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1. 发明授权

US06921895B1 Sensor module with integrated signal processing 失效
标题翻译：具有集成信号处理的传感器模块
公开(公告)号：US06921895B1
公开(公告)日：2005-07-26
申请号：US09914083
申请日：1999-02-13
申请人： Jörg Schieferdecker , Mischa Schulze
发明人： Jörg Schieferdecker , Mischa Schulze
IPC分类号： G01J5/04 , G05D23/27 , H05B6/68 , H05B6/80 , G01J5/20
CPC分类号： H05B6/6447 , G01J5/02 , G01J5/0215 , G01J5/04 , G01J5/045 , G01J5/08 , G01J5/0815 , G01J2005/068 , G05D23/27
摘要： A sensor module comprises a radiation-sensitive sensor element (12), a sensor signal processing circuit (13, 41a, 44a) receiving the output signal of the sensor element (12) and obtaining a radiation-dependent first electric signal therefrom, a temperature-sensitive reference means (14, 15, 41b, 43, 44b) providing a temperature-dependent second electric signal and a signal combining means (16) for combining the two electric signals. The sensor signal processing circuit (13, 41a, 44a), the reference means (14, 15, 41b, 44b) and the combining means (16) are formed on a single chip (20, 21), and the chip (20, 21) and the sensor element (12) are accommodated in a common housing (22, 62, 64).
摘要翻译：传感器模块包括辐射敏感传感器元件（12），接收传感器元件（12）的输出信号并从其获得依赖于辐射的第一电信号的传感器信号处理电路（13,41a，44aa）提供温度依赖的第二电信号的温度敏感参考装置（14,15,41b，43,44b）和用于组合两个电信号的信号组合装置（16）。传感器信号处理电路（13,41a，44a），参考装置（14,15bb，44b）和组合装置（16）形成在单个芯片（20,21）上，并且芯片（20,21）和传感器元件（12）容纳在公共壳体（22,62,64）中。

2. 发明授权

US5826982A Temperature sensing module 失效
标题翻译：温度传感模块
公开(公告)号：US5826982A
公开(公告)日：1998-10-27
申请号：US617847
申请日：1996-06-14
申请人： Jorg Schieferdecker , Reiner Quad , Mischa Schulze
发明人： Jorg Schieferdecker , Reiner Quad , Mischa Schulze
IPC分类号： G01J5/20 , G01J5/12 , H05B6/68 , G01K13/00 , G01J5/08 , G01J5/16
CPC分类号： H05B6/68 , G01J5/12
摘要： The present invention concerns a sensor module with a hollow mirror (3) at whose focal point a sensor element (4) has been arranged whose output signal is compared with a reference signal and is transformed into a temperature signal in an evaluation circuit (15). The sensor module has a thermopile (6) in whose immediate vicinity a temperature reference element (5) has been arranged; a first pre-amplifier (8, 9), that is capable of being calibrated, amplifies the output signal from the thermopile (6); a second pre-amplifier (10-13) amplifies the output signal from the temperature reference element (5); and a third pre-amplifier (14) is connected into the circuit in the form of a difference amplifier and forms the difference in signal between the outputs from the first pre-amplifier (8, 9) and the second pre-amplifier (10-13).
摘要翻译： PCT No.PCT / EP94 / 03041 Sec。 371日期1996年6月14日第 102（e）日期1996年6月14日PCT 1994年9月12日PCT PCT。公开号WO95 / 08251 日期1995年3月23日本发明涉及一种具有中空反射镜（3）的传感器模块，其中焦点为传感器元件（4），其输出信号与参考信号进行比较，并被转换为温度信号评估电路（15）。所述传感器模块具有热电堆（6），所述热电堆（6）紧邻温度参考元件（5）; 能够校准的第一预放大器（8,9）放大来自热电堆（6）的输出信号; 第二前置放大器（10-13）放大来自温度参考元件（5）的输出信号; 并且第三前置放大器（14）以差分放大器的形式连接到电路中，并且形成来自第一前置放大器（8,9）和第二前置放大器（10）的输出之间的信号差， 13）。

