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    • 3. 发明授权
    • Method and circuit for minimizing the charging effect during manufacture of semiconductor devices
    • 用于在半导体器件制造期间最小化充电效应的方法和电路
    • US06337502B1
    • 2002-01-08
    • US09336666
    • 1999-06-18
    • Boaz EitanIlan Bloom
    • Boaz EitanIlan Bloom
    • H01L2362
    • H01L27/0266H01L21/3065H01L21/31116H01L27/0251
    • A protection device which is active during the manufacturing process of a semiconductor chip includes a protection transistor and an antenna. The protection transistor is connected between a metal line having devices to be protected electrically connected thereto and a ground supply, where the metal line is connected to devices to be protected. The antenna is formed of the same metal layer as the metal line and controls the operation of the protection transistor during the manufacturing process. The antenna is connected to a gate of the protection transistor. Optionally, there is a metal ring around the antenna which is connected to a drain of the protection transistor via the same metal layer as the metal line. During normal operation of the chip, the protection transistor is either active for other purposes or is turned off. Turning off is provided either by a line formed of a second metal layer that is connected between the antenna and ground, or by a reversed biased diode and a parallel capacitor that are connected between the gate of the protection transistor and ground. The present invention includes the method of manufacturing the protection device.
    • 在半导体芯片的制造过程中有效的保护装置包括保护晶体管和天线。 保护晶体管连接在具有被保护电气连接的器件的金属线和接地电源之间,其中金属线连接到待保护的器件。 天线由与金属线相同的金属层形成,并且在制造过程中控制保护晶体管的操作。 天线连接到保护晶体管的栅极。 可选地,在天线周围有金属环,其通过与金属线相同的金属层连接到保护晶体管的漏极。 在芯片的正常操作期间,保护晶体管对于其它目的而言是活动的或被关闭。 通过由连接在天线和地之间的第二金属层形成的线或由连接在保护晶体管的栅极和地之间的反向偏置二极管和并联电容器来提供关断。 本发明包括制造保护装置的方法。
    • 4. 发明授权
    • Protection of NROM devices from charge damage
    • 保护NROM设备免受充电损坏
    • US07317633B2
    • 2008-01-08
    • US11175801
    • 2005-07-05
    • Eli LuskyIlan BloomAssaf ShappirBoaz Eitan
    • Eli LuskyIlan BloomAssaf ShappirBoaz Eitan
    • G11C16/22H01L23/62
    • H01L27/105G11C16/22H01L27/0266H01L27/11568
    • A method for protecting NROM devices from charge damage during process steps, the method including providing X-decoder structure for word line connections, wherein each word line is connected to a pair of transistors, a PMOS transistor and an NMOS transistor the PMOS transistors sharing a common deep N well and the NMOS transistors connected to a P well, wherein during negative charging, the NMOS transistors shunt leakage current to ground, and during positive charging, the PMOS transistors shunt leakage current to ground, providing an N+ tap connected to the N well and connecting the N+ tap to a positive voltage clamping device, and connecting all the P wells together to a common P+ tap and connecting the P+ tap to a negative voltage clamping device, wherein during process steps, the negative and positive voltage clamping devices direct leakage current to ground.
    • 一种用于在处理步骤期间保护NROM器件免受电荷损伤的方法,所述方法包括提供用于字线连接的X解码器结构,其中每个字线连接到一对晶体管,PMOS晶体管和NMOS晶体管,PMOS晶体管共享 公共深N阱和连接到P阱的NMOS晶体管,其中在负电荷期间,NMOS晶体管将泄漏电流分流到地,并且在正充电期间,PMOS晶体管将泄漏电流分流到地,提供连接到N的N +抽头 并且将N +抽头连接到正电压钳位装置,并将所有P阱连接到一个公共P +抽头,并将P +抽头连接到负电压钳位装置,其中在处理步骤期间,负和正电压钳位装置直接 漏电流到地。
    • 7. 发明申请
    • Protection of NROM devices from charge damage
    • 保护NROM设备免受充电损坏
    • US20060007612A1
    • 2006-01-12
    • US11175801
    • 2005-07-05
    • Eli LuskyIlan BloomAssaf ShappirBoaz Eitan
    • Eli LuskyIlan BloomAssaf ShappirBoaz Eitan
    • H02H9/00
    • H01L27/105G11C16/22H01L27/0266H01L27/11568
    • A method for protecting NROM devices from charge damage during process steps, the method including providing X-decoder structure for word line connections, wherein each word line is connected to a pair of transistors, a PMOS transistor T1 and an NMOS transistor T2, the PMOS transistors T1 sharing a common deep N well and the NMOS transistors T2 connected to a P well, wherein during negative charging, the NMOS transistors T2 shunt leakage current to ground, and during positive charging, the PMOS transistors T1 shunt leakage current to ground, providing an N+ tap connected to the N well and connecting the N+ tap to a positive voltage clamping device, and connecting all the P wells together to a common P+ tap and connecting the P+ tap to a negative voltage clamping device, wherein during process steps, the negative and positive voltage clamping devices direct leakage current to ground.
    • 一种用于在处理步骤期间保护NROM器件免受电荷损伤的方法,所述方法包括提供用于字线连接的X解码器结构,其中每个字线连接到一对晶体管,PMOS晶体管T1和NMOS晶体管T2,PMOS 晶体管T1共享共同的深N阱和连接到P阱的NMOS晶体管T2,其中在负电荷期间,NMOS晶体管T2将漏电流分配到地,并且在正充电期间,PMOS晶体管T1将漏电流分流到地,提供 N +抽头连接到N阱并将N +抽头连接到正电压钳位装置,并将所有P阱连接到一个公共P +抽头,并将P +抽头连接到负电压钳位装置,其中在处理步骤期间, 负和正电压钳位器件将漏电流直接接地。