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    • 1. 发明授权
    • Automatic intelligent yield improving and process parameter multivariate system and the analysis method thereof
    • 自动智能产量提高和过程参数多变量系统及其分析方法
    • US07079677B2
    • 2006-07-18
    • US10249148
    • 2003-03-19
    • Hung-En TaiSheng-Jen Wang
    • Hung-En TaiSheng-Jen Wang
    • G06K9/00G06K9/36
    • G06Q10/04G05B2219/32191G05B2219/45031H01L21/67276Y02P90/22
    • An automatic intelligent yield improving and process parameter multivariate analysis system and the analysis method thereof. The system is applied to a computer to set up analysis procedures for analyzing process parameters obtained from each measuring machine in semiconductor testing process by utilizing data mining technology. The system includes a plurality of semiconductor processing nodes having different functions. The system links each of the semiconductor processing node to another semiconductor processing node by a logic means so that the computer can process the semiconductor processing nodes sequentially. The system also links the semiconductor processing nodes by a data connection means to allow microprocessors to load necessary parameter data or wafer lot numbers from corresponding semiconductor processing nodes by a data connection means.
    • 一种自动智能产量提高和过程参数多变量分析系统及其分析方法。 该系统应用于计算机,通过利用数据挖掘技术,在半导体测试过程中设置分析从每台测量机获得的工艺参数的分析程序。 该系统包括具有不同功能的多个半导体处理节点。 该系统通过逻辑装置将每个半导体处理节点连接到另一个半导体处理节点,使得计算机可以顺序地处理半导体处理节点。 该系统还通过数据连接装置连接半导体处理节点,以允许微处理器通过数据连接装置从相应的半导体处理节点加载必要的参数数据或晶片批号。
    • 3. 发明授权
    • Method of managing wafer defects
    • 晶圆缺陷管理方法
    • US07412090B2
    • 2008-08-12
    • US10711310
    • 2004-09-09
    • Hung-En TaiChia-Yun ChenSheng-Jen Wang
    • Hung-En TaiChia-Yun ChenSheng-Jen Wang
    • G06K9/00
    • G01N21/9501
    • A method of managing wafer defects includes inspecting each chip in a wafer to generate a unit of wafer defect raw data, using a server to integrate the unit of wafer defect raw data to generate a unit of wafer defect distribution data for recording positions, types, and sizes of defects, using the server to generate a corresponding drawing file according to the unit wafer defect distribution data to show all kinds of defect distributions, and transmitting the drawing file to a terminal such that terminal users can view the defect distributions without receiving the unit of wafer defect raw data.
    • 管理晶片缺陷的方法包括检查晶片中的每个芯片以产生晶片缺陷原始数据的单元,使用服务器来整合晶片缺陷原始数据的单元以产生用于记录位置,类型的晶片缺陷分布数据的单元, 和尺寸的缺陷,使用服务器根据单位晶片缺陷分布数据生成相应的图形文件以显示各种缺陷分布,并将绘图文件发送到终端,使得终端用户可以在不接收到缺陷分布的情况下查看缺陷分布 晶圆缺陷原始数据单位。
    • 5. 发明申请
    • Method of Managing Wafer Defects
    • 晶圆缺陷管理方法
    • US20060050950A1
    • 2006-03-09
    • US10711310
    • 2004-09-09
    • Hung-En TaiChia-Yun ChenSheng-Jen Wang
    • Hung-En TaiChia-Yun ChenSheng-Jen Wang
    • G06K9/00
    • G01N21/9501
    • A method of managing wafer defects includes inspecting each chip in a wafer to generate a unit of wafer defect raw data, using a server to integrate the unit of wafer defect raw data to generate a unit of wafer defect distribution data for recording positions, types, and sizes of defects, using the server to generate a corresponding drawing file according to the unit wafer defect distribution data to show all kinds of defect distributions, and transmitting the drawing file to a terminal such that terminal users can view the defect distributions without receiving the unit of wafer defect raw data.
    • 管理晶片缺陷的方法包括检查晶片中的每个芯片以产生晶片缺陷原始数据的单元,使用服务器来整合晶片缺陷原始数据的单元以产生用于记录位置,类型的晶片缺陷分布数据的单元, 和尺寸的缺陷,使用服务器根据单位晶片缺陷分布数据生成相应的图形文件以显示各种缺陷分布,并将绘图文件发送到终端,使得终端用户可以在不接收到缺陷分布的情况下查看缺陷分布 晶圆缺陷原始数据单位。