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1. 发明授权

US09048565B2 Adapter apparatus with deflectable element socket contacts 有权
标题翻译：具有可偏转元件插座触点的适配器设备
公开(公告)号：US09048565B2
公开(公告)日：2015-06-02
申请号：US13916025
申请日：2013-06-12
申请人： Ironwood Electronics, Inc.
发明人： Ilavarasan M. Palaniappa , Vinayak Reddy Panavala , Mickiel P. Fedde
IPC分类号： H01R12/57 , H01R43/26 , H01R12/71 , H01R43/20 , H05K3/30 , H05K7/10
CPC分类号： H01R12/57 , H01R12/716 , H01R43/205 , H01R43/26 , H05K3/30 , H05K3/3436 , H05K7/10 , H05K7/1084 , H05K2201/10325 , H05K2201/1053 , Y10T29/49208
摘要： An adapter apparatus includes a substrate having a plurality of openings defined therethrough. Further, a deflectable element socket contact is provided in each of the openings. When a conductive male pin is positioned in contact between first and second deflectable elements of the deflectable element socket contact, at least a portion of the first and second deflectable elements are caused to deflect within first and second deflection regions, respectively, of the defined opening.
摘要翻译：适配器装置包括具有通过其限定的多个开口的基板。此外，在每个开口中设置可偏转元件插座触点。当导电阳销定位成在可偏转元件插座触头的第一和第二可偏转元件之间接触时，第一和第二可偏转元件的至少一部分分别在限定开口的第一和第二偏转区域内偏转。

2. 发明授权

US09812795B2 Packaged device adapter with force applied using bearing apparatus 有权
公开(公告)号：US09812795B2
公开(公告)日：2017-11-07
申请号：US14930726
申请日：2015-11-03
申请人： IRONWOOD ELECTRONICS, INC.
发明人： Ilavarasan M. Palaniappa , Mickiel P. Fedde , Vinayak Reddy Panavala , Jacob Ray Vavra
IPC分类号： H01R4/50 , H01R4/38 , H01R12/50 , H01R12/72 , H01R12/89 , H05K7/10
CPC分类号： H01R4/5066 , H01R4/38 , H01R12/727 , H01R12/89 , H01R23/6893 , H05K7/1007 , H05K7/1061
摘要： An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a torque applicator configured to apply an axial force. A bearing structure positioned between the torque applicator and a packaged device may be used to transfer a force (e.g., an axial force) applied using the torque applicator to the packaged device.

3. 发明申请

US20140370725A1 ADAPTER APPARATUS WITH DEFLECTABLE ELEMENT SOCKET CONTACTS 有权
标题翻译：适配器与可拆卸元件插座联系
公开(公告)号：US20140370725A1
公开(公告)日：2014-12-18
申请号：US13916025
申请日：2013-06-12
申请人： Ironwood Electronics, Inc.
发明人： Ilavarasan M. Palaniappa , Vinayak Reddy Panavala , Mickiel P. Fedde
IPC分类号： H01R12/57 , H01R43/26
CPC分类号： H01R12/57 , H01R12/716 , H01R43/205 , H01R43/26 , H05K3/30 , H05K3/3436 , H05K7/10 , H05K7/1084 , H05K2201/10325 , H05K2201/1053 , Y10T29/49208
摘要： An adapter apparatus includes a substrate having a plurality of openings defined therethrough. Further, a deflectable element socket contact is provided in each of the openings. When a conductive male pin is positioned in contact between first and second deflectable elements of the deflectable element socket contact, at least a portion of the first and second deflectable elements are caused to deflect within first and second deflection regions, respectively, of the defined opening.
摘要翻译：适配器装置包括具有通过其限定的多个开口的基板。此外，在每个开口中设置可偏转元件插座触点。当导电阳销定位成在可偏转元件插座触头的第一和第二可偏转元件之间接触时，第一和第二可偏转元件的至少一部分分别在限定开口的第一和第二偏转区域内偏转。

4. 发明授权

US09835650B2 Packaged device adapter with parameter indication 有权
公开(公告)号：US09835650B2
公开(公告)日：2017-12-05
申请号：US14300808
申请日：2014-06-10
申请人： Ironwood Electronics, Inc.
发明人： Ilavarasan M. Palaniappa , Mickiel P. Fedde , Vinayak Reddy Panavala , Sultan M. Faiz , Scott Delano
IPC分类号： G01R1/04
CPC分类号： G01R1/0466
摘要： An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a socket lid assembly configured to apply a force upon a packaged device received in the socket cavity of the adapter body. A measurement apparatus associated with the socket lid assembly may include a measurement element (e.g., temperature sensing element, compressible element, etc.) that is configured to contact a packaged device received in the socket cavity when the socket lid assembly closes the socket cavity and applies a force upon the packaged device (e.g., a measurement signal is generated with use of the measurement element that is configured to contact the packaged device). An indicator may be configured to display a parameter based on the measurement signal (e.g., a count, a temperature, etc.).

5. 发明申请

US20150355234A1 PACKAGED DEVICE ADAPTER WITH PARAMETER INDICATION 有权
标题翻译：具有参数指示的包装设备适配器
公开(公告)号：US20150355234A1
公开(公告)日：2015-12-10
申请号：US14300808
申请日：2014-06-10
申请人： Ironwood Electronics, Inc.
发明人： Ilavarasan M. Palaniappa , Mickiel P. Fedde , Vinayak Reddy Panavala , Sultan M. Faiz , Scott Delano
IPC分类号： G01R1/04 , G01R31/28
CPC分类号： G01R1/0466
摘要： An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a socket lid assembly configured to apply a force upon a packaged device received in the socket cavity of the adapter body. A measurement apparatus associated with the socket lid assembly may include a measurement element (e.g., temperature sensing element, compressible element, etc.) that is configured to contact a packaged device received in the socket cavity when the socket lid assembly closes the socket cavity and applies a force upon the packaged device (e.g., a measurement signal is generated with use of the measurement element that is configured to contact the packaged device). An indicator may be configured to display a parameter based on the measurement signal (e.g., a count, a temperature, etc.).
摘要翻译：适配器装置和方法包括使用适配器主体，该适配器主体限定被配置为接收封装装置的插座空腔和被配置为向容纳在适配器主体的插座腔中的封装装置施加力的插座盖组件。与插座盖组件相关联的测量装置可以包括测量元件（例如，温度感测元件，可压缩元件等），其被配置为当插座盖组件关闭插座空腔时接触容纳在插座腔中的封装器件，对包装的装置施加力（例如，使用被配置为接触包装的装置的测量元件产生测量信号）。指示符可以被配置为基于测量信号（例如，计数，温度等）来显示参数。

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