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1. 发明授权

US09812795B2 Packaged device adapter with force applied using bearing apparatus 有权
公开(公告)号：US09812795B2
公开(公告)日：2017-11-07
申请号：US14930726
申请日：2015-11-03
申请人： IRONWOOD ELECTRONICS, INC.
发明人： Ilavarasan M. Palaniappa , Mickiel P. Fedde , Vinayak Reddy Panavala , Jacob Ray Vavra
IPC分类号： H01R4/50 , H01R4/38 , H01R12/50 , H01R12/72 , H01R12/89 , H05K7/10
CPC分类号： H01R4/5066 , H01R4/38 , H01R12/727 , H01R12/89 , H01R23/6893 , H05K7/1007 , H05K7/1061
摘要： An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a torque applicator configured to apply an axial force. A bearing structure positioned between the torque applicator and a packaged device may be used to transfer a force (e.g., an axial force) applied using the torque applicator to the packaged device.

2. 发明授权

US09048565B2 Adapter apparatus with deflectable element socket contacts 有权
标题翻译：具有可偏转元件插座触点的适配器设备
公开(公告)号：US09048565B2
公开(公告)日：2015-06-02
申请号：US13916025
申请日：2013-06-12
申请人： Ironwood Electronics, Inc.
发明人： Ilavarasan M. Palaniappa , Vinayak Reddy Panavala , Mickiel P. Fedde
IPC分类号： H01R12/57 , H01R43/26 , H01R12/71 , H01R43/20 , H05K3/30 , H05K7/10
CPC分类号： H01R12/57 , H01R12/716 , H01R43/205 , H01R43/26 , H05K3/30 , H05K3/3436 , H05K7/10 , H05K7/1084 , H05K2201/10325 , H05K2201/1053 , Y10T29/49208
摘要： An adapter apparatus includes a substrate having a plurality of openings defined therethrough. Further, a deflectable element socket contact is provided in each of the openings. When a conductive male pin is positioned in contact between first and second deflectable elements of the deflectable element socket contact, at least a portion of the first and second deflectable elements are caused to deflect within first and second deflection regions, respectively, of the defined opening.
摘要翻译：适配器装置包括具有通过其限定的多个开口的基板。此外，在每个开口中设置可偏转元件插座触点。当导电阳销定位成在可偏转元件插座触头的第一和第二可偏转元件之间接触时，第一和第二可偏转元件的至少一部分分别在限定开口的第一和第二偏转区域内偏转。

3. 发明申请

US20140370727A1 ADAPTER APPARATUS WITH SUSPENDED CONDUCTIVE ELASTOMER INTERCONNECT 有权
标题翻译：具有悬挂导电弹性体互连的适配器装置
公开(公告)号：US20140370727A1
公开(公告)日：2014-12-18
申请号：US13916097
申请日：2013-06-12
申请人： Ironwood Electronics, Inc.
发明人： Ilavarasan M. Palaniappa , Sue Min Huang
IPC分类号： H01R13/24 , H01R43/20
CPC分类号： H01R13/2414 , H01R12/718 , H01R43/205 , Y10T29/49147
摘要： An adapter apparatus for receiving a packaged device having a plurality of contact elements disposed on a surface thereof may include a conductive elastomer interconnect. The conductive elastomer interconnect may include a carrier having a plurality of openings defined therethrough from a first side to a second side thereof (e.g., the plurality of openings being arranged to align with the plurality of contact elements of the packaged device) and conductive elastomer suspended in each of the plurality of openings to contact a contact element of a plurality of contact elements of a packaged device when positioned adjacent the second side of the carrier. Further, the adapter apparatus may include one or more adapter wall members used with the conductive elastomer interconnect to define a socket cavity adapted to receive the packaged device.
摘要翻译：用于接收具有设置在其表面上的多个接触元件的封装装置的适配器装置可以包括导电弹性体互连。导电弹性体互连可以包括具有从其第一侧到第二侧限定穿过的多个开口的载体（例如，多个开口被布置成与封装装置的多个接触元件对准），并且导电弹性体悬挂在多个开口中的每一个中，当邻近载体的第二侧定位时，与打包装置的多个接触元件的接触元件接触。此外，适配器装置可以包括与导电弹性体互连件一起使用的一个或多个适配器壁构件，以限定适于接收封装装置的插座空腔。

