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    • 5. 发明授权
    • Electronic cooling device and fabrication method thereof
    • 电子冷却装置及其制造方法
    • US07679183B2
    • 2010-03-16
    • US12001679
    • 2007-12-11
    • Chang Hun Han
    • Chang Hun Han
    • H01L23/34
    • H01L23/38H01L27/14618H01L27/16H01L2924/0002H01L2924/00
    • Provided are an electronic cooling device and a fabrication method thereof. The method may include forming an insulating layer on a semiconductor substrate, forming first and second silicide layers on the insulating layer, forming separate paired p-type and n-type semiconductors on each of the first and second silicide layers, forming a first interlayer dielectric (ILD) layer on the p-type and n-type semiconductors, exposing top surfaces of the n-type and p-type semiconductors, forming a third silicide layer on one semiconductor on each of the first and second silicide layers, forming a second ILD layer on the third silicide layer, and etching the second and first ILD layers to form contact holes exposing top surfaces of the first and second silicide layers.
    • 提供一种电子冷却装置及其制造方法。 该方法可以包括在半导体衬底上形成绝缘层,在绝缘层上形成第一和第二硅化物层,在第一和第二硅化物层的每一个上形成单独的成对p型和n型半导体,形成第一层间电介质 (ILD)层,暴露n型和p型半导体的顶表面,在第一和第二硅化物层中的每一个上的一个半导体上形成第三硅化物层,形成第二硅化物层 ILD层,并且蚀刻第二和第一ILD层以形成暴露第一和第二硅化物层的顶表面的接触孔。
    • 6. 发明授权
    • CMOS image sensor and method for fabricating the same
    • CMOS图像传感器及其制造方法
    • US07675100B2
    • 2010-03-09
    • US12012937
    • 2008-02-05
    • Chang Hun Han
    • Chang Hun Han
    • H01L31/062H01L31/113
    • H01L27/14603H01L27/1463H01L27/14689
    • CMOS image sensor and method for fabricating the same, the CMOS image sensor including a second conductive type semiconductor substrate having an active region and a device isolation region defined therein, wherein the active region has a photodiode region and a transistor region defined therein, a device isolating film in the semiconductor substrate of the device isolation region, a first conductive type impurity region in the semiconductor substrate of the photodiode region, the first conductive type impurity region being spaced a distance from the device isolation film, and a second conductive type first impurity region in the semiconductor substrate between the first conductive type impurity region and the device isolation film, thereby reducing generation of a darkcurrent at an interface between the photodiode region and a field region.
    • CMOS图像传感器及其制造方法,CMOS图像传感器包括具有限定在其中的有源区和器件隔离区的第二导电型半导体衬底,其中有源区具有限定在其中的光电二极管区和晶体管区, 在器件隔离区域的半导体衬底中的隔离膜,在光电二极管区域的半导体衬底中的第一导电类型杂质区域,与器件隔离膜间隔一定距离的第一导电类型杂质区域和第二导电类型第一杂质 在第一导电型杂质区域和器件隔离膜之间的半导体衬底中的区域,从而减少在光电二极管区域和场区域之间的界面处的产生暗电流。
    • 7. 发明授权
    • Image sensor having a partial light-shielding layer and method for fabricating the same
    • 具有部分遮光层的图像传感器及其制造方法
    • US07667749B2
    • 2010-02-23
    • US11020525
    • 2004-12-27
    • Chang Hun Han
    • Chang Hun Han
    • H04N3/14H01L31/062H04N5/225
    • H04N9/045H01L27/14621H01L27/14623H01L27/14645H01L27/14685H04N2209/045
    • An image sensor and a method for fabricating the same are disclosed, in which a partial light-shielding layer is additionally arranged on a path of a particular colored light, for example, a red colored light that may cause excessive permeation, to partially shield the corresponding red colored light in a state that red colored light, green colored light and blue colored light are permeated into each photodiode of a semiconductor substrate, so that the permeation position of the red colored light coincides with that of the green colored light and the blue colored light each having the wavelength shorter than that of the red colored light, thereby normally generating optical charges caused by the red colored light in an effective depletion area of the photodiode like those caused by the green colored light and the blue colored light. The permeation position of a red colored light, a green colored light and a blue colored light coincides with one another within a depletion area of a semiconductor substrate to obtain an optimal effective ratio from respective optical charges and the uniform quantity of the respective optical charges can be transferred/discharged to an interpolation circuit by signal processing transistors, thereby effectively displaying color images having excellent display quality (in color and resolution) approximate to a ratio of 1:1:1 with red, green and blue.
