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1. 发明申请

US20100070658A1 METHOD OF COMMUNICATION BETWEEN A PROTOCOL-PROCESSING UNIT AND AN INPUT/OUTPUT (I/O) DEVICE THROUGH A DEVICE INTERFACE CONTROLLER 审中-公开
标题翻译：协议处理单元与通过设备接口控制器的输入/输出（I / O）设备之间的通信方法
公开(公告)号：US20100070658A1
公开(公告)日：2010-03-18
申请号：US12555869
申请日：2009-09-09
申请人： Hung-Chih Chiang , Ming-Feng Wu , Shih-Ching Hsiao , Chi-Cheng Cheng , Yau-Wen Liu , Chang-Ming Tsai
发明人： Hung-Chih Chiang , Ming-Feng Wu , Shih-Ching Hsiao , Chi-Cheng Cheng , Yau-Wen Liu , Chang-Ming Tsai
IPC分类号： G06F3/00
CPC分类号： G06F12/0868 , G06F13/385 , G06F2212/311
摘要： A method of communication between a protocol-processing unit and an input/output (I/O) device through a device interface controller includes configuring the protocol-processing unit to write command/message data in a predefined write file, and configuring the device interface controller to translate the command/message data written in the predefined write file into a corresponding command/message and to transmit the corresponding command/message thus translated to the I/O device. A system that includes the protocol-processing unit and the device interface controller is also disclosed.
摘要翻译：通过设备接口控制器在协议处理单元和输入/输出（I / O）设备之间通信的方法包括配置协议处理单元以在预定义的写入文件中写入命令/消息数据，以及配置设备接口控制器将写入预定义写入文件的命令/消息数据转换成相应的命令/消息，并将相应的命令/消息传送到I / O设备。还公开了包括协议处理单元和设备接口控制器的系统。

2. 发明申请

US20090300223A1 METHOD FOR COMMUNICATION BETWEEN AN ELECTRONIC DEVICE AND A TARGET INPUT/OUTPUT DEVICE IN A SECURE DIGITAL INPUT/OUTPUT CARD THROUGH A SECURE DIGITAL INTERFACE, AND SYSTEM FOR IMPLEMENTING THE SAME 审中-公开
标题翻译：用于通过安全数字接口在安全数字输入/输出卡中的电子设备与目标输入/输出设备之间的通信的方法，以及用于实现其的系统
公开(公告)号：US20090300223A1
公开(公告)日：2009-12-03
申请号：US12472769
申请日：2009-05-27
申请人： Hung-Chih Chiang , Ming-Feng Wu , Shih-Ching Hsiao , Chi-Cheng Cheng , Yau-Wen Liu
发明人： Hung-Chih Chiang , Ming-Feng Wu , Shih-Ching Hsiao , Chi-Cheng Cheng , Yau-Wen Liu
IPC分类号： G06F3/00
CPC分类号： G06F13/385 , G06F21/85
摘要： A method for communication between an electronic device and a target input/output (I/O) device in a secure digital input/output (SDIO) card through a secure digital (SD) interface is provided. The SDIO card includes a SDIO controller. The method includes the steps of: configuring the electronic device to write an I/O command packet at a designated address accessible to both the electronic device and the SDIO controller, the I/O command packet including a command for controlling the operation of the target I/O device; and configuring the SDIO controller to control the operation of the target I/O device according to the I/O command packet written at the designated address.
摘要翻译：提供了一种通过安全数字（SD）接口在电子设备和安全数字输入/输出（SDIO）卡中的目标输入/输出（I / O）设备之间进行通信的方法。 SDIO卡包括一个SDIO控制器。该方法包括以下步骤：配置电子设备以在电子设备和SDIO控制器可访问的指定地址处写入I / O命令分组，I / O命令分组包括用于控制目标的操作的命令 I / O设备; 并配置SDIO控制器，以根据在指定地址处写入的I / O命令包来控制目标I / O设备的操作。

