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    • 4. 发明授权
    • Binary mask, method for fabricating the binary mask, and method for fabricating fine pattern of semiconductor device using binary mask
    • 二进制掩模,二进制掩模的制造方法以及使用二元掩模制造半导体器件的精细图案的方法
    • US07939226B2
    • 2011-05-10
    • US12134534
    • 2008-06-06
    • Hye Mi Lee
    • Hye Mi Lee
    • G03F1/00G03F7/00
    • G03F1/32
    • Provided are a binary mask, a method for fabricating the binary mask, and a method for fabricating a fine pattern of semiconductor device. In the method for fabricating the fine pattern, a binary mask including phase shift layer patterns is prepared on a transparent substrate. A semiconductor substrate including an etch objective layer and a resist layer is prepared. An exposure operation using the binary mask and a light source of a short wavelength is performed to transfer the phase shift layer patterns of the binary mask onto the resist layer of the semiconductor substrate. The resist layer to which the patterns have been transferred is developed to form resist layer patterns selectively exposing the etch objective layer. Exposed portions of the etch objective layer are etched using the resist layer patterns as an etch mask to form etch objective layer patterns. The resist layer patterns are removed.
    • 提供二进制掩模,二进制掩模的制造方法以及制造半导体器件精细图案的方法。 在精细图案的制造方法中,在透明基板上制备包括相移层图案的二值掩模。 制备包括蚀刻目标层和抗蚀剂层的半导体衬底。 执行使用二进制掩模和短波长的光源的曝光操作,以将二进制掩模的相移层图案转印到半导体衬底的抗蚀剂层上。 已经转印图案的抗蚀剂层被显影以形成选择性地暴露蚀刻目标层的抗蚀剂层图案。 使用抗蚀剂层图案作为蚀刻掩模蚀刻蚀刻目标层的暴露部分以形成蚀刻目标层图案。 去除抗蚀剂层图案。