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1. 发明授权

US06114651A Laser beam apparatus and workpiece machining process 失效
标题翻译：激光束设备和工件加工过程
公开(公告)号：US06114651A
公开(公告)日：2000-09-05
申请号：US980089
申请日：1997-11-26
申请人： Holger Schluter , Axel Zwick , Konrad Wissenbach , Edwin Buchter , Frank Reichel , Winfried Barkhausen
发明人： Holger Schluter , Axel Zwick , Konrad Wissenbach , Edwin Buchter , Frank Reichel , Winfried Barkhausen
IPC分类号： B08B15/04 , B23K26/00 , B23K26/06 , B23K26/064 , B23K26/12 , B23K26/14 , B23K26/142 , B29C65/00 , B29C65/16 , B63B59/06 , C21D1/82 , B23K26/36
CPC分类号： B23K26/0096 , B08B15/04 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/123 , B23K26/142 , B23K26/1476 , C21D1/82 , B29C65/1619 , B29C65/1654 , B29C66/8167 , B29C66/861 , B63B59/06
摘要： A laser beam apparatus for the removal of surface layers from work pieces with a beam-emitting head that may be guided by hand and that is equipped with focusing optics, which is connected to laser apparatus that generates a laser beam so as to admit light, which exhibits a beam-deflecting direction that moves on a pre-determined pathway in an oscillating manner, which covers the laser beam radially with a point and releases it through an emission opening that faces the work piece, and which has a distance retainer that permits the adjustment of the distance of the beam-emitting head from the work piece. In order to achieve the possibility of its use under freehand guidance with great mean power outputs in the course of which acceptable area coverage rates, or rather processing times are to be rendered possible, the laser beam apparatus is embodied in such a way that the distance retainer is the point of the beam-emitting head that covers the laser beam radially, that the laser beam may be oscillated by the beam deflection apparatus on a pre-determined pathway by means of an exit opening of the distance retainer that has been adapted to the pathway, and that the focusing optics can alter the focusing of the laser beam depending upon the beam deflection in the sense of a focus that lies on the surface of the work piece.
摘要翻译： PCT No.PCT / DE96 / 00941 Sec。 371日期：1997年11月26日 102（e）日期1997年11月26日PCT提交1996年5月30日PCT公布。出版物WO96 / 38257 日期：1996年12月5日一种激光束装置，用于通过手动引导的具有射束头的工件排除表面层，并配有聚焦光学元件，该聚焦光学元件连接到产生激光束的激光装置以承认光，其呈现以预定路径以振荡方式移动的光束偏转方向，其以一定点径向覆盖激光束并将其通过面向工件的发射开口释放，并且具有距离保持器，其允许调节光束发射头与工件的距离。为了实现其在可接受的区域覆盖率或更多的处理时间成为可能的过程中以大的平均功率输出的手绘引导下的使用的可能性，激光束装置被实现为使得距离保持器是径向覆盖激光束的光束发射头的点，激光束可以通过距离保持器的出口开口由光束偏转装置摆动在预定的路径上，路径，并且聚焦光学器件可以改变激光束的聚焦，这取决于位于工件表面上的焦点的光束偏转。