3. 发明授权

US07863759B2 Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse 有权
标题翻译：封装结构和方法，用于在BGA衬底上具有两个接合焊盘阵列的芯片，用于防止金焊丝失效
公开(公告)号：US07863759B2
公开(公告)日：2011-01-04
申请号：US12007361
申请日：2008-01-09
申请人： Ming-Feng Wu
发明人： Ming-Feng Wu
IPC分类号： H01L23/48
CPC分类号： H01L24/49 , H01L23/13 , H01L23/49816 , H01L23/49833 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05553 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/484 , H01L2224/48599 , H01L2224/4899 , H01L2224/4911 , H01L2224/49171 , H01L2224/73265 , H01L2224/85444 , H01L2924/01014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A package structure and method for preventing gold bonding wires from collapsing are disclosed. The structure is especially useful for those chips whose two n×1 arrays of bonding pads are on the chip center to be packaged on a BGA substrate. According to the first preferred embodiment, two dies having a redistribution layer formed thereon are introduced outer the bonding pad array on the chip so that the gold bonding wires can be divided into two sections each to connect the bonding pads with the redistribution layer and the redistribution layer with the gold fingers on the BGA substrate. According to the second embodiment, the gold bonding wires are fixed by the epoxy strips on the chips after bonding the bonding pads to the gold fingers but before pouring liquid encapsulated epoxy into a mold.
摘要翻译：公开了一种用于防止金焊丝塌陷的封装结构和方法。该结构对于将芯片中心的两个n×1个焊盘阵列封装在BGA衬底上的那些芯片是特别有用的。根据第一优选实施例，在其上形成具有再分配层的两个管芯在焊盘阵列外部引入到芯片上，使得金键合线可以被分成两部分，每个部分将接合焊盘与再分配层连接，再分配 BGA基底上的金手指层。根据第二实施例，在将接合焊盘接合到金指之后，但在将液体封装的环氧树脂浇注到模具中之前，金键合线被芯片上的环氧树脂条固定。

4. 发明申请

US20080185720A1 Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse 有权
标题翻译：封装结构和方法，用于在BGA衬底上具有两个接合焊盘阵列的芯片，用于防止金焊丝失效
公开(公告)号：US20080185720A1
公开(公告)日：2008-08-07
申请号：US12007361
申请日：2008-01-09
申请人： Ming-Feng Wu
发明人： Ming-Feng Wu
IPC分类号： H01L23/49 , H01L21/60
CPC分类号： H01L24/49 , H01L23/13 , H01L23/49816 , H01L23/49833 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05553 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/484 , H01L2224/48599 , H01L2224/4899 , H01L2224/4911 , H01L2224/49171 , H01L2224/73265 , H01L2224/85444 , H01L2924/01014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A package structure and method for preventing gold bonding wires from collapsing are disclosed. The structure is especially useful for those chips whose two n×1 arrays of bonding pads are on the chip center to be packaged on a BGA substrate. According to the first preferred embodiment, two dies having a redistribution layer formed thereon are introduced outer the bonding pad array on the chip so that the gold bonding wires can be divided into two sections each to connect the bonding pads with the redistribution layer and the redistribution layer with the gold fingers on the BGA substrate. According to the second embodiment, the gold bonding wires are fixed by the epoxy strips on the chips after bonding the bonding pads to the gold fingers but before pouring liquid encapsulated epoxy into a mold.
摘要翻译：公开了一种用于防止金焊丝塌陷的封装结构和方法。该结构对于将芯片中心的两个nx1焊盘阵列封装在BGA衬底上的那些芯片特别有用。根据第一优选实施例，在其上形成具有再分配层的两个管芯在焊盘阵列外部引入到芯片上，使得金键合线可以被分成两部分，每个部分将接合焊盘与再分配层连接，再分配 BGA基底上的金手指层。根据第二实施例，在将接合焊盘接合到金指之后，但在将液体封装的环氧树脂浇注到模具中之前，金键合线被芯片上的环氧树脂条固定。

