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1. 发明申请

US20070057348A1 Microstructure and manufacturing method thereof 审中-公开
标题翻译：微结构及其制造方法
公开(公告)号：US20070057348A1
公开(公告)日：2007-03-15
申请号：US11497433
申请日：2006-08-02
申请人： Hsin-Chang Tsai , Yu-Ru Chang , Tai-Kang Shing
发明人： Hsin-Chang Tsai , Yu-Ru Chang , Tai-Kang Shing
IPC分类号： H01L29/06 , H01L21/30
CPC分类号： B81C1/00063 , B81B2203/0384
摘要： A microstructure includes a substrate and a photoresist layer. The substrate has a surface, and the photoresist layer is disposed on the substrate. The photoresist layer has at least one recess, which has a sidewall, a depth and a width. An oblique angle of the sidewall is not less than 5 degrees, and the aspect ratio is not less than 2. Also, a manufacturing method of the microstructure is also disclosed.
摘要翻译：微结构包括基底和光刻胶层。衬底具有表面，并且光致抗蚀剂层设置在衬底上。光致抗蚀剂层具有至少一个具有侧壁，深度和宽度的凹部。侧壁的倾斜角度不小于5度，纵横比不小于2.此外，还公开了微结构的制造方法。

2. 发明申请

US20070117247A1 Manufacturing method of microstructure 审中-公开
标题翻译：微观结构的制造方法
公开(公告)号：US20070117247A1
公开(公告)日：2007-05-24
申请号：US11594116
申请日：2006-11-08
申请人： Hsin-Chang Tsai , Yu-Ru Chang , Tai-Kang Shing
发明人： Hsin-Chang Tsai , Yu-Ru Chang , Tai-Kang Shing
IPC分类号： H01L21/00
CPC分类号： G03F7/70375 , G03F7/70275
摘要： A manufacturing method of a microstructure includes the steps of: providing a substrate; forming a photoresist layer on the substrate; providing a first mask, which has at least one opaque area and at least one first lens, over the photoresist layer; providing a light source for illuminating the photoresist layer through the first mask; removing a portion of the photoresist layer to form at least one recess having a lateral wall, a depth and a width. An inclined angle of the lateral wall is not less than 5 degrees and the ratio of the depth to the width is not less than 2.
摘要翻译：微结构的制造方法包括以下步骤：提供基板; 在基板上形成光致抗蚀剂层; 在所述光致抗蚀剂层上提供具有至少一个不透明区域和至少一个第一透镜的第一掩模; 提供用于通过所述第一掩模照射所述光致抗蚀剂层的光源; 去除光致抗蚀剂层的一部分以形成具有侧壁，深度和宽度的至少一个凹部。侧壁的倾斜角度不小于5度，深度与宽度之比不小于2。

3. 发明申请

US20060113660A1 Chip package mechanism 失效
公开(公告)号：US20060113660A1
公开(公告)日：2006-06-01
申请号：US11280359
申请日：2005-11-17
申请人： Hsueh-Kuo Liao , Hsin-Chang Tsai , Tai-Kang Shing
发明人： Hsueh-Kuo Liao , Hsin-Chang Tsai , Tai-Kang Shing
IPC分类号： H01L23/12
CPC分类号： H03H9/1071 , B81B7/0058 , H01L23/10 , H01L23/26 , H01L24/48 , H01L2224/48091 , H01L2924/00014 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H03H9/059 , H03H9/1057 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip package mechanism. A substrate is disposed in a receiving chamber of a base. A chip is disposed on a target surface of the substrate. A plurality of supporting elements is disposed on the target surface and surrounds the chip. A gap for receiving the chip is created in the receiving chamber and between the target surface and the base by means of the supporting elements. A barricade is disposed in the gap to separate glue filled in the receiving chamber from contacting the chip. Outside water and particles cannot enter the chip package mechanism. The chip thus has a prolonged lifespan after packaged in the chip package mechanism.

