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    • 1. 发明授权
    • Electrically programmable interconnect structure having a PECVD
amorphous silicon element
    • 具有PECVD非晶硅元件的电可编程互连结构
    • US5502315A
    • 1996-03-26
    • US161504
    • 1993-12-02
    • Hua-Thye ChuaAndrew K. ChanJohn M. BirknerRalph G. WhittenRichard L. BechtelMammen Thomas
    • Hua-Thye ChuaAndrew K. ChanJohn M. BirknerRalph G. WhittenRichard L. BechtelMammen Thomas
    • H01L23/525H02L27/02
    • H01L23/5252H01L2924/0002
    • In one method for forming amorphous silicon antifuses with significantly reduced leakage current, a film of amorphous silicon is formed in a antifuse via between two electrodes. The amorphous silicon film is deposited using plasma enhanced chemical vapor deposition, preferably in an silane-argon environment and at a temperature between 200 and 500 degrees C., or reactively sputtered in a variety of reactive gases. In another method, an oxide layer is placed between two amorphous silicon film layers. In yet another method, one of the amorphous silicon film layers about the oxide layer is doped. In another embodiment, a layer of conductive, highly diffusible material is formed either on or under the amorphous silicon film. The feature size and thickness of the amorphous silicon film are selected to minimize further the leakage current while providing the desired programming voltage. A method also is described for for forming a field programmable gate array with antifuses.
    • 在形成具有显着降低的漏电流的非晶硅反熔丝的一种方法中,在两个电极之间的反熔丝通孔中形成非晶硅膜。 非晶硅膜使用等离子体增强化学气相沉积,优选在硅烷 - 氩气环境中并在200-500℃的温度下沉积,或者以各种反应性气体反应溅射。 在另一种方法中,将氧化物层放置在两个非晶硅膜层之间。 在另一种方法中,围绕氧化物层的非晶硅膜之一被掺杂。 在另一个实施例中,在非晶硅膜上或下形成导电的,高度可扩散的材料层。 选择非晶硅膜的特征尺寸和厚度,以在提供期望的编程电压的同时进一步最小化漏电流。 还描述了用于形成具有反熔丝的现场可编程门阵列的方法。
    • 3. 发明授权
    • Method for fabrication of programmable interconnect structure
    • 可编程互连结构的制造方法
    • US6150199A
    • 2000-11-21
    • US405979
    • 1999-09-27
    • Ralph G. WhittenRichard L. BechtelMammen ThomasHua-Thye ChuaAndrew K. ChanJohn M. Birkner
    • Ralph G. WhittenRichard L. BechtelMammen ThomasHua-Thye ChuaAndrew K. ChanJohn M. Birkner
    • H01L21/82H01L23/525H01L27/10
    • H01L23/5252H01L2924/0002
    • In one method for forming amorphous silicon antifuses with significantly reduced leakage current, a film of amorphous silicon is formed in a antifuse via between two electrodes. The amorphous silicon film is deposited using plasma enhanced chemical vapor deposition, preferably in an silane-argon environment and at a temperature between 200 and 500 degrees C., or reactively sputtered in a variety of reactive gases. In another method, an oxide layer is placed between two amorphous silicon film layers. In yet another method, one of the amorphous silicon film layers about the oxide layer is doped. In another embodiment, a layer of conductive, highly diffusible material is formed either on or under the amorphous silicon film. The feature size and thickness of the amorphous silicon film are selected to minimize further the leakage current while providing the desired programming voltage. A method also is described for for forming a field programmable gate array with antifuses.
    • 在形成具有显着降低的漏电流的非晶硅反熔丝的一种方法中,在两个电极之间的反熔丝通孔中形成非晶硅膜。 非晶硅膜使用等离子体增强化学气相沉积,优选在硅烷 - 氩气环境中并在200-500℃的温度下沉积,或者以各种反应性气体反应溅射。 在另一种方法中,将氧化物层放置在两个非晶硅膜层之间。 在另一种方法中,围绕氧化物层的非晶硅膜之一被掺杂。 在另一个实施例中,在非晶硅膜上或下形成导电的,高度可扩散的材料层。 选择非晶硅膜的特征尺寸和厚度,以在提供期望的编程电压的同时进一步最小化漏电流。 还描述了用于形成具有反熔丝的现场可编程门阵列的方法。