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1. 发明授权

US07021993B2 Method of polishing a substrate with a polishing system containing conducting polymer 失效
标题翻译：用含有导电聚合物的抛光系统抛光基材的方法
公开(公告)号：US07021993B2
公开(公告)日：2006-04-04
申请号：US10198841
申请日：2002-07-19
申请人： Jian Zhang , Fred Sun , Shumin Wang , Isaac K. Cherian , Eric H. Klingenberg
发明人： Jian Zhang , Fred Sun , Shumin Wang , Isaac K. Cherian , Eric H. Klingenberg
IPC分类号： B24B1/00
CPC分类号： C09K3/1463 , B24B37/00 , H01L21/3212
摘要： The invention provides a method of polishing a substrate comprising (i) contacting a substrate with a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of about 10−10 S/cm to about 106 S/cm, and (c) a liquid carrier, and (ii) abrading or removing at least a portion of the substrate to polish the substrate.
摘要翻译：本发明提供一种抛光衬底的方法，其包括（i）使衬底与抛光系统接触，所述抛光系统包括（a）研磨剂，抛光垫，用于氧化衬底的装置或其任何组合，（b）导电聚合物，其具有约10 -6 S / cm至约10 -6 S / cm的电导率，和（c）液体载体，和（ii）至少研磨或除去衬底的一部分以抛光衬底。

2. 发明授权

US06811474B2 Polishing composition containing conducting polymer 有权
公开(公告)号：US06811474B2
公开(公告)日：2004-11-02
申请号：US10199704
申请日：2002-07-19
申请人： Isaac K. Cherian , Jian Zhang , Fred Sun , Shumin Wang , Eric H. Klingenberg
发明人： Isaac K. Cherian , Jian Zhang , Fred Sun , Shumin Wang , Eric H. Klingenberg
IPC分类号： B24B500
CPC分类号： C09G1/02 , H01L21/3212 , H01L21/32134
摘要： The invention provides a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of about 10−10 S/cm to about 106 S/cm, and (c) a liquid carrier.

3. 发明授权

US06867140B2 Method of polishing a multi-layer substrate 有权
标题翻译：抛光多层基材的方法
公开(公告)号：US06867140B2
公开(公告)日：2005-03-15
申请号：US10353512
申请日：2003-01-29
申请人： Shumin Wang , Vlasta Brusic Kaufman , Steven K. Grumbine , Isaac K. Cherian
发明人： Shumin Wang , Vlasta Brusic Kaufman , Steven K. Grumbine , Isaac K. Cherian
IPC分类号： C09G1/02 , H01L21/321 , H01L21/302
CPC分类号： H01L21/3212 , C09G1/02
摘要： The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, at least one stopping compound with a polishing selectivity of the first metal layer:second layer of at least about 30:1, wherein the stopping compound is a cationically charged nitrogen containing compound selected from compounds comprising amines, imines, amides, imides, and mixtures thereof, and a polishing pad and/or an abrasive, and (ii) polishing the first metal layer with the system until at least a portion of the first metal layer is removed from the substrate.
摘要翻译：本发明提供了一种用于抛光一层或多层多层基材的方法，所述多层基材包括第一金属层和第二层，其包括（i）使第一金属层与包括液体载体，至少一种氧化剂至少一种抛光添加剂，其增加系统抛光至少一层基材的速率，至少一种具有至少约30:1的第一金属层的抛光选择性的停止化合物：第二层，其至少约30:1 停止化合物是选自包含胺，亚胺，酰胺，酰亚胺及其混合物的化合物的阳离子充氮的含氮化合物，以及抛光垫和/或研磨剂，和（ii）用系统抛光第一金属层直到至少从衬底去除第一金属层的一部分。

4. 发明授权

US06852632B2 Method of polishing a multi-layer substrate 有权
标题翻译：抛光多层基材的方法
公开(公告)号：US06852632B2
公开(公告)日：2005-02-08
申请号：US10353542
申请日：2003-01-29
申请人： Shumin Wang , Vlasta Brusic Kaufman , Steven K. Grumbine , Isaac K. Cherian , Renjie Zhou
发明人： Shumin Wang , Vlasta Brusic Kaufman , Steven K. Grumbine , Isaac K. Cherian , Renjie Zhou
IPC分类号： B24B57/02 , B24D11/00 , C09G1/02 , C09K3/14 , H01L21/304 , H01L21/302 , C09K13/00
CPC分类号： C09G1/02
摘要： The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, wherein the polishing additive is selected from the group consisting of pyrophosphates, condensed phosphates, phosphonic acids and salts thereof, amines, amino alcohols, amides, imines, imino acids, nitriles, nitros, thiols thioesters, thioethers, carbothiolic acids, carbothionic acids, thiocarboxylic acids, thiosalicylic acids, and mixtures thereof, and a polishing pad and/or an abrasive, and (ii) polishing the first metal layer with the system until at least a portion of the first metal layer is removed from the substrate.
摘要翻译：本发明提供了一种用于抛光一层或多层多层基材的方法，所述多层基材包括第一金属层和第二层，其包括（i）使第一金属层与包括液体载体，至少一种氧化剂至少一种抛光添加剂，其增加系统抛光至少一层基材的速率，其中所述抛光添加剂选自焦磷酸盐，缩合磷酸盐，膦酸及其盐，胺，氨基醇，酰胺，亚胺，亚氨基酸，腈，亚硝基，硫醇硫酯，硫醚，硫代硫酸，碳硫酸，硫代羧酸，硫代水杨酸及其混合物，以及抛光垫和/或磨料，和（ii）层，直到第一金属层的至少一部分从衬底去除。

