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    • 1. 发明授权
    • Method of making semiconductor device structures by means of ion
implantation under a partial pressure of oxygen
    • 通过离子注入在氧分压下制造半导体器件结构的方法
    • US4386968A
    • 1983-06-07
    • US274986
    • 1981-06-18
    • Holger HinkelJurgen KempfGeorg KrausGerhard E. Schmid
    • Holger HinkelJurgen KempfGeorg KrausGerhard E. Schmid
    • H01L21/266H01L21/265H01L21/316H01L21/263
    • H01L21/02238H01L21/02255H01L21/26513H01L21/2652H01L21/31662
    • Disclosed is a simplified method of producing semiconductor device structures in an integrated technology using at least one ion implantation step. Implantation of the doping ions into a silicon wafer, for example, for producing a subcollector or an emitter, is not effected, as previously, in an ultra-high vacuum atmosphere through a thin protective layer of silicon dioxide which is applied by a separate thermal oxidation step prior to implantation, but the doping ions are directly implanted into the bare silicon wafer. The latter implantation is effected in an atmosphere of increased partial pressure of oxygen. Enhanced diffusion of the oxygen adsorbed at the surface occurs into the vacancies which are generated by the implanted doping ions close the surface of the silicon wafer. In this manner a silicon dioxide protective layer is formed already in the initial stage of ion implantation. As a result one process step can be saved, namely, the production of the protective layer by thermal oxidation prior to ion implantation.
    • 公开了使用至少一个离子注入步骤以集成技术制造半导体器件结构的简化方法。 将掺杂离子注入到例如用于制造子集电极或发射极的硅晶片中,如前所述,在超高真空气氛中通过二氧化硅的薄保护层进行注入,所述薄保护层通过单独的热 在植入之前的氧化步骤,但掺杂离子被直接注入裸硅晶片。 后者的注入在氧分压增加的气氛中进行。 在表面处吸附的氧的增强的扩散发生在由注入的掺杂离子产生的空位中,这些离子靠近硅晶片的表面。 以这种方式,在离子注入的初始阶段已形成二氧化硅保护层。 因此,可以节省一个工艺步骤,即在离子注入之前通过热氧化生产保护层。
    • 5. 发明授权
    • Mask for ion, electron or X-ray lithography and method of making it
    • 用于离子,电子或X射线光刻的掩模及其制作方法
    • US4855197A
    • 1989-08-08
    • US44929
    • 1987-05-01
    • Werner ZapkaJurgen KempfJoachim KeyserKarl Asch
    • Werner ZapkaJurgen KempfJoachim KeyserKarl Asch
    • G03F1/20G03F1/22G03F7/20H01L21/027
    • G03F1/20G03F1/22G03F7/70875Y10S430/167
    • A mask for radiation beam lithography is formed from a semiconductor wafer by thinning a region into a membrane with a hole pattern defining the pattern of the mask. The membrane is doped with a tensile stress-generating material so that minimum doping exists at the periphery of the membrane with the maximum at its center. The difference in doping between the periphery and the center is chosen so that when the mask is irradiated with a given beam current intensity, the membrane is tension-free. To make a mask in the wafer, a hole pattern is formed by etching holes in the membrane or by depositing a layer on the membrane. The wafer is thinned from the opposite surface until the holes in the hole pattern are throughholes or until the desired thickness is reached. The membrane is doped with tensile-stress-generating material using ion implantation or diffusion proportionally to the temperature distribution existing in the membrane during irradiation with exposure beams.
    • 用半导体晶片形成用于辐射束光刻的掩模,通过将区域变薄成具有限定掩模图案的孔图案的膜。 膜被拉伸应力产生材料掺杂,使得最小掺杂存在于膜的周边处,其中心处具有最大值。 选择周边和中心之间的掺杂差异,使得当以给定的束电流强度照射掩模时,膜是无张力的。 为了在晶片中制作掩模,通过蚀刻膜中的孔或通过在膜上沉积一层形成孔图案。 晶片从相对表面变薄,直到孔图案中的孔为通孔,或直到达到所需厚度。 使用离子注入或扩散成膜时,利用曝光光束照射期间膜与存在于膜中的温度分布成比例地掺入拉伸应力产生材料。