    • 公开了一种图像传感器及其制造方法,其中部分遮光层另外布置在特定有色光的路径上,例如可能引起过度渗透的红色光,以部分屏蔽层 在红色的光,绿色的光和蓝色的光的状态下,相应的红色的光被透过到半导体衬底的每个光电二极管中,使得红色的光的透过位置与绿色的光和蓝色的一致 每一个都具有比红色光的波长短的彩色光,从而通常产生由光电二极管的有效耗尽区域中的红色光引起的光电荷,如由绿色光和蓝色光引起的那样。 红色光,绿色光和蓝色光的透过位置在半导体衬底的耗尽区域内彼此重合,从各光电荷获得最佳有效比,并且各个光电荷的均匀量可以 通过信号处理晶体管传输/放电到内插电路,从而以红色,绿色和蓝色有效地显示具有优良的显示质量(颜色和分辨率)的比例为1:1:1的彩色图像。
    • 8. 发明授权
    • CMOS image sensor and method for manufacturing the same
    • CMOS图像传感器及其制造方法
    • US07582504B2
    • 2009-09-01
    • US11319596
    • 2005-12-29
    • Chang Hun Han
    • Chang Hun Han
    • H01L21/00H01L31/062H01L31/113
    • H01L27/14685H01L27/14621H01L27/14627H01L27/14632
    • A CMOS image sensor and a method for manufacturing the same are provided, in which a nitride layer for passivation is used as a microlens to reduce topology. The CMOS image sensor includes an upper metal layer partially deposited on a dielectric layer; a first nitride layer deposited on the upper metal layer; an undoped silicon glass layer deposited on the first nitride layer and polished by chemical-mechanical polishing; color filter array elements deposited and exposed on the undoped silicon glass layer and polished by the chemical-mechanical polishing; and a second nitride layer deposited on the first nitride layer and the color filter array elements and transfer-etched after forming a sacrificial microlens on the second nitride layer.
    • 提供一种CMOS图像传感器及其制造方法,其中使用用于钝化的氮化物层作为微透镜以减少拓扑结构。 CMOS图像传感器包括部分沉积在电介质层上的上金属层; 沉积在上金属层上的第一氮化物层; 沉积在第一氮化物层上并通过化学机械抛光抛光的未掺杂的硅玻璃层; 滤色器阵列元件沉积并暴露在未掺杂的硅玻璃层上,并通过化学机械抛光抛光; 以及沉积在第一氮化物层和滤色器阵列元件上的第二氮化物层,并且在第二氮化物层上形成牺牲微透镜之后进行转印蚀刻。
    • 9. 发明授权
    • Method for manufacturing a CMOS image sensor
    • CMOS图像传感器的制造方法
    • US07537999B2
    • 2009-05-26
    • US10746702
    • 2003-12-24
    • Chang Hun Han
    • Chang Hun Han
    • H01L21/336
    • H01L27/14689H01L27/14603H01L27/14643H01L31/035272
    • A method for manufacturing structures of a CMOS image sensor. The method comprises the steps of depositing a gate insulating layer and a conductive layer on a semiconductor substrate; depositing an ion implantation barrier layer on the conductive layer; patterning the deposited gate insulating layer, conductive layer and ion implantation barrier layer to form a patterned, composite gate insulating layer, gate electrode and ion implantation barrier structure; forming a second photosensitive layer pattern to define a photodiode region; and implanting low-concentration dopant ions into the substrate using the second photosensitive layer pattern as an ion implantation mask to form a low-concentration dopant region within the photodiode region.
    • 一种用于制造CMOS图像传感器的结构的方法。 该方法包括以下步骤:在半导体衬底上沉积栅绝缘层和导电层; 在导电层上沉积离子注入阻挡层; 图案化沉积的栅极绝缘层,导电层和离子注入阻挡层,以形成图案化的复合栅极绝缘层,栅电极和离子注入阻挡结构; 形成第二感光层图案以限定光电二极管区域; 以及使用所述第二感光层图案作为离子注入掩模将低浓度掺杂剂离子注入到所述衬底中,以在所述光电二极管区域内形成低浓度掺杂剂区域。
    • 10. 发明授权
    • CMOS image sensor and method of fabricating the same
    • CMOS图像传感器及其制造方法
    • US07507635B2
    • 2009-03-24
    • US11318434
    • 2005-12-28
    • Chang Hun Han
    • Chang Hun Han
    • H01L21/76
    • H01L27/14689H01L27/14603H01L27/1463
    • A CMOS image sensor and method for fabricating the same, wherein the CMOS image sensor has minimized dark current at the boundary area between a photodiode and an isolation layer. The present invention includes a first-conductivity-type doping area formed in the device isolation area of the substrate, the first-conductivity-type doping area surrounding the isolation area and a dielectric layer formed between the isolation layer and the first-conductivity-type doping area, wherein the first-conductivity-type doping area and the dielectric layer are located between the isolation layer and a second-conductivity-type diffusion area.
    • 一种CMOS图像传感器及其制造方法,其中CMOS图像传感器在光电二极管和隔离层之间的边界区域具有最小化的暗电流。 本发明包括在衬底的器件隔离区域中形成的第一导电型掺杂区域,围绕隔离区域的第一导电型掺杂区域和形成在隔离层和第一导电型之间的介电层 掺杂区域,其中所述第一导电型掺杂区域和所述介电层位于所述隔离层和第二导电型扩散区域之间。