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1. 发明授权

US07156160B2 Integrated liquid cooling system for electronic components 失效
标题翻译：电子元件集成液体冷却系统
公开(公告)号：US07156160B2
公开(公告)日：2007-01-02
申请号：US10946702
申请日：2004-09-21
申请人： Hsieh Kun Lee , Cheng-tien Lai , Shi-Wen Zhou
发明人： Hsieh Kun Lee , Cheng-tien Lai , Shi-Wen Zhou
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a container (10) defining communicable first and second chambers (125a, 125b) therein, a pump (15) mounted on the container and having an entrance port (152) in flow communication with the second chamber, and an exit port (150) in flow communication with the first chamber so that the pump, the first chamber, and the second chamber together form a loop for circulation of coolant, and a heat dissipation unit (2) located at the loop for cooling the coolant.
摘要翻译：液体冷却系统包括容纳在其中的可连通的第一和第二腔室（125a，125b）的容器（10），安装在容器上并具有与第二腔室流动连通的入口（152）的泵（15）以及与所述第一室流动连通的出口（150），使得所述泵，所述第一室和所述第二室一起形成用于循环冷却剂的回路，以及位于所述环处的散热单元（2）用于冷却冷却液。

2. 发明授权

US07110261B2 Heat dissipation assembly 失效
标题翻译：散热组件
公开(公告)号：US07110261B2
公开(公告)日：2006-09-19
申请号：US10946663
申请日：2004-09-21
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.
摘要翻译：本发明的散热组件包括印刷电路板（50），安装在印刷电路板上的电子部件（60），安装在电子部件上的散热装置（70），固定有四个固定部件散热装置和四个定位构件（20）延伸穿过印刷电路板。定位构件被布置在固定构件中的四个弹性构件（30）覆盖。定位构件将固定构件拉向印刷电路板。

3. 发明申请

US20050098305A1 Integrated liquid cooling system for electronic components 失效
标题翻译：电子元件集成液体冷却系统
公开(公告)号：US20050098305A1
公开(公告)日：2005-05-12
申请号：US10946702
申请日：2004-09-21
申请人： Hsieh Kun Lee , Cheng-tien Lai , Shi-Wen Zhou
发明人： Hsieh Kun Lee , Cheng-tien Lai , Shi-Wen Zhou
IPC分类号： H01L23/473 , F28D15/00
CPC分类号： G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a container (10) defining communicable first and second chambers (125a, 125b) therein, a pump (15) mounted on the container and having an entrance port (152) in flow communication with the second chamber, and an exit port (150) in flow communication with the first chamber so that the pump, the first chamber, and the second chamber together form a loop for circulation of coolant, and a heat dissipation unit (2) located at the loop for cooling the coolant.
摘要翻译：液体冷却系统包括容纳在其中的可连通的第一和第二腔室（125a，125b）的容器（10），安装在容器上并具有与第二腔室流动连通的入口（152）的泵（15）以及与所述第一室流动连通的出口（150），使得所述泵，所述第一室和所述第二室一起形成用于循环冷却剂的回路，以及位于所述环处的散热单元（2）用于冷却冷却液。

4. 发明申请

US20050082666A1 Liquid cooling device 审中-公开
标题翻译：液体冷却装置
公开(公告)号：US20050082666A1
公开(公告)日：2005-04-21
申请号：US10950736
申请日：2004-09-27
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
IPC分类号： F28F27/02 , H01L23/473 , F25B41/00 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： F28D15/00 , F28F3/12 , F28F9/0265 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, a liquid inlet port (18) in communication with the container, and a diversion member (20, 20′) located in the casing, for leading liquid from the liquid inlet port to a bottom of the container.
摘要翻译：液体冷却装置包括具有用于容纳液体的容器（14）的壳体（10），与容器连通的液体入口（18）和位于壳体中的分流构件（20,20'），用于引导液体从液体入口到容器的底部。

5. 发明申请

US20050111197A1 Heat dissipation assembly 失效
标题翻译：散热组件
公开(公告)号：US20050111197A1
公开(公告)日：2005-05-26
申请号：US10946663
申请日：2004-09-21
申请人： Hsieh Lee , Cheng-Tien Lai , Shi-Wen Zhou
发明人： Hsieh Lee , Cheng-Tien Lai , Shi-Wen Zhou
IPC分类号： G06F1/16 , H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.
摘要翻译：本发明的散热组件包括印刷电路板（50），安装在印刷电路板上的电子部件（60），安装在电子部件上的散热装置（70），固定有四个固定部件散热装置和四个定位构件（20）延伸穿过印刷电路板。定位构件被布置在固定构件中的四个弹性构件（30）覆盖。定位构件将固定构件拉向印刷电路板。