5. 发明授权

US06459162B1 Encapsulated semiconductor die package 失效
标题翻译：封装半导体管芯封装及其制造方法
公开(公告)号：US06459162B1
公开(公告)日：2002-10-01
申请号：US09817264
申请日：2001-03-27
申请人： Wen-Chun Liu , Yung-Chao Jen , Ming-Feng Wu
发明人： Wen-Chun Liu , Yung-Chao Jen , Ming-Feng Wu
IPC分类号： H01L2328
CPC分类号： H01L23/3107 , H01L21/56 , H01L24/48 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/4826 , H01L2224/73215 , H01L2224/85399 , H01L2924/00014 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor die package has a lead frame, a die attached to the lead frame and an encapsulant enclosing the lead frame and the die. The distance between the top outside face of the encapsulant and the frame is substantially equal to the distance between the bottom outside face of the encapsulant and the die, and the distance between the top outside face of the encapsulant and the frame is substantially two and half times the distance between the bottom outside face of the encapsulant and the lead frame. Consequently, the different thickness of different encapsulant portions achieves an optimum balance during curing that effectively reduces the deformation of the encapsulant. In addition, the encapsulant can be completely formed by an injection process, and no crack will form in the encapsulant.
摘要翻译：半导体管芯封装具有引线框架，附接到引线框架的管芯和封装引线框架和管芯的密封剂。密封剂的顶部外表面与框架之间的距离基本上等于密封剂的底部外表面与模具之间的距离，并且密封剂的顶部外表面与框架之间的距离基本上为两半乘以密封剂的底部外表面与引线框架之间的距离。因此，不同密封剂部分的不同厚度在固化期间实现了最佳平衡，从而有效地减少了密封剂的变形。此外，密封剂可以通过注射方法完全形成，并且在密封剂中不会形成裂纹。

6. 外观设计

USD508349S1 Shelf 失效
公开(公告)号：USD508349S1
公开(公告)日：2005-08-16
申请号：US29190900
申请日：2003-09-30
申请人： Ming-Feng Wu
设计人： Ming-Feng Wu

7. 发明申请

US20050005454A1 Fruit grating tool 失效
标题翻译：水果光栅工具
公开(公告)号：US20050005454A1
公开(公告)日：2005-01-13
申请号：US10616928
申请日：2003-07-11
申请人： Ming-Feng Wu
发明人： Ming-Feng Wu
IPC分类号： A47J43/25 , B07B13/00 , A22B5/16 , B02C17/02 , B26B11/00
CPC分类号： A47J43/255
摘要： A fruit grating tool includes a tube-shaped housing, a cap releasably connected to the housing, a pressing member arranged under the cap and biased down by a spring, a rotary member having a knob arranged on top of the cap, and a grating base arranged under the pressing member and connected to the rotary member; the grating base has a grating surface on an upper side thereof, and many sharp edged tangential holes thereon; fruits are put on the grating base to be pressed against the grating surface by means of the pressing member, and are grated by means of the grating surface when the knob is operated to cause the grating base to rotate; the fruits will pass down via the sharp edged tangential holes of the grating base after having been grated into small pieces.
摘要翻译：水果光栅工具包括管状壳体，可释放地连接到壳体的盖，布置在盖下方并被弹簧向下偏压的按压构件，具有设置在盖顶部上的旋钮的旋转构件和光栅基座布置在所述按压构件的下面并连接到所述旋转构件; 光栅基座在其上侧具有光栅表面，并且在其上具有许多尖锐的切线孔; 水果放在光栅基座上，通过按压部件压靠光栅表面，当操作旋钮以使光栅基座旋转时，通过光栅表面被磨碎; 在磨碎成小块之后，水果将通过光栅基座的锋利边缘切向孔穿过。

8. 发明授权

US06766915B2 Drink container for small children 失效
标题翻译：喝小孩的容器
公开(公告)号：US06766915B2
公开(公告)日：2004-07-27
申请号：US10322546
申请日：2002-12-19
申请人： Ming-Feng Wu
发明人： Ming-Feng Wu
IPC分类号： A61J900
CPC分类号： A61J11/001 , A61J11/002
摘要： A drink container for small children includes a container, a lid joined to an upper opening of the container, and a drip prevention element. The lid has a sucking portion for allowing a young child, to suck on to draw out drink contents of the container with the mouth. The lid is formed with a passage for allowing drink contents of the container to pass through. The drip prevention element is arranged in a passage of the lid to block the passage when there is no external sucking force exerted on the sucking portion, and which can bend to effect opening of the passage when there is external sucking force exerted on the sucking portion. Thus, liquid contents can't drip through the lid when a young child is learning to grasp objects with the drink container.
摘要翻译：用于小孩子的饮料容器包括容器，连接到容器的上部开口的盖子和防滴落元件。盖子具有用于允许幼儿吸吮的抽吸部分，用嘴抽出容器的饮料内容物。盖子形成有允许容器的饮料内容物通过的通道。防滴漏元件布置在盖子的通道中，当不存在吸入部分上的外部吸力时阻止通道，并且当外部吸力作用在吸入部分上时，可以弯曲以使通道开口。因此，当小孩正在学习用饮料容器抓住物体时，液体内容物不能滴过盖子。

