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1. 发明申请

US20070077880A1 Computer system airflow-guiding device 审中-公开
标题翻译：计算机系统导风装置
公开(公告)号：US20070077880A1
公开(公告)日：2007-04-05
申请号：US11241910
申请日：2005-10-03
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Chi Liang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Chi Liang
IPC分类号： F24F13/06
CPC分类号： H05K7/20172 , G06F1/20
摘要： An airflow-guiding device for being mounted into a computer system to periodically change airflow passing therethrough, comprises a motor, a gearing driven by the motor and a plurality of airflow-guiding plates pivoted to a frame and linked to the gearing and driven thereby to turn back and forth periodically. The gearing comprises a cam driven by the motor and a sliding board slideably mounted on a supporting member. The sliding board has a lateral side always in contact with the cam so that when the cam rotates, the sliding plate slides on the supporting member. The airflow-guiding plates each have a linking rod linked to the sliding board. The airflow-guiding plates periodically turn within a given angle following the rotation of the cam so as to change direction of airflow passing through the airflow-guiding plates.
摘要翻译：一种用于安装到计算机系统中以周期性地改变通过其中的气流的气流引导装置，包括电动机，由电动机驱动的齿轮传动装置和多个气流引导板，其枢转到框架并连接到齿轮传动装置并被驱动，周期性地来回转。传动装置包括由马达驱动的凸轮和可滑动地安装在支撑构件上的滑动板。滑动板具有总是与凸轮接触的侧面，使得当凸轮旋转时，滑动板在支撑构件上滑动。气流引导板各自具有连接到滑动板的连接杆。气流引导板在凸轮旋转之后周期性地转动给定的角度，以改变通过气流引导板的气流的方向。

2. 发明授权

US07047640B2 Method of manufacturing a heat dissipating device 失效
标题翻译：制造散热装置的方法
公开(公告)号：US07047640B2
公开(公告)日：2006-05-23
申请号：US11069743
申请日：2005-03-01
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： B21D53/06 , B23P15/26
CPC分类号： B23K1/0012 , B23K2101/06 , B23K2101/14 , B23P2700/10 , F28D15/0275 , H01L21/4882 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , Y10T29/49368 , Y10T29/49369 , Y10T29/49373 , Y10T29/49377 , Y10T29/49378 , Y10T29/49393 , H01L2924/00
摘要： A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.
摘要翻译：一种制造散热装置的方法，所述方法包括以下步骤：a）提供热管，固体焊料条和散热片，其中所述散热器包括在其一侧限定凹槽的基座; b）将焊条和热管依次放入散热器的槽中; c）加热熔化焊料条并同时按压热管以使热管的外表面与限定槽的所述一侧共面; 和d）冷却以实现散热装置，其中焊条均匀分布在热管和基座之间。

3. 发明申请

US20060059684A1 Method of manufacturing a heat dissipating device 失效
公开(公告)号：US20060059684A1
公开(公告)日：2006-03-23
申请号：US11069743
申请日：2005-03-01
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： B23P15/26 , B21D53/06
CPC分类号： B23K1/0012 , B23K2101/06 , B23K2101/14 , B23P2700/10 , F28D15/0275 , H01L21/4882 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , Y10T29/49368 , Y10T29/49369 , Y10T29/49373 , Y10T29/49377 , Y10T29/49378 , Y10T29/49393 , H01L2924/00
摘要： A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

4. 发明申请

US20060032617A1 Heat sink electronic components 审中-公开
标题翻译：散热器电子元件
公开(公告)号：US20060032617A1
公开(公告)日：2006-02-16
申请号：US11012958
申请日：2004-12-14
申请人： Chun-Chi Chen , Shi-Wen Zhou , Chi Liang , Meng Fu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Chi Liang , Meng Fu
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , F28D15/0275 , F28F3/02 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for electronic component includes a base, a first heat dissipation member coupled to the base, heat pipes embedded in the base and a second heat dissipation member coupled to the base. The base is made of a first metal material and includes a heat absorbing portion having a bottom surface for contacting with the electronic component and a heat conductive portion extending from a top surface of heat absorbing portion. The first heat dissipation member is made of a second metal material and coupled to the heat absorbing portion of the base. The second heat dissipation member is made of second metal material and coupled to the heat conductive portion of the base. The first metal material differs from and has higher heat conductivity than the second metal material.
摘要翻译：一种用于电子部件的散热器包括基座，耦合到基座的第一散热构件，嵌入在基座中的热管和耦合到基座的第二散热构件。基座由第一金属材料制成，并且包括具有用于与电子部件接触的底面的吸热部和从吸热部的顶面延伸的导热部。第一散热构件由第二金属材料制成并且联接到基座的吸热部分。第二散热构件由第二金属材料制成并且连接到基座的导热部分。第一金属材料与第二金属材料不同并且具有比第二金属材料更高的热导率。

5. 发明授权

US07218522B2 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US07218522B2
公开(公告)日：2007-05-15
申请号：US11135575
申请日：2005-05-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： H05K7/20
CPC分类号： H01L23/562 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.
摘要翻译：散热装置包括散热器和附接到散热器的保护装置。散热器包括多个单独的翅片组装。保护装置由塑料制成。保护装置包括搁置在翅片上的板条和在板条下方的多个肋条。肋条插在翅片之间。

6. 发明申请

US20060018096A1 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US20060018096A1
公开(公告)日：2006-01-26
申请号：US11135575
申请日：2005-05-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： H05K7/20
CPC分类号： H01L23/562 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.
摘要翻译：散热装置包括散热器和附接到散热器的保护装置。散热器包括多个单独的翅片组装。保护装置由塑料制成。保护装置包括搁置在翅片上的板条和在板条下方的多个肋条。肋条插在翅片之间。

7. 发明授权

US07365978B2 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US07365978B2
公开(公告)日：2008-04-29
申请号：US11135593
申请日：2005-05-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.
摘要翻译：散热装置包括散热器（60），散热器（70）和传热管（80）。散热器包括底盘（62），与底盘分离的板（64）和在底盘和板之间延伸的多个翅片（66）。散热器包括平行于翅片的基座（72）。每个传热管包括热定位到底盘的热吸收部分（82），热定位于板的散热部分（84）和设置在吸热部分和散热部。热传递部分被热接收在散热器的基座中。

8. 发明申请

US20060104036A1 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US20060104036A1
公开(公告)日：2006-05-18
申请号：US11135593
申请日：2005-05-23
申请人： Chun-Chi Chen , Shi-Wen Zhuo , Meng Fu , Chi Liang
发明人： Chun-Chi Chen , Shi-Wen Zhuo , Meng Fu , Chi Liang
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.
摘要翻译：散热装置包括散热器（60），散热器（70）和传热管（80）。散热器包括底盘（62），与底盘分离的板（64）和在底盘和板之间延伸的多个翅片（66）。散热器包括平行于翅片的基座（72）。每个传热管包括热定位到底盘的热吸收部分（82），热定位于板的散热部分（84）和设置在吸热部分和散热部。热传递部分被热接收在散热器的基座中。

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