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1. 发明授权

US08067781B2 Light emitting structure and securing device thereof 有权
标题翻译：发光结构及其固定装置
公开(公告)号：US08067781B2
公开(公告)日：2011-11-29
申请号：US12313590
申请日：2008-11-21
申请人： Chia-Hao Liang , Hsin-Chang Tsai , Xie-Zhi Zhong
发明人： Chia-Hao Liang , Hsin-Chang Tsai , Xie-Zhi Zhong
IPC分类号： H01L33/54 , H01L33/56 , H01L23/043
CPC分类号： H01L25/0753 , H01L33/483 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： The light emitting structure disclosed includes a light emitting device, a metal frame, and a repressing fastener. The light emitting device has a plurality of first coupling terminals, and the metal frame has a plurality of second coupling portions. The light emitting device is disposed in the metal frame, and the first coupling terminals touch the second coupling portions to electrically connect the light emitting device and the metal frame. The repressing fastener is disposed on the light emitting device and fastened to the metal frame to secure the light emitting device in the metal frame. An LED securing device is also disclosed.
摘要翻译：所公开的发光结构包括发光装置，金属框架和压制紧固件。发光器件具有多个第一耦合端子，并且金属框架具有多个第二耦合部分。发光器件设置在金属框架中，并且第一耦合端子接触第二耦合部分以电连接发光器件和金属框架。压制紧固件设置在发光装置上并且紧固到金属框架以将发光装置固定在金属框架中。还公开了LED固定装置。

2. 发明授权

US07808786B2 Circuit board with cooling function 有权
标题翻译：电路板具有散热功能
公开(公告)号：US07808786B2
公开(公告)日：2010-10-05
申请号：US12465040
申请日：2009-05-13
申请人： Chi-Hao Liang , Xie-Zhi Zhong , Hui-Ying Kuo
发明人： Chi-Hao Liang , Xie-Zhi Zhong , Hui-Ying Kuo
IPC分类号： H05K7/20
CPC分类号： H01L23/3675 , H01L23/36 , H01L23/3735 , H01L2924/0002 , H05K1/021 , H05K1/182 , H05K3/0061 , H05K3/341 , H05K2201/10106 , H01L2924/00
摘要： The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.
摘要翻译：电路板的制造工艺包括在热敏板的第一金属薄层上形成热界面层。连接主电路板的第二金属层包括具有热界面层的至少一个开口。然后，用接合的热板回流主电路板。还提供了具有使用上述制造工艺的冷却功能的电路板。

3. 发明申请

US20090134424A1 Light emitting structure and securing device thereof 有权
标题翻译：发光结构及其固定装置
公开(公告)号：US20090134424A1
公开(公告)日：2009-05-28
申请号：US12313590
申请日：2008-11-21
申请人： Chia-Hao Liang , Hsin-Chang Tsai , Xie-Zhi Zhong
发明人： Chia-Hao Liang , Hsin-Chang Tsai , Xie-Zhi Zhong
IPC分类号： H01L27/00
CPC分类号： H01L25/0753 , H01L33/483 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： The light emitting structure disclosed includes a light emitting device, a metal frame, and a repressing fastener. The light emitting device has a plurality of first coupling terminals, and the metal frame has a plurality of second coupling portions. The light emitting device is disposed in the metal frame, and the first coupling terminals touch the second coupling portions to electrically connect the light emitting device and the metal frame. The repressing fastener is disposed on the light emitting device and fastened to the metal frame to secure the light emitting device in the metal frame. An LED securing device is also disclosed.
摘要翻译：所公开的发光结构包括发光装置，金属框架和压制紧固件。发光器件具有多个第一耦合端子，并且金属框架具有多个第二耦合部分。发光器件设置在金属框架中，并且第一耦合端子接触第二耦合部分以电连接发光器件和金属框架。压制紧固件设置在发光装置上并且紧固到金属框架以将发光装置固定在金属框架中。还公开了LED固定装置。

4. 发明申请

US20080029881A1 Circuit board with cooling function 审中-公开
标题翻译：电路板具有散热功能
公开(公告)号：US20080029881A1
公开(公告)日：2008-02-07
申请号：US11598643
申请日：2006-11-14
申请人： Chi-Hao Liang , Xie-Zhi Zhong , Hui-Ying Kuo
发明人： Chi-Hao Liang , Xie-Zhi Zhong , Hui-Ying Kuo
IPC分类号： H01L23/34 , H01L21/00
CPC分类号： H01L23/3675 , H01L23/36 , H01L23/3735 , H01L2924/0002 , H05K1/021 , H05K1/182 , H05K3/0061 , H05K3/341 , H05K2201/10106 , H01L2924/00
摘要： The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.
摘要翻译：电路板的制造工艺包括在热敏板的第一金属薄层上形成热界面层。连接主电路板的第二金属层包括具有热界面层的至少一个开口。然后，用接合的热板回流主电路板。还提供了具有使用上述制造工艺的冷却功能的电路板。

5. 发明申请

US20090219699A1 CIRCUIT BOARD WITH COOLING FUNCTION 有权
标题翻译：具有冷却功能的电路板
公开(公告)号：US20090219699A1
公开(公告)日：2009-09-03
申请号：US12465040
申请日：2009-05-13
申请人： CHI-HAO LIANG , XIE-ZHI ZHONG , HUI-YING KUO
发明人： CHI-HAO LIANG , XIE-ZHI ZHONG , HUI-YING KUO
IPC分类号： H05K7/20
CPC分类号： H01L23/3675 , H01L23/36 , H01L23/3735 , H01L2924/0002 , H05K1/021 , H05K1/182 , H05K3/0061 , H05K3/341 , H05K2201/10106 , H01L2924/00
摘要： The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.
摘要翻译：电路板的制造工艺包括在热敏板的第一金属薄层上形成热界面层。连接主电路板的第二金属层包括具有热界面层的至少一个开口。然后，用接合的热板回流主电路板。还提供了具有使用上述制造工艺的冷却功能的电路板。

6. 发明申请

US20080218051A1 Socket LED device 审中-公开
标题翻译：插座LED装置
公开(公告)号：US20080218051A1
公开(公告)日：2008-09-11
申请号：US11798270
申请日：2007-05-11
申请人： Chi-Hao Liang , Xie-Zhi Zhong , Hsin-Chang Tsai
发明人： Chi-Hao Liang , Xie-Zhi Zhong , Hsin-Chang Tsai
IPC分类号： H01J7/24
CPC分类号： F21S8/003 , F21K9/00 , F21K9/20 , F21V29/86 , F21V29/89 , F21Y2115/10
摘要： A socket LED device includes a first body, a second body, a conducting device, a heat-dissipation device and an LED module. The first body is demountably connected to the second body. The heat-dissipation device is set between the first body and the second body. The conducting device includes two conducting pins and two conducting sockets respectively located on the first connecting surface and the second connecting surface to embed with each other. The LED module is secured on the first body and includes a heat-conducting substrate touching the heat-dissipation device and a conductive portion electrically connected with the conducting pins. Therefore, the heat is gradually decreased through this kind of stacked formation.
摘要翻译：插座LED装置包括第一主体，第二主体，导电装置，散热装置和LED模块。第一主体可拆卸地连接到第二主体。散热装置设置在第一主体和第二主体之间。导电装置包括分别位于第一连接表面和第二连接表面上的两个导电销和两个导电插座，以彼此嵌入。 LED模块固定在第一主体上，并且包括接触散热装置的导热基板和与导电销电连接的导电部分。因此，通过这种层叠结构逐渐减少热量。

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