4. 发明公开

US20240094245A1 TEST SOCKET WITH CONDUCTIVE COMPRESSION CONTACTS FOR INTEGRATED CIRCUITS 审中-公开
公开(公告)号：US20240094245A1
公开(公告)日：2024-03-21
申请号：US18464465
申请日：2023-09-11
申请人： Ironwood Electronics, Inc.
发明人： Ilavarasan M. Palaniappa , David A. Struyk
IPC分类号： G01R1/04 , G01R31/28
CPC分类号： G01R1/0466 , G01R31/2886
摘要： A test socket for an electronic circuit device with protruding circuit contacts, the test socket including an underlying PCB substrate with an overlaying electrically insulative housing, where the PCB substrate includes an array of electrically conductive vias extending therethrough, and the housing includes an array of socket apertures which align with the PCB vias and contain resiliently compressible electrically conductive compression contacts therein that connect electrically with the conductive vias of the PBC substrate. The socket apertures each have peripheral retention flaps which engage and retain the protruding circuit contacts of the electronic circuit device in electrical engagement with the conductive compression contacts within the socket apertures during testing.

5. 发明授权

US09263817B2 Adapter apparatus with suspended conductive elastomer interconnect 有权
标题翻译：具有悬挂导电弹性体互连的适配器装置
公开(公告)号：US09263817B2
公开(公告)日：2016-02-16
申请号：US13916097
申请日：2013-06-12
申请人： Ironwood Electronics, Inc.
发明人： Ilavarasan M. Palaniappa , Sue Min Huang
IPC分类号： H01R4/58 , H01R13/24 , H01R43/20 , H01R12/71
CPC分类号： H01R13/2414 , H01R12/718 , H01R43/205 , Y10T29/49147
摘要： An adapter apparatus for receiving a packaged device having a plurality of contact elements disposed on a surface thereof may include a conductive elastomer interconnect. The conductive elastomer interconnect may include a carrier having a plurality of openings defined therethrough from a first side to a second side thereof (e.g., the plurality of openings being arranged to align with the plurality of contact elements of the packaged device) and conductive elastomer suspended in each of the plurality of openings to contact a contact element of a plurality of contact elements of a packaged device when positioned adjacent the second side of the carrier. Further, the adapter apparatus may include one or more adapter wall members used with the conductive elastomer interconnect to define a socket cavity adapted to receive the packaged device.
摘要翻译：用于接收具有设置在其表面上的多个接触元件的封装装置的适配器装置可以包括导电弹性体互连。导电弹性体互连可以包括具有从其第一侧到第二侧限定穿过的多个开口的载体（例如，多个开口被布置成与封装装置的多个接触元件对准），并且导电弹性体悬挂在多个开口中的每一个中，当邻近载体的第二侧定位时，与打包装置的多个接触元件的接触元件接触。此外，适配器装置可以包括与导电弹性体互连件一起使用的一个或多个适配器壁构件，以限定适于接收封装装置的插座空腔。

6. 发明授权

US09877404B1 Adapter apparatus with socket contacts held in openings by holding structures 有权
公开(公告)号：US09877404B1
公开(公告)日：2018-01-23
申请号：US15417673
申请日：2017-01-27
申请人： IRONWOOD ELECTRONICS, INC.
发明人： Ilavarasan M. Palaniappa
IPC分类号： H01R24/00 , H05K7/10 , H01R12/70 , H01R43/20
CPC分类号： H05K7/10 , H01R12/57 , H01R12/7076 , H01R43/20
摘要： An adapter apparatus and method of forming the adapter apparatus includes providing a substrate with a plurality of layers. The layers include at least one socket contact holding layer that includes a plurality of holding structures positioned between a plurality of other layers. A plurality of socket contacts (e.g., each including an end connection portion and first and second deflectable element coupled thereto) are held in corresponding openings defined through the substrate at least in part by the plurality of holding structures.

