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1. 发明申请

US20220377883A1 PRINTED WIRING BOARD 有权
公开(公告)号：US20220377883A1
公开(公告)日：2022-11-24
申请号：US17748183
申请日：2022-05-19
申请人： IBIDEN CO., LTD.
发明人： Shigeto IYODA , Tomoyuki IKEDA
IPC分类号： H05K1/02 , H05K3/46
摘要： A printed wiring board includes resin insulating layers, and conductor layers including a conductor layer such that the conductor layer includes a conductor circuit and that the conductor circuit has a surface index X/Y in a range of 1.00 to 2.20 where X is a length of an outer circumference of cross section of the conductor circuit, and Y is a length of an outer circumference of a reference quadrangle in the cross section of the conductor circuit. The reference quadrangle has a first reference line drawn with reference to bottom of deepest recess on first side, a second reference line is drawn with reference to bottom of deepest recess on second side, a third reference line is drawn with reference to bottom of deepest recess on third side, and a fourth reference line is drawn with reference to bottom of deepest recess on fourth side of the outer circumference.

2. 发明申请

US20220369456A1 WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE 有权
公开(公告)号：US20220369456A1
公开(公告)日：2022-11-17
申请号：US17730283
申请日：2022-04-27
申请人： IBIDEN CO., LTD.
发明人： Tomoyuki IKEDA , Kentaro WADA
IPC分类号： H05K1/11 , H05K3/40
摘要： A wiring substrate includes a first insulating layer, a conductor layer formed on the first insulating layer, a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer, and a coating film formed on a surface of the conductor layer such that the coating film is adhering the conductor layer and the second insulating layer. The conductor layer includes a conductor pad and a wiring pattern, and the conductor pad of the conductor layer has a mounting surface including a first region and a component mounting region formed such that the second insulating layer has a through hole exposing the component mounting region and that the first region is covered by the second insulating layer and roughened to have a surface roughness higher than a first surface roughness of a surface of the wiring pattern facing the second insulating layer.

3. 发明申请

US20230076560A1 SEMICONDUCTOR PACKAGE 有权
公开(公告)号：US20230076560A1
公开(公告)日：2023-03-09
申请号：US17821534
申请日：2022-08-23
申请人： IBIDEN CO., LTD.
发明人： Keisuke SHIMIZU , Tomoyuki IKEDA
IPC分类号： G02B6/42 , H01L25/16
摘要： A semiconductor package includes a printed wiring board, a logic IC mounted on a first surface of the board, a connector mounted on a second surface of the board on the opposite side with respect to the first surface, an optical element that converts an optical signal and an electrical signal and positioned on the opposite side with respect to the first surface such that the optical element is at least partially embedded in the board, a path that is formed in the board and electrically connects the logic IC on the first surface and the optical element on the opposite side with respect to the first surface, and an optical waveguide that is embedded on the opposite side with respect to the first surface and optically connects the connector on the second surface and the optical element on the opposite side with respect to the first surface.

4. 发明申请

US20150216055A1 METHOD FOR MANUFACTURING PRINTED WIRING BOARD 审中-公开
标题翻译：制造印刷电路板的方法
公开(公告)号：US20150216055A1
公开(公告)日：2015-07-30
申请号：US14683185
申请日：2015-04-10
申请人： IBIDEN CO., LTD.
发明人： Tomoyuki IKEDA
IPC分类号： H05K3/00 , H05K3/42 , C25D5/02
CPC分类号： H05K3/0026 , C25D5/02 , H05K1/119 , H05K3/0032 , H05K3/0094 , H05K3/422 , H05K3/423 , H05K3/427 , H05K2201/09827 , H05K2201/09836 , H05K2201/09854 , H05K2203/1572 , Y10T29/49124 , Y10T29/49126
摘要： A method for manufacturing a printed wiring board including providing a starting material including an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface of the insulating resin substrate such that a first opening portion having an opening on the first surface is formed, irradiating laser upon the second surface of the insulating resin substrate such that a second opening portion having an opening on the second surface and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming a first conductor on the first surface of the insulating resin substrate, forming a second conductor on the second surface of the insulating resin substrate, and forming a through hole conductor structure in the penetrating-hole to electrically connecting the first conductor and the second conductor.
摘要翻译：一种制造印刷线路板的方法，包括提供包括具有第一和第二表面的绝缘树脂基板的起始材料，激光照射在绝缘树脂基板的第一表面上，使得形成在第一表面上具有开口的第一开口部分在绝缘性树脂基板的第二面上照射激光，形成在第二面上具有与第一开口部连通的第二开口部，形成具有第一开口部和第二开口部的贯通孔，在所述绝缘树脂基板的第一表面上形成第一导体，在所述绝缘树脂基板的第二表面上形成第二导体，并且在所述贯穿孔中形成通孔导体结构，以将所述第一导体和所述第二导体。

5. 发明申请

US20230069980A1 METHOD FOR MANUFACTURING WIRING SUBSTRATE 有权
公开(公告)号：US20230069980A1
公开(公告)日：2023-03-09
申请号：US17822883
申请日：2022-08-29
申请人： IBIDEN CO., LTD.
发明人： Tomoyuki IKEDA , Keisuke SHIMIZU , Hiroyuki WATANABE
IPC分类号： H05K3/38
摘要： A method for manufacturing a wiring substrate includes forming a resin insulating layer on a first conductor layer such that the resin insulating layer covers the first conductor layer, applying a roughening treatment on a surface of the resin insulating layer on the opposite side with respect to the first conductor layer, forming an opening in the resin insulating layer after the roughening treatment on the surface of the resin insulating layer such that the opening penetrates through the resin insulating layer and exposes a portion of the first conductor layer, and forming a second conductor layer on the surface of the resin insulating layer such that the second conductor layer is formed in contact with the surface of the resin insulating layer and that a via conductor is formed in the opening of the resin insulating layer.