6. 发明授权

US07631850B2 Apparatus for supporting cooling device 失效
标题翻译：用于支撑冷却装置的装置
公开(公告)号：US07631850B2
公开(公告)日：2009-12-15
申请号：US11135745
申请日：2005-05-24
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Ping-An Yang , Meng Fu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Ping-An Yang , Meng Fu
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： An apparatus (1) for supporting a cooling device (30) thereon includes a bracket (10) and a saddle (20) carrying the cooling device (30) thereon. The bracket (10) defines two opposing rails (12), (13) and a washboard-like member (14) extending along a direction in which the rails (12), (13) extend. The saddle (20) includes a positioning member (26) engaged in the washboard-like member (14) to position the saddle (20) to the bracket (10) and two blocks (24) slidable on the rails (12), (13) of the bracket (10) under condition that the positioning member (26) is disengaged from the washboard-like member (14).
摘要翻译：一种用于在其上支撑冷却装置（30）的装置（1）包括托架（10）和在其上承载冷却装置（30）的鞍座（20）。支架（10）限定了两个相对的轨道（12），（13）和沿轨道（12），（13）延伸的方向延伸的洗衣板状构件（14）。所述鞍座（20）包括定位构件（26），所述定位构件（26）接合在所述盥洗板状构件（14）中，以将所述鞍座（20）定位到所述支架（10）以及可在所述轨道（12）上滑动的两个块（24），在定位构件（26）与盥洗板状构件（14）分离的条件下，支架（10）的底面（13）是13。

7. 发明授权

US07296617B2 Heat sink 失效
标题翻译：散热器
公开(公告)号：US07296617B2
公开(公告)日：2007-11-20
申请号：US11221285
申请日：2005-09-07
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
IPC分类号： F28D15/04
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.
摘要翻译：一种用于散热电子装置的散热器包括：基座，包括堆叠在一起的多个翅片的第一翅片组，包括多个翅片并与第一翅片组重叠的第二翅片组，以及连接到第一翅片组的弯曲热管基础。第一和第二翅片组分别在第一和第二翅片组的不同位置与热管接合两次。

8. 发明申请

US20060262506A1 Heat sink assembly 有权
标题翻译：散热器组件
公开(公告)号：US20060262506A1
公开(公告)日：2006-11-23
申请号：US11244916
申请日：2005-10-05
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204) having a threaded bottom end (208). The sleeve comprises a cylindrical wall (302), an upper open end (304) and a lower open end (306). The sleeve further has an annular pedestal (308) perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring (22) is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.
摘要翻译：散热器组件包括散热器（10），从吊具延伸的多个散热片（12），紧固件（20）和固定到紧固件的固定套管（30）。紧固件包括具有螺纹底端（208）的头部（200）和轴（204）。套筒包括圆柱形壁（302），上开口端（304）和下开口端（306）。套筒还具有与壁垂直连接并在下开口端延伸的环形基座（308）。头部被接收在墙壁上并接触基座。轴延伸穿过吊具。压头弹簧（22）在头部和吊具之间提供，用于向下推动吊具以与发热电子装置接合。

9. 发明申请

US20060158850A1 Heat dissipation device with a heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US20060158850A1
公开(公告)日：2006-07-20
申请号：US11244688
申请日：2005-10-06
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28F2215/00 , H01L23/4006 , H01L23/467 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
摘要翻译：散热装置包括导热基座，底座上的散热器和与散热器和基座热接触的两个热管。散热器由金属挤压制成，并且在散热器周围包括导热圆柱体，以及从圆筒延伸并被圆筒包围的多个翅片。气缸包括四个互连的侧面。同一侧的翅片彼此平行。两个热管热量围绕散热器的气缸并且完全接触散热器。

10. 发明授权

US07312994B2 Heat dissipation device with a heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US07312994B2
公开(公告)日：2007-12-25
申请号：US11244688
申请日：2005-10-06
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0266 , F28F2215/00 , H01L23/4006 , H01L23/467 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
摘要翻译：散热装置包括导热基座，底座上的散热器和与散热器和基座热接触的两个热管。散热器由金属挤压制成，并且在散热器周围包括导热圆柱体，以及从圆筒延伸并被圆筒包围的多个翅片。气缸包括四个互连的侧面。同一侧的翅片彼此平行。两个热管热量围绕散热器的气缸并且完全接触散热器。

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