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    • 5. 发明授权
    • Method for programming of a semiconductor memory cell
    • 半导体存储单元编程方法
    • US06292394B1
    • 2001-09-18
    • US09606205
    • 2000-06-29
    • Zeev CohenBoaz EitanEduardo Maayan
    • Zeev CohenBoaz EitanEduardo Maayan
    • G11C1604
    • G11C16/3445G11C16/3436G11C16/3459
    • A method for programming an array having a multiplicity of memory cells. The method includes, per cell to be programmed, verifying a programmed or non-programmed state of the cell and flagging those of the cells that verify as non-programmed during one of the verify steps after having previously verified as programmed. A programming pulse having a programming level is applied to the non-programmed cells which are not flagged cells. The steps of verifying, flagging and applying are then repeated until all of the cells verify as programmed at least once. Subsequently, a boost pulse having a boost programming level lower than the programming level is applied to the flagged cells.
    • 一种用于编程具有多个存储器单元的阵列的方法。 该方法包括每个待编程的单元,验证单元的编程或非编程状态,并且在先前已经被编程的验证之后,在验证步骤之一期间验证被验证为非编程的单元的那些单元。 具有编程电平的编程脉冲被施加到非标记单元的非编程单元。 然后重复验证,标记和应用的步骤,直到所有小区至少一次被编程为验证。 随后,将具有低于编程电平的升压编程电平的升压脉冲施加到标记的单元。
    • 6. 发明授权
    • Non-volatile memory cell and non-volatile memory device using said cell
    • US07400529B2
    • 2008-07-15
    • US11785285
    • 2007-04-17
    • Boaz EitanEduardo Maayan
    • Boaz EitanEduardo Maayan
    • G11C16/04
    • H01L29/7887G11C11/5671G11C16/0475G11C16/10G11C16/14G11C16/26H01L21/28282H01L29/7885H01L29/7923
    • A non-volatile electrically erasable programmable read only memory (EEPROM) capable of storing two bit of information having a non-conducting charge trapping dielectric, such as silicon nitride, sandwiched between two silicon dioxide layers acting as electrical insulators is disclosed. The invention includes a method of programming, reading and erasing the two bit EEPROM device. The non-conducting dielectric layer functions as an electrical charge trapping medium. A conducting gate layer is placed over the upper silicon dioxide layer. A left and a right bit are stored in physically different areas of the charge trapping layer, near left and right regions of the memory cell, respectively. Each bit of the memory device is programmed in the conventional manner, using hot electron programming, by applying programming voltages to the gate and to either the left or the right region while the other region is grounded. Hot electrons are accelerated sufficiently to be injected into the region of the trapping dielectric layer near where the programming voltages were applied to. The device, however, is read in the opposite direction from which it was written, meaning voltages are applied to the gate and to either the right or the left region while the other region is grounded. Two bits are able to be programmed and read due to a combination of relatively low gate voltages with reading in the reverse direction. This greatly reduces the potential across the trapped charge region. This permits much shorter programming times by amplifying the effect of the charge trapped in the localized trapping region associated with each of the bits. In addition, both bits of the memory cell can be individually erased by applying suitable erase voltages to the gate and either left or right regions so as to cause electrons to be removed from the corresponding charge trapping region of the nitride layer.
    • 7. 发明申请
    • Non-volatile memory cell and non-volatile memory device using said cell
    • 使用所述单元的非易失性存储单元和非易失性存储器件
    • US20070206415A1
    • 2007-09-06
    • US11785285
    • 2007-04-17
    • Boaz EitanEduardo Maayan
    • Boaz EitanEduardo Maayan
    • G11C16/04
    • H01L29/7887G11C11/5671G11C16/0475G11C16/10G11C16/14G11C16/26H01L21/28282H01L29/7885H01L29/7923
    • A non-volatile electrically erasable programmable read only memory (EEPROM) capable of storing two bit of information having a non-conducting charge trapping dielectric, such as silicon nitride, sandwiched between two silicon dioxide layers acting as electrical insulators is disclosed. The invention includes a method of programming, reading and erasing the two bit EEPROM device. The non-conducting dielectric layer functions as an electrical charge trapping medium. A conducting gate layer is placed over the upper silicon dioxide layer. A left and a right bit are stored in physically different areas of the charge trapping layer, near left and right regions of the memory cell, respectively. Each bit of the memory device is programmed in the conventional manner, using hot electron programming, by applying programming voltages to the gate and to either the left or the right region while the other region is grounded. Hot electrons are accelerated sufficiently to be injected into the region of the trapping dielectric layer near where the programming voltages were applied to. The device, however, is read in the opposite direction from which it was written, meaning voltages are applied to the gate and to either the right or the left region while the other region is grounded. Two bits are able to be programmed and read due to a combination of relatively low gate voltages with reading in the reverse direction. This greatly reduces the potential across the trapped charge region. This permits much shorter programming times by amplifying the effect of the charge trapped in the localized trapping region associated with each of the bits. In addition, both bits of the memory cell can be individually erased by applying suitable erase voltages to the gate and either left or right regions so as to cause electrons to be removed from the corresponding charge trapping region of the nitride layer.
    • 公开了一种非易失性电可擦除可编程只读存储器(EEPROM),其能够存储夹在作为电绝缘体的两个二氧化硅层之间的具有非导电电荷捕获电介质(例如氮化硅)的两位信息。 本发明包括一种编程,读取和擦除两位EEPROM器件的方法。 非导电介电层用作电荷捕获介质。 导电栅极层放置在上部二氧化硅层上。 左和右位分别存储在电荷俘获层的物理上不同的区域中,分别位于存储器单元的左侧和右侧区域附近。 使用热电子编程,通过将编程电压施加到栅极以及向左或右区域施加编程电压,而另一区域接地,存储器件的每一位都被编程。 热电子被充分加速以注入到施加编程电压附近的捕获介电层的区域中。 然而,器件以与其写入的相反方向读取,意味着电压被施加到栅极以及右侧区域或左侧区域,而另一个区域被接地。 由于相对低的栅极电压和反向读取的组合,两位能够被编程和读取。 这大大降低了被捕获的电荷区域的电位。 这允许通过放大捕获在与每个位相关联的局部捕获区域中的电荷的影响来缩短编程时间。 此外,可以通过向栅极和左或右区域施加合适的擦除电压来单独擦除存储单元的两个位,以使电子从氮化物层的相应的电荷俘获区域移除。