4. 发明申请

US20060119457A1 Micro-switch 审中-公开
标题翻译：微动开关
公开(公告)号：US20060119457A1
公开(公告)日：2006-06-08
申请号：US11283991
申请日：2005-11-22
申请人： Hsin-Chang Tsai , Chia-Hua Chu , Horng-Jou Wang , Tai-Kang Shing
发明人： Hsin-Chang Tsai , Chia-Hua Chu , Horng-Jou Wang , Tai-Kang Shing
IPC分类号： H01H51/22
CPC分类号： H01H59/0009
摘要： A micro-switch. The micro-switch comprises at least one base, at least one fixed portion, and at least one switch component. The base comprises at least one first terminal and at least one first drive unit. The fixed portion is protruded higher than the base. The switch component comprises at least one deflection structure and at least one reverse structure. The deflection structure comprises at least one second terminal and at least one second drive unit. The second terminal corresponds to the first terminal and the second drive unit corresponds to the first drive unit. The reverse structure comprises one end connected to the fixed portion and another end connected to the deflection structure.
摘要翻译：一个微动开关微型开关包括至少一个基座，至少一个固定部分和至少一个开关部件。底座包括至少一个第一端子和至少一个第一驱动单元。固定部分比基座突出。开关部件包括至少一个偏转结构和至少一个反向结构。偏转结构包括至少一个第二端子和至少一个第二驱动单元。第二端子对应于第一端子，第二驱动单元对应于第一驱动单元。反向结构包括连接到固定部分的一端和连接到偏转结构的另一端。

5. 发明授权

US07528472B2 Chip package mechanism 失效
标题翻译：芯片封装机制
公开(公告)号：US07528472B2
公开(公告)日：2009-05-05
申请号：US11280359
申请日：2005-11-17
申请人： Hsueh-Kuo Liao , Hsin-Chang Tsai , Tai-Kang Shing
发明人： Hsueh-Kuo Liao , Hsin-Chang Tsai , Tai-Kang Shing
IPC分类号： H01L23/02 , H01L23/06 , H01L23/22
CPC分类号： H03H9/1071 , B81B7/0058 , H01L23/10 , H01L23/26 , H01L24/48 , H01L2224/48091 , H01L2924/00014 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H03H9/059 , H03H9/1057 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip package mechanism. A substrate is disposed in a receiving chamber of a base. A chip is disposed on a target surface of the substrate. A plurality of supporting elements is disposed on the target surface and surrounds the chip. A gap for receiving the chip is created in the receiving chamber and between the target surface and the base by means of the supporting elements. A barricade is disposed in the gap to separate glue filled in the receiving chamber from contacting the chip. Outside water and particles cannot enter the chip package mechanism. The chip thus has a prolonged lifespan after packaged in the chip package mechanism.
摘要翻译：芯片封装机制。衬底设置在基座的容纳室中。芯片设置在基板的目标表面上。多个支撑元件设置在目标表面上并围绕芯片。通过支撑元件在接收室中和目标表面和基座之间产生用于接收芯片的间隙。在间隙中设置路障以分离填充在接收室中的胶与芯片接触。外部水和颗粒不能进入芯片封装机构。因此芯片封装在芯片封装机构中后具有延长的使用寿命。

6. 发明申请

US20060144565A1 Heat dissipation devices and fabrication methods thereof 审中-公开
标题翻译：散热装置及其制造方法
公开(公告)号：US20060144565A1
公开(公告)日：2006-07-06
申请号：US11315244
申请日：2005-12-23
申请人： Hsin-Chang Tsai , Horng-Jou Wang , Darren Chen , Tai-Kang Shing
发明人： Hsin-Chang Tsai , Horng-Jou Wang , Darren Chen , Tai-Kang Shing
IPC分类号： H05K7/20 , F28D15/02
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/025 , F28D15/0266 , F28F2210/02 , H01L2924/0002 , H01L2924/00
摘要： This invention id related to a heat dissipation device comprises a case having a heat dissipation path, a backflow path, a first link path, and a second link path for working fluid to circulate therein. The heat dissipation path and the backflow path are positioned in the different height levels individually. The working fluid will not be more easily have turbulence. The reduction of heat dissipation efficiency will be improved. And the working fluid will not be necessary to limit covering the liquid state and gaseous state both.
摘要翻译：本发明涉及一种散热装置，其特征在于，具有：具有散热路径的壳体，回流路径，第一连结路径，以及工作流体在其中循环的第二连杆路径。散热路径和回流路径分别位于不同的高度水平。工作液不会更容易产生紊流。降低散热效率将得到改善。并且工作流体不需要限制覆盖液体状态和气态两者。

