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1. 发明授权

US06999897B2 Method and related system for semiconductor equipment early warning management 失效
标题翻译：半导体设备预警管理方法及相关系统
公开(公告)号：US06999897B2
公开(公告)日：2006-02-14
申请号：US10708573
申请日：2004-03-11
申请人： Hung-En Tai , Chien-Chung Chen , Haw-Jyue Luo , Sheng-Jen Wang
发明人： Hung-En Tai , Chien-Chung Chen , Haw-Jyue Luo , Sheng-Jen Wang
IPC分类号： G11C7/00
CPC分类号： G05B19/41875 , Y02P90/22
摘要： A method and related system for semiconductor equipment early warning management. The method includes recording process parameters of each piece of equipment, recording equipment parameters when each piece of equipment is processing, evaluating and recording the quality of semiconductor products and corresponding testing parameters, and analyzing a relationship between the corresponding process parameters, the corresponding equipment parameters, and the quality of semiconductor products of each piece of equipment.
摘要翻译：一种半导体设备预警管理方法及相关系统。该方法包括记录每件设备的处理参数，每台设备处理时记录设备参数，评估和记录半导体产品的质量和相应的测试参数，分析相应工艺参数，相应设备参数之间的关系，以及每件设备的半导体产品的质量。

2. 发明申请

US20050203715A1 METHOD AND RELATED SYSTEM FOR SEMICONDUCTOR EQUIPMENT EARLY WARNING MANAGEMENT 失效
标题翻译：用于半导体设备的方法和相关系统早期警告管理
公开(公告)号：US20050203715A1
公开(公告)日：2005-09-15
申请号：US10708573
申请日：2004-03-11
申请人： Hung-En Tai , Chien-Chung Chen , Haw-Jyue Luo , Sheng-Jen Wang
发明人： Hung-En Tai , Chien-Chung Chen , Haw-Jyue Luo , Sheng-Jen Wang
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , Y02P90/22
摘要： A method and related system for semiconductor equipment early warning management. The method includes recording process parameters of each piece of equipment, recording equipment parameters when each piece of equipment is processing, evaluating and recording the quality of semiconductor products and corresponding testing parameters, and analyzing a relationship between the corresponding process parameters, the corresponding equipment parameters, and the quality of semiconductor products of each piece of equipment.
摘要翻译：一种半导体设备预警管理方法及相关系统。该方法包括记录每件设备的处理参数，每台设备处理时记录设备参数，评估和记录半导体产品的质量和相应的测试参数，分析相应工艺参数，相应设备参数之间的关系，以及每件设备的半导体产品的质量。

3. 发明授权

US07099729B2 Semiconductor process and yield analysis integrated real-time management method 失效
标题翻译：半导体工艺和产量分析集成实时管理方法
公开(公告)号：US07099729B2
公开(公告)日：2006-08-29
申请号：US10708277
申请日：2004-02-20
申请人： Hung-En Tai , Chien-Chung Chen , Sheng-Jen Wang
发明人： Hung-En Tai , Chien-Chung Chen , Sheng-Jen Wang
IPC分类号： G06F19/00
CPC分类号： H01L22/20 , G05B2219/32191 , Y02P90/22
摘要： A semiconductor process and yield analysis integrated real-time management method comprises inspecting a plurality of semiconductor products with a plurality of items to generate and record a plurality of inspecting results during semiconductor process, classifying the semiconductor products as a plurality of groups with a default rule to generate and record an initial data in a database, indexing a plurality of semiconductor product groups and the corresponding initial data from the database by a default product rule and parameter to calculate a corresponding analysis result, and displaying the analysis result according to the indexed semiconductor product groups and the initial data.
摘要翻译：集成实时管理方法的半导体工艺和成品率分析包括在半导体处理期间检查多个半导体产品以产生并记录多个检查结果，并将半导体产品作为具有默认规则的多个组进行分类在数据库中生成和记录初始数据，通过默认产品规则和参数从数据库索引多个半导体产品组和相应的初始数据，以计算相应的分析结果，并根据索引的半导体显示分析结果产品组和初始数据。

