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    • 1. 发明申请
    • Off-axis projection optical system and extreme ultraviolet lithography apparatus using the same
    • 离轴投影光学系统和使用其的极紫外光刻设备
    • US20060284113A1
    • 2006-12-21
    • US11453775
    • 2006-06-16
    • Seung-Hyuk ChangI-Hun SongYoung-Soo ParkSuk-Pil KimHoon Kim
    • Seung-Hyuk ChangI-Hun SongYoung-Soo ParkSuk-Pil KimHoon Kim
    • G21G5/00A61N5/00
    • G03F7/70241G03F7/70941
    • An off-axis projection optical system including first and second mirrors that are off-axially arranged is provided. The tangential and sagittal radii of curvature of the first mirror may be R1t and R1s, respectively. The tangential and sagittal radii of curvature of the second mirror may be R2t and R2s, respectively. The incident angle of the beam from an object point to the first mirror 10 may be i1, and an incident angle of the beam reflected from the first mirror 10 to the second mirror 30 is i2. The values of R1t, R1s, R2t, R2s, i1 and i2 may satisfy the following Equation. R1t cos i1=R2t cos i2 R1s=R1t cos2i1 R2s=R2t cos2i2
    • 提供了一种离轴投影光学系统,其包括非轴向布置的第一和第二反射镜。 第一反射镜的切向和矢状曲率半径可以分别为R 1t 1和R 1s 1。 第二反射镜的切向和矢状曲率半径可以分别为R 2t 2和R 2s 3。 从物点到第一反射镜10的光束的入射角度可以为1&lt; 1&gt;,从第一反射镜10反射到第二反射镜30的光束的入射角为 2 。 R 1,R 1,R 2,R 2,R 2,R 1,R 2, SUB&gt;和i&lt; 2&gt;可以满足以下等式。 <?in-line-formula description =“In-line Formulas”end =“lead”?> R&lt; 1t&gt; cos&lt; 1&lt; 1&lt; 2&lt; > cos i <2> <?in-line-formula description =“In-line Formulas”end =“tail”?> <?in-line-formula description =“In-line Formulas”end = “引线”→R 1> = R 1t&lt; 2&gt;&lt; 2&lt;&lt; =“在线公式”end =“tail”?> <?in-line-formula description =“In-line Formulas”end =“lead”?> R <2> 2t 2 “in-line-formula description =”In-line Formulas“end =”tail“?>
    • 4. 发明授权
    • Off-axis projection optical system and extreme ultraviolet lithography apparatus using the same
    • 离轴投影光学系统和使用其的极紫外光刻设备
    • US07301694B2
    • 2007-11-27
    • US11453775
    • 2006-06-16
    • Seung-Hyuk ChangI-Hun SongYoung-Soo ParkSuk-Pil KimHoon Kim
    • Seung-Hyuk ChangI-Hun SongYoung-Soo ParkSuk-Pil KimHoon Kim
    • G02B5/08
    • G03F7/70241G03F7/70941
    • Example embodiments are directed to an off-axis projection optical system including first and second mirrors that are off-axially arranged. The tangential and sagittal radii of curvature of the first mirror may be R1t and R1s, respectively. The tangential and sagittal radii of curvature of the second mirror may be R2t and R2s, respectively. The incident angle of the beam from an object point to the first mirror 10 may be i1, and an incident angle of the beam reflected from the first mirror 10 to the second mirror 30 is i2. The values of R1t, R1s, R2t, R2s, i1 and i2 may satisfy the following Equation R1t cos i1=R2t cos i2 R1s=R1t cos2i1 R2s=R2t cos2i2.