7. 发明申请

US20140370725A1 ADAPTER APPARATUS WITH DEFLECTABLE ELEMENT SOCKET CONTACTS 有权
标题翻译：适配器与可拆卸元件插座联系
公开(公告)号：US20140370725A1
公开(公告)日：2014-12-18
申请号：US13916025
申请日：2013-06-12
申请人： Ironwood Electronics, Inc.
发明人： Ilavarasan M. Palaniappa , Vinayak Reddy Panavala , Mickiel P. Fedde
IPC分类号： H01R12/57 , H01R43/26
CPC分类号： H01R12/57 , H01R12/716 , H01R43/205 , H01R43/26 , H05K3/30 , H05K3/3436 , H05K7/10 , H05K7/1084 , H05K2201/10325 , H05K2201/1053 , Y10T29/49208
摘要： An adapter apparatus includes a substrate having a plurality of openings defined therethrough. Further, a deflectable element socket contact is provided in each of the openings. When a conductive male pin is positioned in contact between first and second deflectable elements of the deflectable element socket contact, at least a portion of the first and second deflectable elements are caused to deflect within first and second deflection regions, respectively, of the defined opening.
摘要翻译：适配器装置包括具有通过其限定的多个开口的基板。此外，在每个开口中设置可偏转元件插座触点。当导电阳销定位成在可偏转元件插座触头的第一和第二可偏转元件之间接触时，第一和第二可偏转元件的至少一部分分别在限定开口的第一和第二偏转区域内偏转。

8. 发明公开

US20240094242A1 PNEUMATIC SEMICONDUCTOR SOCKET LID ASSEMBLY 审中-公开
公开(公告)号：US20240094242A1
公开(公告)日：2024-03-21
申请号：US18464533
申请日：2023-09-11
申请人： Ironwood Electronics, Inc.
发明人： Jacob Vavra , Ilavarasan M. Palaniappa , David A. Struyk
IPC分类号： G01R1/04
CPC分类号： G01R1/0433
摘要： A socket lid for a semiconductor test socket which uses a plurality of pneumatic cylinders integrated into the socket lid to facilitate the application of a controlled and variable force to multiple zones of an electronic circuit device carried by the test socket. The socket lid includes a cylinder casing with multiple independently sealed pressure chambers, each of which incorporates a plurality a pneumatic cylinders which bear against separate and independently movable compression plates that engage different areas of the electronic circuit device carried by the semiconductor test socket, thus providing an adjustably variable force to multiple zones of the electronic circuit device under test.

9. 发明授权

US10122139B1 Adapter apparatus with conductive elements mounted using laminate layer and methods regarding same 有权
公开(公告)号：US10122139B1
公开(公告)日：2018-11-06
申请号：US15834479
申请日：2017-12-07
申请人： IRONWOOD ELECTRONICS, INC.
发明人： David Allen Struyk , Kenneth Irving Krawza , Ilavarasan M. Palaniappa , Sultan Mahmood Faiz
IPC分类号： H01R12/57 , H01R31/06 , H01R12/70 , H01R12/52 , H01R13/405
摘要： An adapter apparatus and methods for using in providing such adapter apparatus include providing a substrate having a plurality of openings defined therethrough. A plurality of conductive elements are mounted within corresponding openings thereof using a flowable and curable laminate material.

10. 发明授权

US09835650B2 Packaged device adapter with parameter indication 有权
公开(公告)号：US09835650B2
公开(公告)日：2017-12-05
申请号：US14300808
申请日：2014-06-10
申请人： Ironwood Electronics, Inc.
发明人： Ilavarasan M. Palaniappa , Mickiel P. Fedde , Vinayak Reddy Panavala , Sultan M. Faiz , Scott Delano
IPC分类号： G01R1/04
CPC分类号： G01R1/0466
摘要： An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a socket lid assembly configured to apply a force upon a packaged device received in the socket cavity of the adapter body. A measurement apparatus associated with the socket lid assembly may include a measurement element (e.g., temperature sensing element, compressible element, etc.) that is configured to contact a packaged device received in the socket cavity when the socket lid assembly closes the socket cavity and applies a force upon the packaged device (e.g., a measurement signal is generated with use of the measurement element that is configured to contact the packaged device). An indicator may be configured to display a parameter based on the measurement signal (e.g., a count, a temperature, etc.).

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