4. 发明授权

US06950783B1 Method and related system for semiconductor equipment prevention maintenance management 有权
标题翻译：半导体设备预防维护管理方法及相关系统
公开(公告)号：US06950783B1
公开(公告)日：2005-09-27
申请号：US10708572
申请日：2004-03-11
申请人： Hung-En Tai , Chien-Chung Chen , Sheng-Jen Wang
发明人： Hung-En Tai , Chien-Chung Chen , Sheng-Jen Wang
IPC分类号： G06F19/00 , G21C17/00
CPC分类号： H01L22/20 , G05B19/41875 , G06Q30/0283 , Y02P90/22
摘要： A method and related system for semiconductor equipment prevention maintenance management. The method includes recording process parameters of each piece of equipment, recording equipment parameters when each piece of equipment is processing, evaluating and recording time and cost of prevention maintenance after each piece of equipment runs prevention maintenance, evaluating the quality of semiconductor products, and analyzing a relationship between the corresponding process parameter, the corresponding equipment parameters, prevention maintenance cost, and semiconductor products of each piece of equipment.
摘要翻译：一种半导体设备预防维护管理方法及相关系统。该方法包括记录每件设备的工艺参数，每台设备的加工记录设备参数，每台设备运行后的预防维护的评估和记录时间和成本预防维护，半导体产品的质量评估和分析相应的过程参数，相应的设备参数，预防维护成本以及每件设备的半导体产品之间的关系。

5. 发明申请

US20050187648A1 SEMICONDUCTOR PROCESS AND YIELD ANALYSIS INTEGRATED REAL-TIME MANAGEMENT METHOD 失效
标题翻译：半导体工艺和分析实时管理方法
公开(公告)号：US20050187648A1
公开(公告)日：2005-08-25
申请号：US10708277
申请日：2004-02-20
申请人： Hung-En Tai , Chien-Chung Chen , Sheng-Jen Wang
发明人： Hung-En Tai , Chien-Chung Chen , Sheng-Jen Wang
IPC分类号： G05B19/418 , G05B23/02 , H01L21/02 , G06F19/00
CPC分类号： H01L22/20 , G05B2219/32191 , Y02P90/22
摘要： A semiconductor process and yield analysis integrated real-time management method comprises inspecting a plurality of semiconductor products with a plurality of items to generate and record a plurality of inspecting results during semiconductor process, classifying the semiconductor products as a plurality of groups with a default rule to generate and record an initial data in a database, indexing a plurality of semiconductor product groups and the corresponding initial data from the database by a default product rule and parameter to calculate a corresponding analysis result, and displaying the analysis result according to the indexed semiconductor product groups and the initial data.
摘要翻译：集成实时管理方法的半导体工艺和成品率分析包括在半导体处理期间检查多个半导体产品以产生并记录多个检查结果，并将半导体产品作为具有默认规则的多个组进行分类在数据库中生成和记录初始数据，通过默认产品规则和参数从数据库索引多个半导体产品组和相应的初始数据，以计算相应的分析结果，并根据索引的半导体显示分析结果产品组和初始数据。