    • 示例性实施例涉及一种离轴投影光学系统,其包括非轴向布置的第一和第二反射镜。 第一反射镜的切向和矢状曲率半径可以分别为R 1t 1和R 1s 1。 第二反射镜的切向和矢状曲率半径可以分别为R 2t 2和R 2s 3。 从物点到第一反射镜10的光束的入射角度可以为1&lt; 1&gt;,从第一反射镜10反射到第二反射镜30的光束的入射角为 2 。 R 1,R 1,R 2,R 2,R 2,R 1,R 2, SUB>和i <2>可以满足以下等式<?in-line-formula description =“In-line Formulas”end =“lead”?> R 1t cos α-in-line-formula description =“In-line Formulas”end =“tail”?> R&lt; 1s&lt; 1&lt; 1&lt; 1&lt; i <?in-line-formula description =“In-line Formulas”end =“tail”?> <?in-line-formula description =“In-line Formulas”end =“lead “?”R 2s 2 = R 2t 2&lt; 2&lt; 2&lt; 2&lt;&lt;行内公式描述= “直线公式”end =“tail”?>
    • 5. 发明申请
    • Reflection mask for EUV photolithography and method of fabricating the reflection mask
    • 用于EUV光刻的反射掩模和制造反射掩模的方法
    • US20060281017A1
    • 2006-12-14
    • US11441835
    • 2006-05-26
    • Suk-pil KimI-hun SongYoung-Soo ParkSeung-hyuk ChangHoon Kim
    • Suk-pil KimI-hun SongYoung-Soo ParkSeung-hyuk ChangHoon Kim
    • G21K5/00G03F1/00
    • G21K1/062B82Y10/00B82Y40/00G03F1/24
    • A reflection mask for extreme ultraviolet (EUV) photolithography and a method of fabricating the same, in which the reflection mask includes a substrate, a lower reflection layer formed in a multi-layer structure on the substrate and including a material reflecting EUV light, an upper reflection layer formed in a multi-layer structure on the lower reflection layer and reflecting EUV light, and a phase reversing layer formed between the lower reflection layer and the upper reflection layer in a certain pattern and causing destructive interference between reflection light from the upper reflection layer and reflection light from the lower reflection layer. An incidence of a shadow effect can be reduced and unnecessary EUV light can be eliminated, so that a pattern on the reflection mask can be projected precisely on a silicon wafer. Since the phase reversing layer includes the same material as the reflection layer and an absorption layer, mask fabrication processes can be handled easily.
    • 一种用于极紫外(EUV)光刻的反射掩模及其制造方法,其中反射掩模包括基板,在基板上形成为多层结构的下反射层,并且包括反射EUV光的材料, 在下反射层上形成多层结构并反射EUV光的上反射层和以一定图案形成在下反射层和上反射层之间的相位反转层,并且产生来自上层的反射光之间的相消干涉 反射层和来自下反射层的反射光。 可以减少阴影效应的入射,并且可以消除不必要的EUV光,使得反射掩模上的图案可以精确地投影在硅晶片上。 由于相位反转层包括与反射层和吸收层相同的材料,因此可以容易地处理掩模制造工艺。
    • 6. 发明授权
    • Reflection mask for EUV photolithography and method of fabricating the reflection mask
    • 用于EUV光刻的反射掩模和制造反射掩模的方法
    • US07682758B2
    • 2010-03-23
    • US11441835
    • 2006-05-26
    • Suk-pil KimI-hun SongYoung-soo ParkSeung-hyuk ChangHoon Kim
    • Suk-pil KimI-hun SongYoung-soo ParkSeung-hyuk ChangHoon Kim
    • G03F1/00
    • G21K1/062B82Y10/00B82Y40/00G03F1/24
    • A reflection mask for extreme ultraviolet (EUV) photolithography and a method of fabricating the same, in which the reflection mask includes a substrate, a lower reflection layer formed in a multi-layer structure on the substrate and including a material reflecting EUV light, an upper reflection layer formed in a multi-layer structure on the lower reflection layer and reflecting EUV light, and a phase reversing layer formed between the lower reflection layer and the upper reflection layer in a certain pattern and causing destructive interference between reflection light from the upper reflection layer and reflection light from the lower reflection layer. An incidence of a shadow effect can be reduced and unnecessary EUV light can be eliminated, so that a pattern on the reflection mask can be projected precisely on a silicon wafer. Since the phase reversing layer includes the same material as the reflection layer and an absorption layer, mask fabrication processes can be handled easily.
    • 一种用于极紫外(EUV)光刻的反射掩模及其制造方法,其中反射掩模包括基板,在基板上形成为多层结构的下反射层,并且包括反射EUV光的材料, 在下反射层上形成多层结构并反射EUV光的上反射层和以一定图案形成在下反射层和上反射层之间的相位反转层,并且产生来自上层的反射光之间的相消干涉 反射层和来自下反射层的反射光。 可以减少阴影效应的入射,并且可以消除不必要的EUV光,使得反射掩模上的图案可以精确地投影在硅晶片上。 由于相位反转层包括与反射层和吸收层相同的材料,因此可以容易地处理掩模制造工艺。