专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09397471B2 Heat removal from photonic devices 有权
标题翻译：从光子器件散热
公开(公告)号：US09397471B2
公开(公告)日：2016-07-19
申请号：US14541367
申请日：2014-11-14
申请人： INTEL CORPORATION
发明人： Zhihua Li , Qing Tan , Qinrong Yu
IPC分类号： H01L23/66 , H01S5/024 , H01L31/024 , H01S5/022 , H01L31/02 , H01L31/0232 , H01S5/02
CPC分类号： H01S5/02476 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01S5/02276 , H01S5/02469 , H01S5/02484 , H01L2924/00014
摘要： Embodiments of the present description relate to mechanisms for transferring heat through a microelectronic substrate from a photonic device to a heat dissipation device. In one embodiment, the microelectronic substrate may comprise a highly thermally conductive dielectric material. In another embodiment, the microelectronic substrate may comprise a conductive insert within the microelectronic substrate wherein the photonic device is in thermal contact with the conductive insert proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the conductive insert proximate an opposing surface of the microelectronic substrate. In still another embodiment, a stepped heat spreader, having a base portion and a pedestal portion, has the pedestal portion inserted through the microelectronic substrate, wherein the photonic device is in thermal contact with the pedestal portion proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the base portion.
摘要翻译：本说明书的实施例涉及将热量从微电子衬底从光子器件传递到散热器件的机构。在一个实施例中，微电子衬底可以包括高导热介电材料。在另一个实施例中，微电子衬底可以包括在微电子衬底内的导电插入物，其中光子器件与微电子衬底的一个表面附近的导电插入件热接触，并且散热器件与导电插件紧邻相对的热接触微电子衬底的表面。在另一个实施例中，具有基座部分和基座部分的台阶式散热器具有穿过微电子衬底插入的基座部分，其中光子器件与靠近微电子衬底的一个表面的基座部分热接触，散热装置与基座部分热接触。

IPRDB

热门服务

关于我们

友情链接

联系方式