6. 发明申请

US20050203858A1 METHOD AND RELATED SYSTEM FOR SEMICONDUCTOR EQUIPMENT PREVENTION MAINTENANCE MANAGEMENT 有权
标题翻译：半导体设备预防维护管理方法与相关系统
公开(公告)号：US20050203858A1
公开(公告)日：2005-09-15
申请号：US10708572
申请日：2004-03-11
申请人： Hung-En Tai , Chien-Chung Chen , Sheng-Jen Wang
发明人： Hung-En Tai , Chien-Chung Chen , Sheng-Jen Wang
IPC分类号： G06F19/00 , G21C17/00
CPC分类号： H01L22/20 , G05B19/41875 , G06Q30/0283 , Y02P90/22
摘要： A method and related system for semiconductor equipment prevention maintenance management. The method includes recording process parameters of each piece of equipment, recording equipment parameters when each piece of equipment is processing, evaluating and recording time and cost of prevention maintenance after each piece of equipment runs prevention maintenance, evaluating the quality of semiconductor products, and analyzing a relationship between the corresponding process parameter, the corresponding equipment parameters, prevention maintenance cost, and semiconductor products of each piece of equipment.
摘要翻译：一种半导体设备预防维护管理方法及相关系统。该方法包括记录每件设备的工艺参数，每台设备的加工记录设备参数，每台设备运行后的预防维护的评估和记录时间和成本预防维护，半导体产品的质量评估和分析相应的过程参数，相应的设备参数，预防维护成本以及每件设备的半导体产品之间的关系。

7. 发明授权

US07218981B1 Dispatch integration system and method based on semiconductor manufacturing 失效
标题翻译：基于半导体制造的调度集成系统和方法
公开(公告)号：US07218981B1
公开(公告)日：2007-05-15
申请号：US11401900
申请日：2006-04-12
申请人： Yu-Wen Ho , Hung-En Tai , Chien-Chung Chen
发明人： Yu-Wen Ho , Hung-En Tai , Chien-Chung Chen
IPC分类号： G06F19/00
CPC分类号： G05B19/4187 , G05B2219/32257 , G05B2219/45031 , Y02P90/12 , Y02P90/205
摘要： A dispatch integration method based on semiconductor manufacturing. When multiple tools are idle, idle messages are sent to a real-time dispatch system through a tool control system and a manufacturing execution system. The real-time dispatch system sorts tool parameters relating to tool efficiency based on a currently executed process using a principal component analysis method, defining weights of each tool according to the defined tool parameters and corresponding factor weights using a linear regression weight formula, calculating tool weights of each tool parameter using a linear regression weight formula, and determining a desired tool for dispatch according to the calculated tool weights.
摘要翻译：基于半导体制造的调度集成方法。当多个工具空闲时，空闲消息通过工具控制系统和制造执行系统发送到实时调度系统。实时调度系统基于使用主成分分析方法的当前执行的过程来分类与工具效率相关的工具参数，根据所定义的工具参数和相应的因子权重使用线性回归权重公式定义每个工具的权重，计算工具使用线性回归权重公式的每个工具参数的权重，以及根据所计算的工具权重确定用于调度的期望工具。

8. 发明申请

US20070129833A1 DISPATCH INTEGRATION SYSTEM AND METHOD BASED ON SEMICONDUCTOR MANUFACTURING 失效
标题翻译：基于半导体制造的分布式集成系统和方法
公开(公告)号：US20070129833A1
公开(公告)日：2007-06-07
申请号：US11401900
申请日：2006-04-12
申请人： Yu-Wen Ho , Hung-En Tai , Chien-Chung Chen
发明人： Yu-Wen Ho , Hung-En Tai , Chien-Chung Chen
IPC分类号： G06F19/00
CPC分类号： G05B19/4187 , G05B2219/32257 , G05B2219/45031 , Y02P90/12 , Y02P90/205
摘要： A dispatch integration method based on semiconductor manufacturing. When multiple tools are idle, idle messages are sent to a real-time dispatch system through a tool control system and a manufacturing execution system. The real-time dispatch system sorts tool parameters relating to tool efficiency based on a currently executed process using a principal component analysis method, defining weights of each tool according to the defined tool parameters and corresponding factor weights using a linear regression weight formula, calculating tool weights of each tool parameter using a linear regression weight formula, and determining a desired tool for dispatch according to the calculated tool weights.
摘要翻译：基于半导体制造的调度集成方法。当多个工具空闲时，空闲消息通过工具控制系统和制造执行系统发送到实时调度系统。实时调度系统基于使用主成分分析方法的当前执行的过程来分类与工具效率相关的工具参数，根据所定义的工具参数和相应的因子权重使用线性回归权重公式定义每个工具的权重，计算工具使用线性回归权重公式的每个工具参数的权重，以及根据所计算的工具权重确定用于调度的期望工具。

