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1. 发明授权

US07147043B2 Integratied liquid cooling system for electrical components 失效
标题翻译：电气元件集成液体冷却系统
公开(公告)号：US07147043B2
公开(公告)日：2006-12-12
申请号：US10900815
申请日：2004-07-27
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
IPC分类号： F28D15/00
CPC分类号： H01L23/473 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a cooling body (1) defining an hollow portion receiving a pump (3) and a number of cooling fins (18) therein, and a contact portion for contacting an electrical component. The cooling body defines a passageway therein filled with liquid coolant, and an inlet (124) and an outlet (125) both in communication with the passageway. The pump defines an exit (31) and an entrance (32) connected to the inlet and the outlet of the cooling body respectively by two tubes (5). Heat is transferred from the electrical component to the contact portion, and then conducted to the coolant, and conducted to other portions of the cooling body as the coolant flows through the passageway. The heat is then conducted to the cooling fins for dissipation.
摘要翻译：液体冷却系统包括限定中空部分的冷却体（1），所述冷却体容纳泵（3）和其中的多个冷却翅片（18），以及用于接触电气部件的接触部分。冷却体限定了其中填充有液体冷却剂的通道，以及与通道连通的入口（124）和出口（125）。泵分别由两个管（5）分别连接到冷却体的入口和出口的出口（31）和入口（32）。热从电气部件传递到接触部分，然后传导到冷却剂，并且随着冷却剂流过通道而传导到冷却体的其它部分。然后将热量传导到散热片以进行散热。

2. 发明授权

US07100677B2 Integrated liquid cooling system for electrical components 失效
标题翻译：电气元件集成液体冷却系统
公开(公告)号：US07100677B2
公开(公告)日：2006-09-05
申请号：US10900801
申请日：2004-07-27
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/473 , F28F3/02 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a tank (10) for thermally contacting a heat source (100), a cylindrical heat dissipating unit (20) mounted on the tank, and a pump (30) located within the cylindrical heat dissipating unit. The tank defines a cavity therein for containing liquid coolant for heat exchange, and an inlet (122) in communication with the cavity. The heat dissipating unit defines a chamber therein in flow communication with the cavity, and an outlet (275) in communication with the chamber. The pump has an entrance (31) in flow communication with the outlet, and an exit (32) in flow communication with the inlet, thereby the tank, the heat dissipating unit, and the pump together forming a loop for circulation the of liquid coolant.
摘要翻译：液体冷却系统包括用于热接触热源（100）的罐（10），安装在罐上的圆柱形散热单元（20）和位于圆柱形散热单元内的泵（30）。所述罐在其中限定了用于容纳用于热交换的液体冷却剂的空腔，以及与所述空腔连通的入口（122）。散热单元限定其中与腔体流动连通的腔室，以及与腔室连通的出口（275）。泵具有与出口流动连通的入口（31）和与入口流动连通的出口（32），从而使罐，散热单元和泵一起形成用于使液体冷却剂循环的回路。

3. 发明授权

US07028761B2 Integrated liquid cooling system for electrical components 失效
标题翻译：电气元件集成液体冷却系统
公开(公告)号：US07028761B2
公开(公告)日：2006-04-18
申请号：US10901749
申请日：2004-07-28
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
IPC分类号： F28D15/00
CPC分类号： F28F3/12 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a cooling unit (100) and a coolant driving unit (200). The cooling unit includes a first cooling body (110) defining a first cavity, a second cooling body (130) defining a second cavity in communication with the first cooling body (110), and a heat sink (150) sandwiched between the first and second cooling bodies. The coolant driving unit is in flow communication with the first and second cooling bodies respectively, so that the first and second cooling bodies and the coolant driving unit together form a loop. Circulation of the coolant in the loop causes the heat generated by the heat generating component to be capable of being transferred from the first and second cooling bodies to the heat sink for dissipation.
摘要翻译：液体冷却系统包括冷却单元（100）和冷却剂驱动单元（200）。冷却单元包括限定第一空腔的第一冷却体（110），限定与第一冷却体（110）连通的第二空腔的第二冷却体（130）和夹在第一和第二冷却体第二冷却体。冷却剂驱动单元分别与第一和第二冷却体流动连通，使得第一和第二冷却体和冷却剂驱动单元一起形成回路。冷却液在回路中的循环使得由发热部件产生的热量能够从第一和第二冷却体转移到散热器以进行散热。

