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1. 发明申请

US20020092594A1 Fixture for securing hard stops to a substrate 失效
标题翻译：用于将硬止动件固定到基板的夹具
公开(公告)号：US20020092594A1
公开(公告)日：2002-07-18
申请号：US09764592
申请日：2001-01-18
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Dennis Barringer , Mark A. Marnell , Steven J. Mazzuca , Donald W. Porter , Roger R. Schmidt , Wade H. White
IPC分类号： B32B031/00
CPC分类号： G01R1/0408 , G01R31/2887 , Y10S269/903 , Y10T156/17 , Y10T156/1744
摘要： An exemplary embodiment is a fixture for securing hard stops to a substrate. The fixture has a base which provides support to the fixture. The base has a cavity configured for nestably supporting a substrate. A top plate is mounted on the base, the top plate is configured for mounting the substrate. An alignment plate is disposed on the top plate separate from the base. An adjusting plunger assembly is coupled to the base. The adjusting plunger assembly is configured for use with attaching a hard stop to the substrate. A plunger is coupled to the base substantially perpendicular to the adjusting plunger assembly. The plunger is configured for use with supporting the substrate. A method of using a fixture is disclosed comprising disposing a substrate in a base of the fixture and mounting a hard stop to the substrate. An adhesive is disposed between the hard stop and the substrate. The substrate is mounted between a plunger and a top plate. The hard stop on the substrate is aligned with an alignment plate. An adjusting plunger assembly is adjusted to mount the hard stop to the substrate.
摘要翻译：示例性实施例是用于将硬止动件固定到基底的夹具。该固定装置具有为夹具提供支撑的基座。基座具有被配置为可嵌套地支撑衬底的空腔。顶板安装在基座上，顶板被配置用于安装基板。对准板设置在与基座分开的顶板上。调节柱塞组件联接到基座。调节柱塞组件构造成用于将硬止动件附接到基底上。柱塞与基座垂直于调节柱塞组件联接到基座。柱塞构造成用于支撑衬底。公开了一种使用固定装置的方法，包括将基板设置在固定装置的基座中，并将硬止动件安装到基板上。粘合剂设置在硬止动件和基板之间。衬底安装在柱塞和顶板之间。基板上的硬止动件与对准板对准。调节柱塞组件被调节以将硬质止挡件安装到基板上。

2. 发明申请

US20010050567A1 Segmented architecture for wafer test & burn-in 审中-公开
标题翻译：晶圆测试和老化的分段架构
公开(公告)号：US20010050567A1
公开(公告)日：2001-12-13
申请号：US09887211
申请日：2001-06-22
申请人： International Business Machines Corporation
发明人： Thomas W. Bachelder , Dennis R. Barringer , Dennis R. Conti , James M. Crafts , David L. Gardell , Paul M. Gaschke , Mark R. Laforce , Charles H. Perry , Roger R. Schmidt , Joseph J. Van Horn , Wade H. White
IPC分类号： G01R031/02
CPC分类号： G01R31/2863
摘要： An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burn-in to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation. Evacuation also provides atmospheric pressure augmentation of contact for connection between boards and contact to wafer. Probes for parallel testing of chips are arranged in crescent shaped stripes to significantly increase tester throughput as compared with probes arranged in an area array.
摘要翻译：用于在产品晶片上同时测试或燃烧大量集成电路芯片的装置包括安装在第一板上的探针和安装在第二板上的测试器芯片，连接两个板的电连接器。测试器芯片用于向产品芯片分配电力或用于测试产品芯片。其所附接的探针和薄膜布线被个性化以用于被探测的特定晶片的焊盘覆盖区。第一板和第二板的基座对于产品系列中的所有晶片都保持不变。使用两块板可以使测试仪芯片在老化期间保持在比产品芯片低得多的温度，以延长测试芯片的使用寿命。间隙可以用作板之间的绝热，并将间隙密封并抽真空以进行进一步的隔热。疏散还提供大气压力增加的接触，用于连接板和与晶片的接触。用于平行测试芯片的探针被布置成月牙形条纹，以便与布置在区域阵列中的探针相比显着增加测试仪的吞吐量。

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