6. 发明申请

US20220404564A1 SEMICONDUCTOR PACKAGE 有权
公开(公告)号：US20220404564A1
公开(公告)日：2022-12-22
申请号：US17752936
申请日：2022-05-25
申请人： IBIDEN CO., LTD.
发明人： Keisuke SHIMIZU , Tomoyuki IKEDA
IPC分类号： G02B6/42
摘要： A semiconductor package includes a printed wiring board, a logic IC mounted on the printed wiring board, a connector mounted on the printed wiring board, an optical element that is accommodated inside the printed wiring board and converts an optical signal to an electrical signal and/or the electrical signal to the optical signal, an optical waveguide formed between the optical element inside the printed wiring board and the connector on the printed wiring board such that the optical waveguide optically connects the optical element and the connector, and an electrical path formed between the optical element and the logic IC such that the electrical path connects the logic IC and the optical element and that a length of the electrical path is 1 mm or less.

7. 发明申请

US20220377884A1 PRINTED WIRING BOARD 有权
公开(公告)号：US20220377884A1
公开(公告)日：2022-11-24
申请号：US17748235
申请日：2022-05-19
申请人： IBIDEN CO., LTD.
发明人： Shigeto IYODA , Tomoyuki IKEDA
IPC分类号： H05K1/02
摘要： A printed wiring board includes resin insulating layers, and conductor layers laminated on the resin insulating layers, respectively. The conductor layers includes a conductor layer including a conductor circuit formed such that the conductor circuit has recesses each having a depth of 2.0 μm or more and a bottom whose diameter is larger than a diameter of an opening part of a respective one of the recesses.

8. 发明申请

US20220223532A1 WIRING SUBSTRATE 有权
公开(公告)号：US20220223532A1
公开(公告)日：2022-07-14
申请号：US17569837
申请日：2022-01-06
申请人： IBIDEN CO., LTD.
发明人： Tomoyuki IKEDA , Yoshinori TAKENAKA
IPC分类号： H01L23/538 , H01L21/48
摘要： A wiring substrate includes a core substrate, and a build-up part formed on the core substrate and including insulating layers and conductor layers. The conductor layers include one or more conductor layers each having a first wiring and a second wiring such that the second wiring has a conductor thickness smaller than a conductor thickness of the first wiring and that a minimum value of a line width of a wiring pattern of the second wiring is smaller than a minimum value of a line width of a wiring pattern of the first wiring.

9. 发明申请

US20160316566A1 WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有内置电子元件的接线板及其制造方法
公开(公告)号：US20160316566A1
公开(公告)日：2016-10-27
申请号：US15138792
申请日：2016-04-26
申请人： IBIDEN CO., LTD.
发明人： Kenji SAKAI , Tomoyuki IKEDA , Toshiki FURUTANI
IPC分类号： H05K1/18 , H05K3/46 , H05K3/32 , H05K1/02
CPC分类号： H05K1/185 , H01L2224/16227 , H05K1/0298 , H05K3/32 , H05K3/4602 , H05K3/4644 , H05K3/4652 , H05K3/4688 , H05K2201/0187 , H05K2201/09009 , H05K2201/09536 , H05K2201/09854 , H05K2201/10015 , H05K2201/10522 , H05K2201/10636 , H05K2203/0191 , H05K2203/1563 , Y02P70/611
摘要： A wiring board includes electronic components, a multilayer core substrate including insulating layers and conductive layers such that the insulating layers include a central insulating layer in the center position of the core in the thickness direction, a first build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core, and a second build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core. The core has cavities accommodating the electronic components, respectively, and including a first cavity and a second cavity such that the first and second cavities have different lengths in the thickness direction and are penetrating through the central layer at centers of the first and second cavities in the thickness direction.
摘要翻译：布线板包括电子部件，包括绝缘层和导电层的多层芯基板，使得绝缘层包括在芯的厚度方向的中心位置的中心绝缘层，包括绝缘层的第一累积层和导电层，使得所述绝缘层具有与所述芯中的绝缘层的树脂组合物不同的树脂组合物，以及包括绝缘层和导电层的第二堆积层，使得所述绝缘层具有与所述绝缘层不同的树脂组合物核心中的绝缘层。芯具有分别容纳电子元件的空腔，并且包括第一空腔和第二空腔，使得第一和第二空腔在厚度方向上具有不同的长度，并且在第一和第二空腔的中心穿过中心层厚度方向。

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