4. 发明申请

US20050082666A1 Liquid cooling device 审中-公开
标题翻译：液体冷却装置
公开(公告)号：US20050082666A1
公开(公告)日：2005-04-21
申请号：US10950736
申请日：2004-09-27
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
IPC分类号： F28F27/02 , H01L23/473 , F25B41/00 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： F28D15/00 , F28F3/12 , F28F9/0265 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, a liquid inlet port (18) in communication with the container, and a diversion member (20, 20′) located in the casing, for leading liquid from the liquid inlet port to a bottom of the container.
摘要翻译：液体冷却装置包括具有用于容纳液体的容器（14）的壳体（10），与容器连通的液体入口（18）和位于壳体中的分流构件（20,20'），用于引导液体从液体入口到容器的底部。

5. 发明授权

US07110261B2 Heat dissipation assembly 失效
标题翻译：散热组件
公开(公告)号：US07110261B2
公开(公告)日：2006-09-19
申请号：US10946663
申请日：2004-09-21
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.
摘要翻译：本发明的散热组件包括印刷电路板（50），安装在印刷电路板上的电子部件（60），安装在电子部件上的散热装置（70），固定有四个固定部件散热装置和四个定位构件（20）延伸穿过印刷电路板。定位构件被布置在固定构件中的四个弹性构件（30）覆盖。定位构件将固定构件拉向印刷电路板。

6. 发明授权

US06935410B2 Heat sink assembly 失效
标题翻译：散热器组件
公开(公告)号：US06935410B2
公开(公告)日：2005-08-30
申请号：US10749889
申请日：2003-12-31
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
IPC分类号： H01L23/467 , F28F3/00
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly includes a fan (10), a heat sink (20) and a mounting device (50). The heat sink includes a base (22) and plural of fins (24) extending upwardly from the base. Plural of claws (26) are formed in a top end of one fin which extends from a side of the base. A locking hole (30) is defined in another fin which extends from an opposite side of the base. A vent (52) is defined in the center of the mounting device, and four fixing holes (54) are defined in four comers of the mounting device for engaging with four screws (14) which extend through the fan to the mounting device. Plural of pivots (56) are provided in a first side of the mounting device for pivotably received in the claws of the heat sink thereby pivotably attaching the mounting device to the heat sink. A hook (62) is provided in an opposite side of the mounting device for engaging with the locking hole of the heat sink thereby fixing the mounting device to the heat sink.
摘要翻译：散热器组件包括风扇（10），散热器（20）和安装装置（50）。散热器包括底座（22）和从基座向上延伸的多个翅片（24）。多个爪（26）形成在从基部的一侧延伸的一个翅片的顶端中。锁定孔（30）被限定在从基座的相对侧延伸的另一个翅片中。在安装装置的中心设有一个排气口（52），在安装装置的四个角上限定了四个固定孔（54），用于与通过风扇延伸到安装装置的四个螺钉（14）接合。多个枢轴（56）设置在安装装置的第一侧，用于可枢转地容纳在散热片的爪中，从而将安装装置可枢转地附接到散热器。在安装装置的相对侧设有钩（62），用于与散热片的锁定孔接合，从而将安装装置固定到散热器。

