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    • 1. 发明申请
    • METHOD FOR FABRICATING INTERCONNECTIONS WITH CARBON NANOTUBES
    • 用碳纳米管制备互连的方法
    • US20120135598A1
    • 2012-05-31
    • US13094388
    • 2011-04-26
    • Hsin-wei WUChung-Min TsaiTri-Rung Yew
    • Hsin-wei WUChung-Min TsaiTri-Rung Yew
    • H01L21/768
    • H01L23/53276H01L21/76849H01L21/76876H01L21/76879H01L2221/1094H01L2924/0002H01L2924/00
    • A method for fabricating interconnections with carbon nanotubes of the present invention comprises the following steps: forming a dual-layer that contains a catalytic layer and an upper covering layer on the periphery of a hole connecting with a substrate; and growing carbon nanotubes on the catalytic layer with the upper covering layer covering the carbon nanotubes. The present invention grows the carbon nanotubes between the catalytic layer and the upper covering layer. The upper covering layer protects the catalytic layer from being oxidized and thus enhances the growth of the carbon nanotubes. The carbon nanotubes are respectively connected with the lower substrate and an upper conductive wire via the catalytic layer and the upper covering layer, which results in a lower contact resistance. Moreover, the upper covering layer also functions as a metal-diffusion barrier layer to prevent metal from spreading to other materials via diffusion or other approaches.
    • 本发明的制造与碳纳米管的互连的方法包括以下步骤:在与基板连接的孔的周围形成包含催化剂层和上覆盖层的双层; 并在上覆盖层覆盖碳纳米管的催化层上生长碳纳米管。 本发明在催化层和上覆盖层之间生长碳纳米管。 上覆盖层保护催化层不被氧化,从而增强碳纳米管的生长。 碳纳米管分别通过催化层和上覆盖层与下基板和上导电线连接,导致较低的接触电阻。 此外,上覆盖层还用作金属扩散阻挡层,以防止金属通过扩散或其它方法扩散到其它材料。
    • 2. 发明授权
    • Method for fabricating interconnections with carbon nanotubes
    • 制造与碳纳米管互连的方法
    • US08461037B2
    • 2013-06-11
    • US13094388
    • 2011-04-26
    • Hsin-wei WuChung-Min TsaiTri-Rung Yew
    • Hsin-wei WuChung-Min TsaiTri-Rung Yew
    • H01L21/00
    • H01L23/53276H01L21/76849H01L21/76876H01L21/76879H01L2221/1094H01L2924/0002H01L2924/00
    • A method for fabricating interconnections with carbon nanotubes of the present invention comprises the following steps: forming a dual-layer that contains a catalytic layer and an upper covering layer on the periphery of a hole connecting with a substrate; and growing carbon nanotubes on the catalytic layer with the upper covering layer covering the carbon nanotubes. The present invention grows the carbon nanotubes between the catalytic layer and the upper covering layer. The upper covering layer protects the catalytic layer from being oxidized and thus enhances the growth of the carbon nanotubes. The carbon nanotubes are respectively connected with the lower substrate and an upper conductive wire via the catalytic layer and the upper covering layer, which results in a lower contact resistance. Moreover, the upper covering layer also functions as a metal-diffusion barrier layer to prevent metal from spreading to other materials via diffusion or other approaches.
    • 本发明的制造与碳纳米管的互连的方法包括以下步骤:在与基板连接的孔的周围形成包含催化剂层和上覆盖层的双层; 并在上覆盖层覆盖碳纳米管的催化层上生长碳纳米管。 本发明在催化层和上覆盖层之间生长碳纳米管。 上覆盖层保护催化层不被氧化,从而增强碳纳米管的生长。 碳纳米管分别通过催化层和上覆盖层与下基板和上导电线连接,导致较低的接触电阻。 此外,上覆盖层还用作金属扩散阻挡层,以防止金属通过扩散或其它方法扩散到其它材料。