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    • 1. 发明申请
    • Fluid circuit connector system
    • 流体回路连接器系统
    • US20060260699A1
    • 2006-11-23
    • US10326714
    • 2002-12-19
    • Howard EdelmanHoward Davidson
    • Howard EdelmanHoward Davidson
    • F16L37/32
    • A61M39/1011A61F7/00A61M5/1408A61M39/223A61M39/26A61M2039/1027A61M2039/1083A61M2039/1088A61M2205/36Y10T137/87161Y10T137/87957
    • A fluid circuit connector system includes a quick-release connector for connecting a set of tubes to an object. The quick-release connector includes a release button, a lock arm, a lock tab and a cavity configured to receive the tubes and a set of coupler housings. The connector system includes an object fitting having lock recess may be configured to receive the lock tab. The object fitting includes a cavity. The system further includes a set of male coupler housings each including a first unitary valve and a set of female coupler housings each including a second unitary valve. Each female housing is configured to receive and engage one of the male coupler housings. The system includes a set of seals configured to seal each male coupler housing and each female coupler housing when the quick-release connector is connected to the object fitting.
    • 流体回路连接器系统包括用于将一组管连接到物体的快速释放连接器。 快速释放连接器包括释放按钮,锁定臂,锁定舌片和被构造成接收管子的腔和一组联接器壳体。 连接器系统包括具有锁定凹部的对象配件可以被配置为接收锁定突出部。 物体配件包括腔体。 该系统还包括一组阳联接器壳体,每个包括第一单一阀和一组阴联接器壳体,每个均包括第二整体阀。 每个阴壳体被构造成接收并接合阳联接器壳体中的一个。 该系统包括一组密封件,其构造成当快速连接器连接到物体接头时密封每个阳联接器壳体和每个阴联接器壳体。
    • 2. 发明授权
    • Method for bonding substrates
    • 接合基板的方法
    • US06946363B2
    • 2005-09-20
    • US10302196
    • 2002-11-22
    • Howard Davidson
    • Howard Davidson
    • H01L21/48H01L21/58H01L23/36H01L21/46
    • H01L24/83H01L21/4882H01L23/36H01L24/26H01L2224/8319H01L2224/8385H01L2224/83894H01L2924/01005H01L2924/01006H01L2924/01013H01L2924/01029H01L2924/01033H01L2924/01079H01L2924/014H01L2924/07802H01L2924/14
    • A method for bonding diamond heat distribution structures to integrated circuit packages using optical contacting. In one embodiment, a heat spreader comprising diamond slab has a flat contact surface which is polished to a high degree of smoothness. An integrated circuit's package also has a flat contact surface which is polished to a high degree of smoothness. The contact surfaces of the diamond slab and the package are thoroughly cleaned and are then placed in contact with each other, establishing an optical contact bond between them. In one embodiment, the contact surfaces of the diamond and package which are to be bonded together are first polished, then a layer of an intermediate material such as silicon carbide is deposited on the polished surfaces. The silicon carbide layers on the contact surfaces are cleaned and placed in contact with each other to establish an optical contact bond. If desired, the silicon carbide layers on the contact surfaces may be activated with a substance such as hydrogen fluoride to promote bonding.