7. 外观设计

USD646015S1 Light emitting diode lamp 有权
公开(公告)号：USD646015S1
公开(公告)日：2011-09-27
申请号：US29362093
申请日：2010-05-20
申请人： Jen-Ta Chiang , Chia-Hao Liang , Hsin-Chang Tsai
设计人： Jen-Ta Chiang , Chia-Hao Liang , Hsin-Chang Tsai

8. 发明授权

US08067781B2 Light emitting structure and securing device thereof 有权
标题翻译：发光结构及其固定装置
公开(公告)号：US08067781B2
公开(公告)日：2011-11-29
申请号：US12313590
申请日：2008-11-21
申请人： Chia-Hao Liang , Hsin-Chang Tsai , Xie-Zhi Zhong
发明人： Chia-Hao Liang , Hsin-Chang Tsai , Xie-Zhi Zhong
IPC分类号： H01L33/54 , H01L33/56 , H01L23/043
CPC分类号： H01L25/0753 , H01L33/483 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： The light emitting structure disclosed includes a light emitting device, a metal frame, and a repressing fastener. The light emitting device has a plurality of first coupling terminals, and the metal frame has a plurality of second coupling portions. The light emitting device is disposed in the metal frame, and the first coupling terminals touch the second coupling portions to electrically connect the light emitting device and the metal frame. The repressing fastener is disposed on the light emitting device and fastened to the metal frame to secure the light emitting device in the metal frame. An LED securing device is also disclosed.
摘要翻译：所公开的发光结构包括发光装置，金属框架和压制紧固件。发光器件具有多个第一耦合端子，并且金属框架具有多个第二耦合部分。发光器件设置在金属框架中，并且第一耦合端子接触第二耦合部分以电连接发光器件和金属框架。压制紧固件设置在发光装置上并且紧固到金属框架以将发光装置固定在金属框架中。还公开了LED固定装置。

9. 外观设计

USD584428S1 LED lamp 有权
公开(公告)号：USD584428S1
公开(公告)日：2009-01-06
申请号：US29319162
申请日：2008-06-05
申请人： Tai-Ling Li , Chi-Hao Liang , Hsin-Chang Tsai , Mong-Ting Tsai
设计人： Tai-Ling Li , Chi-Hao Liang , Hsin-Chang Tsai , Mong-Ting Tsai

10. 发明授权

US07013537B2 Detent means for a heat sink 失效
标题翻译：防静电装置用于散热器
公开(公告)号：US07013537B2
公开(公告)日：2006-03-21
申请号：US10875224
申请日：2004-06-25
申请人： Jung-Cheng Lin , Hsin-Chang Tsai
发明人： Jung-Cheng Lin , Hsin-Chang Tsai
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44017 , Y10T24/44026 , Y10T24/44034 , H01L2924/00
摘要： The detent means for a heat sink has on each of the two ends of a pressing member a fixing engaging member and a movable engaging member, the movable engaging member is provided thereon with a foldable member. Wherein the pressing member is provided on the heat sink, the fixing engaging member extending downwards to engage protrusions on a side of a fixing seat of a microprocessor, the movable engaging member can be lowered to engage with protrusions on an opposite side of the fixing seat of the microprocessor, and the movable engaging member can be raised to a predetermined level under the action of the foldable member to thereby exert a force on the pressing member, thus the heat sink and the microprocessor at the center of the fixing seat can be press connected with each other.
摘要翻译：用于散热器的制动装置在按压构件的两个端部上具有固定接合构件和可移动接合构件，可动接合构件设置有可折叠构件。其中，所述按压构件设置在所述散热器上，所述固定接合构件向下延伸以接合微处理器的固定座侧的突起，所述可动接合构件可以降低以与所述固定座的相对侧上的突起接合并且可动接合构件在可折叠构件的作用下可以升高到预定水平，从而在按压构件上施加力，因此可以将固定座的中心处的散热器和微处理器按压相互连接。

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