9. 发明授权

US06898539B2 Method for analyzing final test parameters 有权
标题翻译：分析最终测试参数的方法
公开(公告)号：US06898539B2
公开(公告)日：2005-05-24
申请号：US10604979
申请日：2003-08-29
申请人： Hung-En Tai , Chien-Chung Chen
发明人： Hung-En Tai , Chien-Chung Chen
IPC分类号： G01R31/26 , G05B19/418 , G06F11/30 , G06F19/00 , H01L21/66
CPC分类号： G05B19/41875 , G05B2219/32222 , G05B2219/45031 , H01L22/20 , H01L2924/0002 , Y02P90/14 , Y02P90/22 , H01L2924/00
摘要： A method for analyzing final test parameters includes the following steps: To retrieve the final test parameters of each product lots by searching a database. To compare the final test parameters to select a representative final test parameter and a representative final test item. To determine if the representative final test item is correlated to a packaging process step. To classify the plurality of product lots into at least a first qualified group and a first failed group according to the representative final test item if there is correlation. To search for the equipment through which the first qualified group or the first failed group had passed in the packaging process step. To determine the equipment having a probability of having processed the first failed group being greater than a probability of having processed the first qualified group.
摘要翻译：分析最终测试参数的方法包括以下步骤：通过搜索数据库来检索每个产品批次的最终测试参数。比较最终测试参数以选择代表性的最终测试参数和代表性的最终测试项目。确定代表性的最终测试项目是否与包装过程步骤相关。如果存在相关性，则根据代表性的最终测试项目将多个产品批次分类为至少第一合格组和第一故障组。在包装过程中搜索第一个合格组或第一个故障组通过的设备。确定具有处理第一故障组的可能性的设备大于处理第一合格组的概率。

10. 发明申请

US20060241802A1 REAL-TIME MANAGEMENT SYSTEMS AND METHODS FOR MANUFACTURING MANAGEMENT AND YIELD RATE ANALYSIS INTEGRATION 失效
标题翻译：实时管理系统及其制造管理和收费率分析整合方法
公开(公告)号：US20060241802A1
公开(公告)日：2006-10-26
申请号：US11228361
申请日：2005-09-19
申请人： Chien-Chung Chen , Sheng-Jen Wang , Yu-Wen Ho
发明人： Chien-Chung Chen , Sheng-Jen Wang , Yu-Wen Ho
IPC分类号： G06F19/00
CPC分类号： H01L21/67276 , G05B15/02 , G05B23/024 , G05B2219/1112 , G05B2219/45031 , G05B2223/02
摘要： A real-time management method for manufacturing management and yield rate analysis integration. A plurality of yield rates relating to wafer products are summed and averaged for a historical yield rate. Multiple representational inline QC parameters are selected. A statistical process is implemented and, if no extreme value and collinear parameter exists and if analysis results satisfy normal distribution, multiple optimum inline QC parameters are selected from the representational inline QC parameters. Weights of each optimum inline QC parameter are calculated. A predicted yield rate is calculated according to the historical yield rate, weights, and a plurality of measurement and target values relating to the wafer products.
摘要翻译：制造管理和产出率分析整合的实时管理方法。将与晶片产品相关的多个屈服率以历史产量率相加和平均。选择多个代表性的在线QC参数。实施统计过程，如果没有极值和共线参数存在，并且如果分析结果满足正态分布，则从表示的在线QC参数中选择多个最佳在线QC参数。计算每个最佳在线QC参数的权值。根据历史收益率，权重以及与晶片产品相关的多个测量值和目标值来计算预测收益率。

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