2. 发明授权

US08497448B2 Apparatus and method for working a surface of a workpiece by means of laser radiation 有权
标题翻译：通过激光辐射加工工件表面的装置和方法
公开(公告)号：US08497448B2
公开(公告)日：2013-07-30
申请号：US12451259
申请日：2008-04-29
申请人： Winfried Barkhausen , Edwin Buechter
发明人： Winfried Barkhausen , Edwin Buechter
IPC分类号： B23K26/067 , B23K26/06 , B23K26/36
CPC分类号： B23K26/36 , B08B7/0042 , B23K26/0619 , B23K26/0622 , B23K26/067 , B23K26/0734 , B23K26/082 , B23K26/103 , B23K26/352 , B23K26/354 , C09J5/02 , C09J2205/31
摘要： The present invention, among other things, relates to an apparatus (10) for working a surface (11) of a workpiece, in particular a metal workpiece, by means of laser radiation. The apparatus (10) is characterized by a scanner device (20), which is mounted in a rotationally immovable manner in the working apparatus (10) and is intended for shaping a laser beam that is to be deflected and positioned onto the surface to be worked, a control device for changing the orientation of the scanning direction of the laser beam shaped in the scanner device (20), and an optics element (40), which is movable about an axis of rotation (12), is arranged downstream of the scanner device (20) in the beaming direction of the laser beam and advantageously has a beam splitter device for splitting the laser beam into two or more beam parts (41, 42) and for deflecting and positioning the beam parts (41, 42) onto the surface (11) that is to be worked. A method for working a surface of a workpiece by means of laser radiation is also described.
摘要翻译：本发明尤其涉及一种用于通过激光辐射来加工工件的表面（11），特别是金属工件的装置（10）。该设备（10）的特征在于扫描器装置（20），其以可旋转地移动的方式安装在加工装置（10）中，并用于成形要被偏转并定位在表面上的激光束工作时，用于改变在扫描仪装置（20）中成形的激光束的扫描方向的取向的控制装置和可围绕旋转轴线（12）移动的光学元件（40），其布置在所述扫描仪装置（20）处于所述激光束的发射方向，并且有利地具有用于将所述激光束分成两个或更多个光束部分（41,42）并用于偏转和定位所述光束部分（41,42）的分束器装置，到待加工的表面（11）上。还描述了通过激光辐射来加工工件表面的方法。

3. 发明申请

US20110049114A1 APPARATUS AND METHOD FOR WORKING A SURFACE OF A WORKPIECE BY MEANS OF LASER RADIATION 有权
标题翻译：通过激光辐射工作表面的装置和方法
公开(公告)号：US20110049114A1
公开(公告)日：2011-03-03
申请号：US12451259
申请日：2008-04-29
申请人： Winfried Barkhausen , Edwin Buechter
发明人： Winfried Barkhausen , Edwin Buechter
IPC分类号： B23K26/067
CPC分类号： B23K26/36 , B08B7/0042 , B23K26/0619 , B23K26/0622 , B23K26/067 , B23K26/0734 , B23K26/082 , B23K26/103 , B23K26/352 , B23K26/354 , C09J5/02 , C09J2205/31
摘要： The present invention, among other things, relates to an apparatus (10) for working a surface (11) of a workpiece, in particular a metal workpiece, by means of laser radiation. The apparatus (10) is characterized by a scanner device (20), which is mounted in a rotationally immovable manner in the working apparatus (10) and is intended for shaping a laser beam that is to be deflected and positioned onto the surface to be worked, a control device for changing the orientation of the scanning direction of the laser beam shaped in the scanner device (20), and an optics element (40), which is movable about an axis of rotation (12), is arranged downstream of the scanner device (20) in the beaming direction of the laser beam and advantageously has a beam splitter device for splitting the laser beam into two or more beam parts (41, 42) and for deflecting and positioning the beam parts (41, 42) onto the surface (11) that is to be worked. A method for working a surface of a workpiece by means of laser radiation is also described.
摘要翻译：本发明尤其涉及一种用于通过激光辐射来加工工件的表面（11），特别是金属工件的装置（10）。该设备（10）的特征在于扫描器装置（20），其以可旋转地移动的方式安装在加工装置（10）中，并用于成形要被偏转并定位在表面上的激光束工作时，用于改变在扫描仪装置（20）中成形的激光束的扫描方向的取向的控制装置和可围绕旋转轴线（12）移动的光学元件（40），其布置在所述扫描仪装置（20）处于所述激光束的发射方向，并且有利地具有用于将所述激光束分成两个或更多个光束部分（41,42）并用于偏转和定位所述光束部分（41,42）的分束器装置，到待加工的表面（11）上。还描述了通过激光辐射来加工工件表面的方法。

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