9. 发明授权

US08444074B2 Pepper mill 有权
标题翻译：胡椒磨
公开(公告)号：US08444074B2
公开(公告)日：2013-05-21
申请号：US12651967
申请日：2010-01-04
申请人： Ming-Feng Wu
发明人： Ming-Feng Wu
IPC分类号： A01D34/90
CPC分类号： A47J42/04 , A47J42/08
摘要： A pepper mill includes a driving member coupled rotatably to a container body and cooperating with the container body to define a receiving space, a grinding unit, a planetary gear mechanism, and an adjusting component. The grinding unit includes a coupling shaft extending rotatably and being movable in the receiving space, a stationary first grinding seat, and a second grinding seat co-rotatable with the coupling shaft. The size of a grinding space between the first and second grinding seats is adjusted when the coupling shaft and the second grinding seat move axially relative to the first grinding seat. The planetary gear mechanism includes a driving gear unit and a driven gear unit driven rotatably by the driving gear unit to drive rotation of the coupling shaft. The adjusting component is connected threadedly to the coupling shaft and is operable to drive the axial movement of the coupling shaft and the second grinding seat.
摘要翻译：胡椒粉碎机包括可旋转地联接到容器主体并与容器主体配合以限定容纳空间的驱动构件，磨削单元，行星齿轮机构和调节部件。磨削单元包括可旋转地延伸并且可在接收空间中移动的联接轴，固定的第一研磨座和与联接轴共同旋转的第二研磨座。当联接轴和第二研磨座相对于第一研磨座轴向移动时，调整第一和第二研磨座之间的研磨空间的尺寸。行星齿轮机构包括驱动齿轮单元和从动齿轮单元，该从动齿轮单元由驱动齿轮单元可旋转地驱动以驱动联接轴的旋转。调节部件被螺纹连接到联接轴上，并且可操作地驱动联接轴和第二研磨座的轴向运动。

10. 发明授权

US08395822B2 Image processing method combining compression and watermark techniques 失效
标题翻译：组合压缩和水印技术的图像处理方法
公开(公告)号：US08395822B2
公开(公告)日：2013-03-12
申请号：US12640018
申请日：2009-12-17
申请人： Jing-Ming Guo , Ming-Feng Wu
发明人： Jing-Ming Guo , Ming-Feng Wu
IPC分类号： H04N1/40 , H04N1/46 , G06F15/00 , G06K1/00 , G06K15/00
CPC分类号： H04N1/32256 , G06T1/0028 , G06T2201/0051 , G06T2201/0061 , H04N1/32208 , H04N1/32224 , H04N1/32277
摘要： An image processing method combining compression and watermark techniques is provided. In the method, a block is taken as a unit, and two ordered dither arrays mutually conjugate are used to code an original image, so as to insert information of a watermark into the original image during the coding process. Accordingly, the method generates a compressed image gives consideration to the compression ratio, the image quality and the data safety. On the other hand, the method also provides a procedure to extract the watermark from the compressed image, in order to verify whether the compressed image has been modified illegally.
摘要翻译：提供了一种组合压缩和水印技术的图像处理方法。在该方法中，将块作为单位，并且使用两个相互共轭的有序抖动数组来编码原始图像，以便在编码处理期间将水印的信息插入到原始图像中。因此，该方法生成压缩图像，考虑压缩率，图像质量和数据安全性。另一方面，该方法还提供从压缩图像中提取水印的过程，以便验证压缩图像是否被非法修改。

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