    • 一种使用光学接触将金刚石散热结构结合到集成电路封装的方法。 在一个实施例中,包括金刚石板的散热器具有平坦的接触表面,其被抛光到高度的平滑度。 集成电路封装还具有平坦的接触表面,其被抛光到高度的平滑度。 金刚石板和封装的接触表面被彻底清洁,然后彼此接触,在它们之间建立光学接触。 在一个实施例中,首先研磨要结合在一起的金刚石和封装的接触表面,然后在抛光表面上沉积诸如碳化硅的中间材料层。 接触表面上的碳化硅层被清洁并且彼此接触以建立光学接触键。 如果需要,接触表面上的碳化硅层可以用诸如氟化氢的物质来活化以促进结合。
    • 4. 发明授权
    • Method and apparatus for making a sorber
    • 制造吸附剂的方法和设备
    • US07003979B1
    • 2006-02-28
    • US09524216
    • 2000-03-13
    • Howard Davidson
    • Howard Davidson
    • F25B33/00
    • F25B35/04
    • A structure and method of manufacture for a sorber, wherein a mass of sorbent contained in a sorber enclosure comprises a plurality of sorbent disks stacked in face-to-face relation. The sorbent disks are formed from a solid sorbent material such as zeolite and contain surface features in at least one face of each disk which, when the disks are stacked, form passageways by which sorbate is distributed throughout the mass of sorbent material. In one embodiment, each sorbent disk is annular in shape and has a plurality of radial grooves which extend from the periphery of the disk to the aperture through the center of the disk. The disks are stacked face-to-face and an inner conductor is inserted through the center apertures of the disks. This assembly is then inserted into a conductive housing and is enclosed by a pair of end plugs or caps which are secured to the housing. A port in one of the end caps allows sorbate to enter and exit the sorber enclosure. The sorber structure forms a coaxial transmission line for electromagnetic waves which are used to desorb sorbate from the sorbent disks. Alternate embodiments may use sorbent disks which employ surface features other than grooves to provide passageways through the sorbent mass. Alternate embodiments may also have configurations which are not cylindrical and/or coaxial.
    • 用于吸附器的结构和制造方法,其中包含在吸附器壳体中的吸收剂的质量包括以面对面的关系堆叠的多个吸附剂盘。 吸附剂盘由诸如沸石的固体吸附剂材料形成,并且在每个盘的至少一个表面中包含表面特征,当盘堆叠时,吸附剂盘形成通道,通过该通道,山梨酸盐分布在整个吸附剂材料块中。 在一个实施例中,每个吸附盘是环形的并且具有多个径向槽,其从盘的周边延伸通过盘的中心到孔。 磁盘面对面堆叠,内部导体插入磁盘的中心孔。 然后将该组件插入导电壳体中,并被固定到壳体上的一对端塞或盖封闭。 一个端盖中的一个端口允许山梨酸进入和离开吸附器外壳。 吸附器结构形成用于电磁波的同轴传输线,其用于从吸附剂盘解吸吸浆。 替代实施例可以使用吸附剂盘,其使用凹槽以外的表面特征来提供穿过吸附剂块的通道。 替代实施例也可以具有不是圆柱形和/或同轴的构造。
    • 6. 发明授权
    • Optical interconnect
    • 光互连
    • US06619858B1
    • 2003-09-16
    • US09575418
    • 2000-05-20
    • Rick LytelHoward DavidsonTheresa SzeNyles NettletonDawei Huang
    • Rick LytelHoward DavidsonTheresa SzeNyles NettletonDawei Huang
    • G02B636
    • G02B6/43G02B6/4249
    • An optical interconnect is provided that optically connects two adjacent printed circuit boards, or electrical component. The optical interconnect includes a floating frame which is flexibly connected to one electrical component. The floating frame includes a plurality of optical guides. The optical guides are connected to the electrical component either electronically or optically. A second frame, coupled to a second electrical component also contains a plurality of optical guides. A mechanical guide assembly positions the first frame and the second frame are optically coupled. The optical guide in the second frame connects to the second electrical component providing a path for a signal from the first electrical component to the second electrical component.
    • 提供光学互连以光学连接两个相邻的印刷电路板或电气部件。 光学互连包括浮动框架,该浮动框架柔性地连接到一个电气部件。 浮动框架包括多个光导件。 光导件以电子方式或光学方式连接到电气部件。 耦合到第二电气部件的第二框架还包含多个光导件。 机械引导组件定位第一框架并且第二框架被光耦合。 第二框架中的光导件连接到第二电气部件,从而提供用于从第一电气部件到第二电气部件的信号的路径。