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    • 1. 发明授权
    • Method of making arrays of thin sheet microdischarge devices
    • 制备薄片微放电器件阵列的方法
    • US08221179B2
    • 2012-07-17
    • US11981412
    • 2007-10-31
    • J. Gary EdenSung-Jin ParkClark J. Wagner
    • J. Gary EdenSung-Jin ParkClark J. Wagner
    • H01J17/49
    • H01J17/49H01J1/025H01J9/00H01J9/02H01J25/50H01J61/09H01J61/305H01J61/62H01J63/04H01J65/046
    • The cavity 102 defines an empty volume formed in the insulator 108 has its walls defined by the insulator 108 and may extend through either (or both) the first electrode 106 or the second electrode 104, in which case the first electrode and/or second electrode also define the walls of the cavity 102. The cavity 102 is preferably cylindrical and has a diameter of 0.1 μm-1 mm. More preferably, the diameter ranges from 0.1 μm-500 μm, 1 μm-100 μm, or 100 μm-500 μm. The cavity 102 will be filled with a gas that contacts the cavity walls, fills the entire cavity 102 and is selected for its breakdown voltage or light emission properties at breakdown. Light is produced when the voltage difference between the first electrode 106 and the second electrode 104 creates an electric field sufficiently large to electrically break down the gas (nominally about 104 V-cm). This light escapes from the microcavity 102 through at least one end of the cavity 102.
    • 空腔102限定在绝缘体108中形成的空的体积具有由绝缘体108限定的壁,并且可延伸穿过第一电极106或第二电极104(或两者)中的一个或两者,在这种情况下,第一电极和/或第二电极 还限定空腔102的壁。空腔102优选是圆柱形的并且具有0.1μm-1mm的直径。 更优选的是,直径为0.1μm〜500μm,1μm〜100μm或100μm〜500μm。 空腔102将填充有与空腔壁接触的气体,填充整个空腔102,并且在击穿时选择其击穿电压或发光特性。 当第一电极106和第二电极104之间的电压差产生足够大的电场以电气分解气体(标称约为104V-cm)时产生光。 该光通过空腔102的至少一端从微腔102逸出。
    • 3. 发明授权
    • Roll to roll method of making microdischarge devices and arrays
    • 制作微放电器件和阵列的卷对卷方法
    • US07638937B2
    • 2009-12-29
    • US11070100
    • 2005-03-01
    • J. Gary EdenSung-Jin ParkClark J. Wagner
    • J. Gary EdenSung-Jin ParkClark J. Wagner
    • H01J63/04H01J61/09H01J13/46
    • H01J17/49H01J1/025H01J9/00H01J9/02H01J25/50H01J61/09H01J61/305H01J61/62H01J63/04H01J65/046
    • Roll to roll fabrication methods of the invention enable low cost mass production of microdischarge devices and arrays. A preferred embodiment method of fabricating a discharge device includes providing a dielectric layer sheet, a first electrode, and a second electrode sheet. A cavity is provided through at least a portion of the dielectric layer sheet. At least the dielectric layer sheet and second electrode sheet are rolled together. Another preferred embodiment method of fabrication a discharge device includes method of fabricating a discharge device includes providing a dielectric layer sheet and a cavity through at least a portion of the dielectric layer sheet. A first electrode is disposed as a film of conducting material on the dielectric layer sheet around a rim of the cavity. A second electrode sheet is provided. The dielectric layer sheet is rolled together with first electrode and second electrode sheets.