7. 发明申请

US20050111197A1 Heat dissipation assembly 失效
标题翻译：散热组件
公开(公告)号：US20050111197A1
公开(公告)日：2005-05-26
申请号：US10946663
申请日：2004-09-21
申请人： Hsieh Lee , Cheng-Tien Lai , Shi-Wen Zhou
发明人： Hsieh Lee , Cheng-Tien Lai , Shi-Wen Zhou
IPC分类号： G06F1/16 , H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.
摘要翻译：本发明的散热组件包括印刷电路板（50），安装在印刷电路板上的电子部件（60），安装在电子部件上的散热装置（70），固定有四个固定部件散热装置和四个定位构件（20）延伸穿过印刷电路板。定位构件被布置在固定构件中的四个弹性构件（30）覆盖。定位构件将固定构件拉向印刷电路板。

8. 发明申请

US20050061482A1 Integrated liquid cooling system for electrical components 失效
标题翻译：电气元件集成液体冷却系统
公开(公告)号：US20050061482A1
公开(公告)日：2005-03-24
申请号：US10900801
申请日：2004-07-27
申请人： Hsieh Lee , Cheng-Tien Lai , Shi Wen Zhou
发明人： Hsieh Lee , Cheng-Tien Lai , Shi Wen Zhou
IPC分类号： F28F3/02 , F28F3/12 , H01L23/473 , F28F1/00
CPC分类号： H01L23/473 , F28F3/02 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a tank (10) for thermally contacting a heat source (100), a cylindrical heat dissipating unit (20) mounted on the tank, and a pump (30) located within the cylindrical heat dissipating unit. The tank defines a cavity therein for containing liquid coolant for heat exchange, and an inlet (122) in communication with the cavity. The heat dissipating unit defines a chamber therein in flow communication with the cavity, and an outlet (275) in communication with the chamber. The pump has an entrance (31) in flow communication with the outlet, and an exit (32) in flow communication with the inlet, thereby the tank, the heat dissipating unit, and the pump together forming a loop for circulation the of liquid coolant.
摘要翻译：液体冷却系统包括用于热接触热源（100）的罐（10），安装在罐上的圆柱形散热单元（20）和位于圆柱形散热单元内的泵（30）。所述罐在其中限定了用于容纳用于热交换的液体冷却剂的空腔，以及与所述空腔连通的入口（122）。散热单元限定其中与腔体流动连通的腔室，以及与腔室连通的出口（275）。泵具有与出口流动连通的入口（31）和与入口流动连通的出口（32），从而使罐，散热单元和泵一起形成用于使液体冷却剂循环的回路。

9. 发明授权

US07301774B2 Universal locking device for heat sink 失效
标题翻译：通用散热器锁紧装置
公开(公告)号：US07301774B2
公开(公告)日：2007-11-27
申请号：US11210130
申请日：2005-08-23
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Shao-Long Zhai , Zhi-Yong Zhou
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Shao-Long Zhai , Zhi-Yong Zhou
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.
摘要翻译：用于将散热器固定到发热部件的锁定装置包括锁定板，多个锁定脚，每个锁定脚可枢转地附接到锁定板，以及多个锁定构件，其连接到锁定脚。多个锁定脚中的相邻的两个能够从锁定脚彼此分开的第一位置朝向彼此旋转，锁定构件将第一安装位置限定到锁定脚堆叠的第二位置以及限定第二安装位置的锁定构件。

10. 发明申请

US20060120053A1 Universal locking device for heat sink 失效
标题翻译：通用散热器锁紧装置
公开(公告)号：US20060120053A1
公开(公告)日：2006-06-08
申请号：US11210130
申请日：2005-08-23
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Shao-Long Zhai , Zhi-Yong Zhou
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Shao-Long Zhai , Zhi-Yong Zhou
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.
摘要翻译：用于将散热器固定到发热部件的锁定装置包括锁定板，多个锁定脚，每个锁定脚可枢转地附接到锁定板，以及多个锁定构件，其连接到锁定脚。多个锁定脚中的相邻的两个能够从锁定脚彼此分开的第一位置朝向彼此旋转，锁定构件将第一安装位置限定到锁定脚堆叠的第二位置以及限定第二安装位置的锁定构件。

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