5. 发明授权

US06855266B1 Polishing system with stopping compound and method of its use 有权
标题翻译：具有停车复合抛光系统及其使用方法
公开(公告)号：US06855266B1
公开(公告)日：2005-02-15
申请号：US09636246
申请日：2000-08-10
申请人： Shumin Wang , Vlasta Brusic Kaufman , Steven K. Grumbine , Isaac K. Cherian
发明人： Shumin Wang , Vlasta Brusic Kaufman , Steven K. Grumbine , Isaac K. Cherian
IPC分类号： C09G1/02 , H01L21/321 , C09K13/00
CPC分类号： H01L21/3212 , C09G1/02
摘要： The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, (iv) at least one stopping compound with a polishing selectivity of the first metal layer:second layer of at least about 30:1, and (v) a polishing pad and/or an abrasive. The invention also provides a composition comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive (iv) at least one stopping compound with a polishing selectivity of the first metal layer:second layer of at least about 30:1, to be used with (v) a polishing pad and/or an abrasive.
摘要翻译：本发明提供一种用于抛光多层基底的一层或多层的系统，其包括第一金属层和第二层，所述第二层包括（i）液体载体，（ii）至少一种氧化剂，（iii）至少一种抛光添加剂，其增加系统抛光至少一层基材的速率，（iv）至少一种具有第一金属层的抛光选择性的停止化合物：至少约30:1的第二层，和（v ）抛光垫和/或磨料。本发明还提供一种组合物，其包含（i）液体载体，（ii）至少一种氧化剂，（iii）至少一种抛光添加剂（iv）至少一种具有第一金属层的抛光选择性的停止化合物：第二至少约30:1的层，与（v）抛光垫和/或研磨剂一起使用。

6. 发明授权

US09850571B2 Method for preparing graphene 有权
公开(公告)号：US09850571B2
公开(公告)日：2017-12-26
申请号：US14396519
申请日：2012-07-03
申请人： Shumin Wang , Qian Gong , Xiaoming Xie , Hailong Wang , Zengfeng Di , Guqiao Ding , Qingbo Liu
发明人： Shumin Wang , Qian Gong , Xiaoming Xie , Hailong Wang , Zengfeng Di , Guqiao Ding , Qingbo Liu
IPC分类号： C23C16/26 , B82Y30/00 , B82Y40/00 , C01B32/186 , C01B32/188
CPC分类号： C23C16/26 , B82Y30/00 , B82Y40/00 , C01B32/186 , C01B32/188
摘要： The invention belongs to the technical field of inorganic compounds, and particularly, relates to a method for directly preparing graphene by taking CBr4 as a source material and using methods such as molecular-beam epitaxy (MBE) or chemical vapor deposition (CVD). A method for preparing graphene comprises the following steps: selecting a proper material as a substrate; directly depositing a catalyst and CBr4 on a surface of the substrate; and performing annealing treatment on the sample obtained through deposition. Compared with other technologies, an innovative point of the method in the invention is that the catalyst and CBr4 source can be quantitatively and controllably deposited on any substrate, and the catalyst and CBr4 source react on the surface of the substrate to form the graphene, so that the dependence of the graphene growth on a substrate material can be reduced to a great extent, and different substrate materials can be selected according to different application backgrounds.

7. 发明授权

US08038749B2 Composition for removing photoresist layer and method for using it 有权
标题翻译：去除光致抗蚀剂层的组合物及其使用方法
公开(公告)号：US08038749B2
公开(公告)日：2011-10-18
申请号：US11920247
申请日：2006-05-12
申请人： Shumin Wang , Chris Chang Yu
发明人： Shumin Wang , Chris Chang Yu
IPC分类号： C09G1/02 , C09G1/04
CPC分类号： C09G1/02 , G03F7/423 , G03F7/425 , H01L21/02063
摘要： A composition for removing a photoresist layer and a method for using it are disclosed. The composition comprises a chemical portion which includes water and chemical constituents dissolving or softening the photoresist layer and a mechanical portion which is abrasive particles. Using the composition and the method according to the present invention can decrease the conventional two steps of removing a photoresist layer process to one step, thereby simplifying the procedure, shortening the removing time and reducing the cost. The chemical constituents in the composition according to the present invention are of low toxicity and flammability and the amount used is small, which makes it more friendly with the environment and decreases the expense of disposing the waste.
摘要翻译：公开了一种用于除去光致抗蚀剂层的组合物及其使用方法。组合物包括化学部分，其包括水和溶解或软化光致抗蚀剂层的化学成分和作为磨料颗粒的机械部分。使用根据本发明的组合物和方法可以将将光致抗蚀剂层处理去除一个步骤的常规两个步骤减少，从而简化了步骤，缩短了去除时间并降低了成本。根据本发明的组合物中的化学成分具有低毒性和易燃性，并且所用量小，这使得它对环境更加友好并且降低了废弃物的处理费用。