    • 本发明的卷对卷制造方法能够实现微量放电装置和阵列的低成本批量生产。 制造放电装置的优选实施例的方法包括提供介电层片,第一电极和第二电极片。 通过介电层片材的至少一部分提供空腔。 至少将电介质层片和第二电极片卷成一体。 制造放电器件的另一个优选实施例的方法包括制造放电器件的方法包括通过至少一部分电介质层片提供介电层片和空腔。 第一电极作为导电材料的膜设置在该空腔的边缘周围的介电层片上。 提供第二电极片。 介电层片与第一电极和第二电极片一起卷绕。
    • 4. 发明授权
    • Interwoven wire mesh microcavity plasma arrays
    • 交织丝网微腔等离子体阵列
    • US08362699B2
    • 2013-01-29
    • US12682973
    • 2008-10-27
    • J. Gary EdenSung-Jin ParkAndrew J. PriceJason D. ReadleClark J. Wagner
    • J. Gary EdenSung-Jin ParkAndrew J. PriceJason D. ReadleClark J. Wagner
    • H01J17/49H01J9/00
    • H01J17/49H01J61/06H01J61/305H01J61/52H01J61/82
    • Embodiments of the invention provide for large arrays of microcavity plasma devices that can be made inexpensively, and can produce large area but thin displays or lighting sources Interwoven metal wire mesh, such as interwoven Al mesh, consists of two sets of wires which are interwoven in such a way that the two wire sets cross each other, typically at πght angles (90 degrees) although other patterns are also available Fabrication is accomplished with a simple and inexpensive wet chemical etching process The wires in each set are spaced from one another such that the finished mesh forms an array of openings that can be, for example, square, rectangular or diamond-shaped The size of the openings or microcavities is a function of the diameter of the wires in the mesh and the spacing between the wires in the mesh used to form the array of microcavity plasma devices.
    • 本发明的实施例提供了可以廉价制造并且可以生产大面积但薄的显示器或照明源的微腔等离子体装置的大阵列。交织的金属丝网如交织的Al网由两组电线组成, 尽管其他图案也是可用的,这两种线组彼此交叉的方式,通常是直角(90度)通过简单和便宜的湿式化学蚀刻工艺完成。每组中的导线彼此间隔开,使得 完成的网格形成可以是例如正方形,矩形或菱形的开口阵列。开口或微腔的尺寸是网中线的直径和网中线之间的间距的函数 用于形成微腔等离子体装置阵列。
    • 5. 发明申请
    • Method of making arrays of thin sheet microdischarge devices
    • 制备薄片微放电器件阵列的方法
    • US20080119105A1
    • 2008-05-22
    • US11981412
    • 2007-10-31
    • J. Gary EdenSung-Jin ParkClark J. Wagner
    • J. Gary EdenSung-Jin ParkClark J. Wagner
    • H01J9/02
    • H01J17/49H01J1/025H01J9/00H01J9/02H01J25/50H01J61/09H01J61/305H01J61/62H01J63/04H01J65/046
    • The invention provides methods of making arrays of thin sheet microdischarge devices. In a preferred method of fabricating an array of microdischarge devices, a multi-layer dielectric layer thin sheet is position with respect to a first thin electrode. A second electrode thin sheet is joined on the dielectric layer sheet. An array of microcavities is provided through at least a portion of the dielectric layer sheet. The method can produce thin large arrays inexpensively. In preferred embodiments, each of the multi-layer dielectric layer thin sheet, the first thin electrode and the second electrode thin sheet have a thickness of less than less than 100 μm. In preferred embodiments, the multi-layer dielectric is formed of polymer, and in other embodiments from oxides and/or nitrides. In a particular preferred embodiment, the multilayer dielectric is formed from oxide and nitride films.
    • 本发明提供了制备薄片微放电器件阵列的方法。 在制造微放电器件阵列的优选方法中,多层介电层薄片相对于第一薄电极位置。 第二电极薄片接合在电介质层片上。 通过介电层片材的至少一部分提供微腔阵列。 该方法可以廉价地生产薄的大阵列。 在优选实施例中,多层介电层薄片,第一薄电极和第二电极薄片中的每一个具有小于小于100μm的厚度。 在优选实施例中,多层电介质由聚合物形成,在其它实施例中由氧化物和/或氮化物形成。 在特别优选的实施例中,多层电介质由氧化物和氮化物膜形成。