 , H01L29/945
摘要： A structure including a first device and a second device, wherein the second device has a dielectric thickness greater than the dielectric thickness of the first device, and the method of so forming the structure.

9. 发明授权

US06869846B2 Forming electronic structures having dual dielectric thicknesses and the structure so formed 失效
标题翻译：形成具有双介电厚度的电子结构和如此形成的结构
公开(公告)号：US06869846B2
公开(公告)日：2005-03-22
申请号：US10411850
申请日：2003-04-10
申请人： Louis L. Hsu , Jack A. Mandelman , Carl J. Radens , Richard A. Strub , William R. Tonti
发明人： Louis L. Hsu , Jack A. Mandelman , Carl J. Radens , Richard A. Strub , William R. Tonti
IPC分类号： H01L21/8239 , H01L21/334 , H01L21/8234 , H01L21/8242 , H01L29/94
CPC分类号： H01L29/66181 , H01L21/823462 , H01L27/10861 , H01L27/10894 , H01L29/945
摘要： A structure including a first device and a second device, wherein the second device has a dielectric thickness greater than the dielectric thickness of the first device, and the method of so forming the structure.
摘要翻译：一种包括第一装置和第二装置的结构，其中所述第二装置的电介质厚度大于所述第一装置的电介质厚度，以及形成所述结构的方法。

10. 发明授权

US06566191B2 Forming electronic structures having dual dielectric thicknesses and the structure so formed 失效
公开(公告)号：US06566191B2
公开(公告)日：2003-05-20
申请号：US09731148
申请日：2000-12-05
申请人： Louis L. Hsu , Jack A. Mandelman , Carl J. Radens , Richard A. Strub , William R. Tonti
发明人： Louis L. Hsu , Jack A. Mandelman , Carl J. Radens , Richard A. Strub , William R. Tonti
IPC分类号： H01L218242
CPC分类号： H01L29/66181 , H01L21/823462 , H01L27/10861 , H01L27/10894 , H01L29/945
摘要： A structure including a first device and a second device, wherein the second device has a dielectric thickness greater than the dielectric thickness of the first device, and the method of so forming the structure.

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