3. 发明授权

US07842922B2 Thermopile infrared sensor array 有权
标题翻译：热电堆红外传感器阵列
公开(公告)号：US07842922B2
公开(公告)日：2010-11-30
申请号：US11913443
申请日：2006-05-16
申请人： Wilhelm Leneke , Marion Simon , Mischa Schulze , Karlheinz Storck , Joerg Schieferdecker
发明人： Wilhelm Leneke , Marion Simon , Mischa Schulze , Karlheinz Storck , Joerg Schieferdecker
IPC分类号： G01J5/16 , G01J5/04 , G01J5/12
CPC分类号： G01J5/06 , G01J5/12 , H01L2224/48091 , H01L2224/48472 , H01L2924/1461 , H01L2924/3025 , H04N5/2253 , H04N5/33 , H01L2924/00014 , H01L2924/00
摘要： A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements.
摘要翻译：热电堆红外传感器阵列包括具有多个热电堆传感器元件的传感器芯片，由半导体衬底和相应的电子部件制成。传感器芯片安装在支撑电路板上，并由其中布置透镜的盖子包围。其目的是生产具有小的芯片尺寸并且经济地制造的具有高热分辨能力的单片式红外传感器阵列。其目的是通过在传感器芯片的半导体衬底上布置由非导电材料制成的薄膜，其中热电堆传感器元件位于阵列中。在每个热电堆传感器元件下，通过蚀刻将膜的背面未被覆盖成蜂窝图案，并且电子部件布置在传感器芯片的边界区域中。可以为每列和每行传感器元件提供具有随后的低通滤波器的单个前置放大器。

4. 发明申请

US20080216883A1 Thermopile Infrared Sensor Array 有权
标题翻译：热电堆红外传感器阵列
公开(公告)号：US20080216883A1
公开(公告)日：2008-09-11
申请号：US11913443
申请日：2006-05-16
申请人： Wilhelm Leneke , Marion Simon , Mischa Schulze , Karlheinz Storck , Joerg Schieferdecker
发明人： Wilhelm Leneke , Marion Simon , Mischa Schulze , Karlheinz Storck , Joerg Schieferdecker
IPC分类号： H01L35/28 , G01J5/00
CPC分类号： G01J5/06 , G01J5/12 , H01L2224/48091 , H01L2224/48472 , H01L2924/1461 , H01L2924/3025 , H04N5/2253 , H04N5/33 , H01L2924/00014 , H01L2924/00
摘要： A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements.
摘要翻译：热电堆红外传感器阵列包括具有多个热电堆传感器元件的传感器芯片，由半导体衬底和相应的电子部件制成。传感器芯片安装在支撑电路板上，并由其中布置透镜的盖子包围。其目的是生产具有小的芯片尺寸并且经济地制造的具有高热分辨能力的单片式红外传感器阵列。其目的是通过在传感器芯片的半导体衬底上布置由非导电材料制成的薄膜，其中热电堆传感器元件位于阵列中。在每个热电堆传感器元件下，通过蚀刻将膜的背面未被覆盖成蜂窝图案，并且电子部件布置在传感器芯片的边界区域中。可以为每列和每行传感器元件提供具有随后的低通滤波器的单个前置放大器。

5. 发明授权

US08592765B2 Thermopile infrared sensor by monolithic silicon micromachining 有权
标题翻译：热电堆红外传感器采用单片硅微加工
公开(公告)号：US08592765B2
公开(公告)日：2013-11-26
申请号：US13005853
申请日：2011-01-13
申请人： Bodo Forg , Frank Herrmann , Wilhelm Leneke , Joerg Schieferdecker , Marion Simon , Karlheinz Storck , Mischa Schulze
发明人： Bodo Forg , Frank Herrmann , Wilhelm Leneke , Joerg Schieferdecker , Marion Simon , Karlheinz Storck , Mischa Schulze
IPC分类号： G01J5/12
CPC分类号： G01J5/10 , G01J5/02 , G01J5/023 , G01J5/04 , G01J5/045 , G01J5/08 , G01J5/0853 , G01J5/12 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A thermal infrared sensor is provided in a housing with optics and a chip with thermoelements on a membrane. The membrane spans a frame-shaped support body that is a good heat conductor, and the support body has vertical or approximately vertical walls. The thermopile sensor structure consists of a few long thermoelements per sensor cell. The thermoelements being arranged on connecting webs that connect together hot contacts on an absorber layer to cold contacts of the thermoelements. The membrane is suspended by one or more connecting webs and has, on both sides of the long thermoelements, narrow slits that separate the connecting webs from both the central region and also the support body. At least the central region is covered by the absorber layer.
摘要翻译：热敏红外传感器设置在具有光学元件的壳体中，并且在膜上具有热电元件的芯片。膜跨过一个良好导热体的框架形支撑体，支撑体具有垂直或大致垂直的壁。热电堆传感器结构由每个传感器单元的几个长的热电偶组成。热电偶被布置在将吸收层上的热触点连接到热电偶的冷触点的连接腹板上。膜通过一个或多个连接腹板悬挂，并且在长热电元件的两侧上具有将连接腹板与中心区域以及支撑体分开的狭窄狭缝。至少中心区域被吸收层覆盖。

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