8. 发明授权

US06952100B1 Phase controlled surface coil magnetic resonance imaging 失效
标题翻译：相控面磁共振成像
公开(公告)号：US06952100B1
公开(公告)日：2005-10-04
申请号：US10709354
申请日：2004-04-29
申请人： Graeme C. McKinnon , Eddy B. Boskamp , Shumin Wang
发明人： Graeme C. McKinnon , Eddy B. Boskamp , Shumin Wang
IPC分类号： G01R33/3415 , G01V3/00
CPC分类号： G01R33/3415
摘要： A magnetic resonance imaging assembly is provided. The assembly includes a magnet assembly defining a scanning bore along a z-direction. The assembly further includes a surface coil assembly positioned within the scanning bore. The surface coil assembly receives an imaging field. The surface coil assembly comprises a first surface coil positioned along the z-direction. The first surface coil is induced with a first coil current comprised of a first coil amplitude and a first coil phase. The surface coil assembly includes a second surface coil positioned along said z-direction. The second surface coil is induced with a second coil current comprised of a second coil amplitude and a second coil phase. The second coil phase is varied from the first coil phase to correct asymmetries within the imaging field.
摘要翻译：提供磁共振成像组件。组件包括沿z方向限定扫描孔的磁体组件。组件还包括位于扫描孔内的表面线圈组件。表面线圈组件接收成像场。表面线圈组件包括沿z方向定位的第一表面线圈。用第一线圈振幅和第一线圈相位的第一线圈电流感应第一表面线圈。表面线圈组件包括沿着z方向定位的第二表面线圈。第二表面线圈由包括第二线圈振幅和第二线圈相的第二线圈电流感应。第二线圈相位从第一线圈相位变化，以校正成像场内的不对称性。

9. 发明授权

US06592776B1 Polishing composition for metal CMP 有权
标题翻译：金属CMP抛光组合物
公开(公告)号：US06592776B1
公开(公告)日：2003-07-15
申请号：US09609882
申请日：2000-07-05
申请人： Shumin Wang , Steven K. Grumbine , Christopher C. Streinz , Eric W. G. Hoglund
发明人： Shumin Wang , Steven K. Grumbine , Christopher C. Streinz , Eric W. G. Hoglund
IPC分类号： C09K1300
CPC分类号： C09K3/1463 , C09G1/02 , C23F3/00 , H01L21/3212
摘要： Chemical mechanical polishing compositions and slurries comprising a film forming agent and at least one silane compound wherein the compositions are useful for polishing substrate features such as copper, tantalum, and tantalum nitride features.
摘要翻译：化学机械抛光组合物和包含成膜剂和至少一种硅烷化合物的浆料，其中组合物可用于抛光基底特征如铜，钽和氮化钽的特征。

10. 发明授权

US06217416B1 Chemical mechanical polishing slurry useful for copper/tantalum substrates 失效
标题翻译：用于铜/钽基板的化学机械抛光浆料
公开(公告)号：US06217416B1
公开(公告)日：2001-04-17
申请号：US09105065
申请日：1998-06-26
申请人： Vlasta Brusic Kaufman , Rodney C. Kistler , Shumin Wang
发明人： Vlasta Brusic Kaufman , Rodney C. Kistler , Shumin Wang
IPC分类号： C09K1300
CPC分类号： C23F3/00 , C09G1/02 , H01L21/3212
摘要： The present invention is a first CMP slurry including an abrasive, an oxidizing agent, a complexing agent, a film forming agent and an organic amino compound, a second polishing slurry including an abrasive, an oxidizing agent, and acetic acid wherein the weight ratio of the oxidizing agent to acetic acid is at least 10 and a method for using the first and second polishing slurries sequentially to polish a substrate containing copper and containing tantalum or tantalum nitride or both tantalum and tantalum nitride.
摘要翻译：本发明是包括研磨剂，氧化剂，配位剂，成膜剂和有机氨基化合物的第一CMP浆料，包括研磨剂，氧化剂和乙酸的第二研磨浆料，其中重量比氧化剂至乙酸为至少10，并且依次使用第一和第二抛光浆料的方法来抛光含有铜并含有钽或氮化钽或钽或氮化钽的基板。

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