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    • 2. 发明申请
    • Zero threshold voltage pFET and method of making same
    • 零阈值电压pFET及其制作方法
    • US20040251475A1
    • 2004-12-16
    • US10845835
    • 2004-05-14
    • International Business Machines Corporation
    • Jeffrey S. BrownChung H. LamRandy W. MannJeffery H. Oppold
    • H01L029/76
    • H01L29/1037H01L21/823412H01L21/823493H01L29/78
    • A zero threshold voltage (ZVt) pFET (104) and a method of making the same. The ZVt pFET is made by implanting a p-type substrate (112) with a retrograde n-well (116) so that a pocket (136) of the p-type substrate material remains adjacent the surface of the substrate. This is accomplished using an n-well mask (168) having a pocket-masking region (184) in the aperture (180) corresponding to the ZVt pFET. The n-well may be formed by first creating a ring-shaped precursor n-well (116null) and then annealing the substrate so as to cause the regions of the lower portion (140null) of the precursor n-well to merge with one another to isolate the pocket of p-type substrate material. After the n-well and isolated pocket of p-type substrate material have been formed, remaining structures of the ZVt pFET may be formed, such as a gate insulator (128), gate (132), source (120), and drain (124).
    • 零阈值电压(ZVt)pFET(104)及其制造方法。 ZVt pFET通过用逆向n阱(116)注入p型衬底(112),使得p型衬底材料的凹口(136)保持邻近衬底的表面而制成。 这是通过在对应于ZVt pFET的孔径(180)中具有口罩掩蔽区域(184)的n阱掩模(168)来实现的。 可以通过首先产生环形前体n阱(116')然后对衬底退火以使前体n阱的下部(140')的区域与 彼此隔开p型衬底材料的口袋。 在已经形成p型衬底材料的n阱和隔离袋之后,可以形成ZVt pFET的剩余结构,例如栅极绝缘体(128),栅极(132),源极(120)和漏极( 124)。