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    • 6. 发明授权
    • Semiconductor device forming method
    • 半导体器件形成方法
    • US07943930B2
    • 2011-05-17
    • US12143035
    • 2008-06-20
    • Hongyong ZhangToru TakayamaYasuhiko TakemuraAkiharu MiyanagaHisashi Ohtani
    • Hongyong ZhangToru TakayamaYasuhiko TakemuraAkiharu MiyanagaHisashi Ohtani
    • H01L29/04
    • H01L29/045G09G2300/0408H01L21/02532H01L21/02672H01L27/1277H01L27/1296H01L29/66757
    • In thin film transistors (TFTs) having an active layer of crystalline silicon adapted for mass production, a catalytic element is introduced into doped regions of an amorphous silicon film by ion implantation or other means. This film is crystallized at a temperature below the strain point of the glass substrate. Further, a gate insulating film and a gate electrode are formed. Impurities are introduced by a self-aligning process. Then, the laminate is annealed below the strain point of the substrate to activate the dopant impurities. On the other hand, Neckel or other element is also used as a catalytic element for promoting crystallization of an amorphous silicon film. First, this catalytic element is applied in contact with the surface of the amorphous silicon film. The film is heated at 450 to 650° C. to create crystal nuclei. The film is further heated at a higher temperature to grow the crystal grains. In this way, a crystalline silicon film having improved crystallinity is formed.
    • 在具有适于批量生产的结晶硅有源层的薄膜晶体管(TFT)中,通过离子注入或其它方式将催化元素引入到非晶硅膜的掺杂区域中。 该膜在低于玻璃基板的应变点的温度下结晶。 此外,形成栅极绝缘膜和栅电极。 杂质通过自对准过程引入。 然后,层压体在基板的应变点以下退火以活化掺杂剂杂质。 另一方面,Neckel或其它元素也用作促进非晶硅膜结晶的催化元素。 首先,将该催化元件与非晶硅膜的表面接触。 将膜在450至650℃加热以产生晶核。 将膜进一步在较高温度下加热以生长晶粒。 以这种方式,形成具有改善的结晶度的晶体硅膜。
    • 7. 发明授权
    • Semiconductor device forming method
    • 半导体器件形成方法
    • US07391051B2
    • 2008-06-24
    • US11321640
    • 2005-12-30
    • Hongyong ZhangToru TakayamaYasuhiko TakemuraAkiharu MiyanagaHisashi Ohtani
    • Hongyong ZhangToru TakayamaYasuhiko TakemuraAkiharu MiyanagaHisashi Ohtani
    • H01L31/00
    • H01L29/045G09G2300/0408H01L21/02532H01L21/02672H01L27/1277H01L27/1296H01L29/66757
    • In thin film transistors (TFTs) having an active layer of crystalline silicon adapted for mass production, a catalytic element is introduced into doped regions of an amorphous silicon film by ion implantation or other means. This film is crystallized at a temperature below the strain point of the glass substrate. Further, a gate insulating film and a gate electrode are formed. Impurities are introduced by a self-aligning process. Then, the laminate is annealed below the strain point of the substrate to activate the dopant impurities. On the other hand, Neckel or other element is also used as a catalytic element for promoting crystallization of an amorphous silicon film. First, this catalytic element is applied in contact with the surface of the amorphous silicon film. The film is heated at 450 to 650° C. to create crystal nuclei. The film is further heated at a higher temperature to grow the crystal grains. In this way, a crystalline silicon film having improved crystallinity is formed.
    • 在具有适于批量生产的结晶硅有源层的薄膜晶体管(TFT)中,通过离子注入或其它方式将催化元素引入到非晶硅膜的掺杂区域中。 该膜在低于玻璃基板的应变点的温度下结晶。 此外,形成栅极绝缘膜和栅电极。 杂质通过自对准过程引入。 然后,层压体在基板的应变点以下退火以活化掺杂剂杂质。 另一方面,Neckel或其它元素也用作促进非晶硅膜结晶的催化元素。 首先,将该催化元件与非晶硅膜的表面接触。 将膜在450至650℃加热以产生晶核。 将膜进一步在较高温度下加热以生长晶粒。 以这种方式,形成具有改善的结晶度的晶体硅膜。
    • 10. 发明授权
    • Semiconductor device structure
    • 半导体器件结构
    • US06987283B2
    • 2006-01-17
    • US10180015
    • 2002-06-27
    • Hongyong ZhangToru TakayamaYasuhiko TakemuraAkiharu MiyanagaHisashi Ohtani
    • Hongyong ZhangToru TakayamaYasuhiko TakemuraAkiharu MiyanagaHisashi Ohtani
    • H01L29/76
    • H01L29/045G09G2300/0408H01L21/02532H01L21/02672H01L27/1277H01L27/1296H01L29/66757
    • In thin film transistors (TFTs) having an active layer of crystalline silicon adapted for mass production, a catalytic element is introduced into doped regions of an amorphous silicon film by ion implantation or other means. This film is crystallized at a temperature below the strain point of the glass substrate. Further, a gate insulating film and a gate electrode are formed. Impurities are introduced by a self-aligning process. Then, the laminate is annealed below the strain point of the substrate to activate the dopant impurities. On the other hand, Neckel or other element is also used as a catalytic element for promoting crystallization of an amorphous silicon film. First, this catalytic element is applied in contact with the surface of the amorphous silicon film. The film is heated at 450 to 650° C. to create crystal nuclei. The film is further heated at a higher temperature to grow the crystal grains. In this way, a crystalline silicon film having improved crystallinity is formed.
    • 在具有适于批量生产的结晶硅有源层的薄膜晶体管(TFT)中,通过离子注入或其它方式将催化元素引入到非晶硅膜的掺杂区域中。 该膜在低于玻璃基板的应变点的温度下结晶。 此外,形成栅极绝缘膜和栅电极。 杂质通过自对准过程引入。 然后,层压体在基板的应变点以下退火以活化掺杂剂杂质。 另一方面,Neckel或其它元素也用作促进非晶硅膜结晶的催化元素。 首先,将该催化元件与非晶硅膜的表面接触。 将膜在450至650℃加热以产生晶核。 将膜进一步在较高温度下加热以生长晶粒。 以这种方式,形成具有改善的结晶度的晶体硅膜。