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    • 3. 发明申请
    • Ultra-Fine Pitch Probe Card Structure
    • 超细间距探头卡结构
    • US20080116923A1
    • 2008-05-22
    • US11768087
    • 2007-06-25
    • Hsu Ming ChengFrank HwangClinton Chao
    • Hsu Ming ChengFrank HwangClinton Chao
    • G01R31/26G01R1/073
    • G01R1/07314G01R1/06744G01R1/07378
    • A system and a method of testing a semiconductor die is provided. An embodiment comprises a plurality of metal tips that are connected to a redistribution layer that fans out the pitch from the tips to metal plugs located in the substrate. The metal tips could be formed using semiconductor processes and either adding smaller layers of metal to larger layers of metal or else removing portions of one piece of metal to form the tips. The metal plugs are connected to a space transformation layer. The space transformation layer is electrically connected to a printed circuit board using, for example, a spring loaded connection such as a pogo pin. The space transformation layer is aligned onto the printed circuit board by a series of guidance mechanisms such as smooth fixtures, and the planarity of the tips is adjusted by adjusting a series of screws.
    • 提供一种测试半导体管芯的系统和方法。 一个实施例包括多个金属尖端,其连接到再分配层,该再分布层从尖端扇出沥青到位于衬底中的金属插塞。 金属尖端可以使用半导体工艺形成,并且将更小的金属层添加到更大的金属层,或者去除一块金属的部分以形成尖端。 金属插头连接到空间转换层。 空间转换层使用例如诸如弹簧销的弹簧加载连接电连接到印刷电路板。 空间转换层通过一系列引导机构(如光滑的固定装置)对准印刷电路板,通过调节一系列螺丝来调整尖端的平面度。
    • 4. 发明授权
    • Ultra-fine pitch probe card structure
    • 超细音调探针卡结构
    • US07642793B2
    • 2010-01-05
    • US11768087
    • 2007-06-25
    • Hsu Ming ChengFrank HwangClinton Chao
    • Hsu Ming ChengFrank HwangClinton Chao
    • G01R31/02
    • G01R1/07314G01R1/06744G01R1/07378
    • A system and a method of testing a semiconductor die is provided. An embodiment comprises a plurality of metal tips that are connected to a redistribution layer that fans out the pitch from the tips to metal plugs located in the substrate. The metal tips could be formed using semiconductor processes and either adding smaller layers of metal to larger layers of metal or else removing portions of one piece of metal to form the tips. The metal plugs are connected to a space transformation layer. The space transformation layer is electrically connected to a printed circuit board using, for example, a spring loaded connection such as a pogo pin. The space transformation layer is aligned onto the printed circuit board by a series of guidance mechanisms such as smooth fixtures, and the planarity of the tips is adjusted by adjusting a series of screws.
    • 提供一种测试半导体管芯的系统和方法。 一个实施例包括多个金属尖端,其连接到再分配层,该再分布层从尖端扇出沥青到位于衬底中的金属插塞。 金属尖端可以使用半导体工艺形成,并且将更小的金属层添加到更大的金属层,或者去除一块金属的部分以形成尖端。 金属插头连接到空间转换层。 空间转换层使用例如诸如弹簧销的弹簧加载连接电连接到印刷电路板。 空间转换层通过一系列引导机构(如光滑的固定装置)对准印刷电路板,通过调节一系列螺丝来调整尖端的平面度。